Infineon Introduces CoolGaN-Based High-Voltage Intermediate Bus Converter Reference Designs

Why It Matters

The reference designs give data‑center OEMs a proven, high‑efficiency path to adopt 800 V power architectures, reducing development risk and boosting rack power density. This accelerates AI workload scaling while cutting energy loss and cooling costs.

Key Takeaways

• 650 V CoolGaN switches enable >98% efficiency at 800 V
• 800 V‑to‑50 V design reaches 2.5 kW/in³ power density
• Ultra‑thin 800 V‑to‑12 V board delivers 2300 W/in³ density
• Designs support up to 10.8 kW burst for 400 µs
• XDPP1188‑200C controller offers flexible 12‑48‑24 V outputs

Pulse Analysis

The rapid expansion of artificial‑intelligence workloads is forcing data‑center architects to rethink power distribution. Traditional 48 V rails limit power density and increase conversion losses, prompting a shift toward higher bus voltages such as 800 V. Gallium‑nitride (GaN) devices, with their low on‑resistance and fast switching, are uniquely suited to this transition, offering the efficiency and thermal performance needed for next‑generation servers.

Infineon’s new HV IBC reference designs showcase how 650 V CoolGaN switches can be leveraged to create compact, high‑efficiency converters. The 800 V‑to‑50 V module packs 2.5 kW per cubic inch into a 60 × 60 × 11 mm form factor, while the ultra‑thin 800 V‑to‑12 V board pushes density beyond 2300 W/in³ with an 8 mm height. Both designs achieve close to 98 % efficiency across full load and support short‑duration bursts up to 10.8 kW, thanks to ISOP topology, planar transformers, and integrated PSoC control.

For hyperscalers and server OEMs, these reference designs reduce time‑to‑market by providing validated, scalable building blocks that de‑risk high‑voltage integration. Coupled with Infineon’s broader AI power‑delivery portfolio—including SiC, silicon, and GaN components—customers can construct end‑to‑end power architectures that meet the demanding performance, reliability, and energy‑efficiency goals of future AI data centers. The availability of a flexible digital controller, XDPP1188‑200C, further enables customization of intermediate voltages, supporting a wide range of board‑level power topologies.