​​New ZEISS Crossbeam 750 FIB-SEM for High-Accuracy Sample Preparation Workflows​

Why It Matters

The real‑time “see‑while‑you‑mill” capability shortens preparation cycles and boosts yield for leading‑node chip analysis, giving manufacturers a competitive edge in a shrinking‑device market. It also expands high‑precision sample preparation across materials and life‑science research, broadening ZEISS’s addressable market.

Key Takeaways

• Live high‑resolution SEM view while milling
• Gemini 4 optics deliver sub‑nanometer precision
• Reduces rework, improves yield for semiconductor lamellae
• Larger field of view speeds 3D tomography acquisition
• Supports APT, nanofabrication, and electron‑beam lithography

Pulse Analysis

The demand for ever‑smaller semiconductor features has pushed sample preparation tools to the limits of precision and speed. Traditional FIB‑SEM workflows require operators to pause milling, switch to imaging, and then resume, introducing uncertainty and extending cycle times. By integrating a high‑dynamic‑range Mill + SEM that maintains a clear, high‑resolution view at any ion beam current, the Crossbeam 750 eliminates these interruptions, allowing engineers to monitor ion‑sample interactions continuously and make adjustments on the fly.

At the heart of the Crossbeam 750 is the Gemini 4 electron optics suite, which delivers sub‑nanometer positioning accuracy and background‑free imaging. This combination is especially valuable for leading‑node logic and memory devices, where nanometer‑scale endpoint detection can mean the difference between a viable prototype and a costly rework. The system’s real‑time endpointing not only improves first‑pass yield but also shortens the time‑to‑analysis for complex architectures such as GAA, CFET, and emerging 2D materials, reinforcing its appeal to high‑volume chip manufacturers.

Beyond semiconductors, the instrument’s expanded field of view and low‑kV stability benefit materials science and life‑science applications. Faster 3D tomography with reduced distortion enhances signal‑to‑noise ratios for tomography and atom probe tomography sample preparation, while stable low‑energy imaging supports delicate biological specimens. By bridging the gap between precision milling and immediate high‑quality imaging, ZEISS positions the Crossbeam 750 as a versatile platform that can capture new market segments, driving growth across multiple research domains.