ZEISS Introduces Crossbeam 750 FIB-SEM for Sample Prep

Why It Matters

The instrument accelerates nanometer‑scale device analysis, reducing preparation time and improving data quality for leading‑node semiconductor research and advanced materials studies.

Key Takeaways

• Live “see while you mill” imaging at any condition
• Gemini 4 optics deliver sub‑nanometer precision for TEM lamellae
• Larger field‑of‑view reduces distortion, speeds 3D tomography
• Enables first‑pass endpointing for leading‑node logic devices

Pulse Analysis

As semiconductor architectures push below 5 nm, manufacturers demand ever‑greater precision in sample preparation to validate device performance. The ZEISS Crossbeam 750 addresses this pressure by integrating a focused ion beam with a scanning electron microscope that maintains a clear, high‑resolution view throughout milling. Real‑time imaging at low landing energies and tilted angles allows engineers to monitor ion‑sample interactions instantly, cutting down trial‑and‑error cycles and ensuring that critical dimensions are met on the first pass.

Beyond silicon, the Crossbeam 750’s Gemini 4 electron optics deliver sub‑nanometer endpoint accuracy essential for preparing transmission electron microscopy lamellae and atom probe tomography specimens. Uniform lamellae improve signal‑to‑noise ratios in downstream analyses, while the system’s expanded, distortion‑free field of view accelerates three‑dimensional tomography for materials science and life‑science research. Faster acquisition translates into higher throughput for nanofabrication labs, enabling more experiments per day and tighter project timelines.

The broader market impact lies in the instrument’s ability to streamline workflows across multiple disciplines. By eliminating milling interruptions and providing immediate feedback, the Crossbeam 750 reduces labor costs and shortens time‑to‑insight for R&D teams developing next‑generation logic, memory, and emerging 2‑D materials. Early adopters gain a competitive edge, positioning their facilities at the forefront of nanometrology and reinforcing ZEISS’s role as a key supplier in the high‑precision microscopy ecosystem.