GlobalFoundries Joins U.S. Department of Energy’s Genesis Mission as Industry Partner
GlobalFoundries announced a strategic partnership with the U.S. Department of Energy’s Genesis Mission, granting the initiative access to GF’s U.S. manufacturing platform and design‑enablement resources. The collaboration will let national laboratories, universities, startups and industry partners move AI‑enabled chip designs from concept to prototype silicon via GF Labs and its multi‑project wafer program. By providing process design kits, device models and fabrication capacity, GF aims to close the long‑standing lab‑to‑fab gap for advanced computing research. The effort also targets next‑generation technologies such as silicon photonics and quantum computing.
GlobalFoundries Completes Acquisition of Synopsys’ Processor IP Solutions Business, Delivering a Holistic Technology Platform for Physical AI
GlobalFoundries announced the completion of its acquisition of Synopsys’ ARC Processor IP Solutions business, merging it with its MIPS portfolio. The combined ARC and MIPS offering delivers a unified RISC‑V processor IP suite, software tools, and custom silicon services aimed...
From Artemis II to Deep Space: Why Space-Grade Chips Must Be Built for the Harshest Conditions
Artemis II highlighted the critical role of space‑grade semiconductors that can survive extreme temperature swings, high radiation, and vacuum. GlobalFoundries (GF) is advancing both radiation‑hardened‑by‑design (RHBD) and radiation‑hardened‑by‑process (RHBP) technologies, leveraging its global fabs to deliver resilient chips for lunar, deep‑space,...
Building What Comes Next: Why Startups Need a Manufacturing-First Approach to Innovation
GlobalFoundries (GF) argues that semiconductor startups must embed manufacturability into early design decisions to avoid costly redesigns and capital inefficiency. The firm’s GF Labs and GF Accelerate programs provide startups with process design kits, multi‑project wafer runs, and venture funding...
GlobalFoundries Advances Long-Term Technology Innovation Through Investment in Playground Global
GlobalFoundries announced it will invest as a limited partner in Playground Global’s Fund IV through its GF Accelerate venture program. The move deepens GF’s engagement with early‑stage deep‑tech startups developing AI data‑center and emerging Physical AI technologies. By linking capital...
Siemens Unveils AI-Powered Library Characterization to Accelerate Semiconductor Design
Siemens introduced Solido™ Characterizer, an AI‑driven addition to its Solido™ Characterization Suite, aimed at speeding up semiconductor library creation. The tool leverages predictive AI to generate SPICE‑based Liberty files up to seven times faster, shrinking turnaround from weeks to days....
SCALINX Joins GlobalFoundries GlobalSolutions Ecosystem to Expand High-Speed Data Converter SoC Solutions
SCALINX has joined GlobalFoundries' GlobalSolutions ecosystem, gaining visibility on the partner portal and offering its mixed‑signal ASIC design services on GF’s low‑power 40 nm and FDX processes. The company unveiled new high‑performance data‑converter IP—a 14‑bit, 4 GS/s ADC and a 14‑bit, 8 GS/s...
GlobalFoundries Reports First Quarter 2026 Financial Results
GlobalFoundries posted first‑quarter 2026 revenue of $1.634 billion, a 3 % increase year‑over‑year but down from the prior quarter’s $1.830 billion. Gross profit rose to $451 million, lifting the IFRS gross margin to 27.6 % and the non‑IFRS margin to 29.0 %. Operating profit reached $180 million,...
GlobalFoundries Accelerates Adoption of Co-Packaged Optics for Advanced AI Data Centers with SCALE Optical Module Solution
GlobalFoundries unveiled its SCALE™ optical module, the first co‑packaged optics platform that meets the Optical Compute Interconnect (OCI) Multi‑Source Agreement. Built on GF’s silicon‑photonic silicon, the solution demonstrates 8λ and 16λ bi‑directional DWDM capability, far exceeding copper‑based interconnect limits. It...
How GlobalFoundries’ “Virtual Fabs” Are Redefining Semiconductor Manufacturing
GlobalFoundries introduced Global Fab Engineering Services (GFES), a "virtual fab" model that extends engineering support, data analytics and process optimization beyond the physical wafer fab. Launched in 2015 with a hub in Bengaluru focused on yield analytics, GFES added a...
GlobalFoundries’ Isabelle Ferain and Kylee Coffey Honored with 2026 STEP Ahead Awards for Manufacturing Excellence
GlobalFoundries executives Dr. Isabelle Ferain and senior director Kylee Coffey were honored at the Manufacturing Institute’s 2026 STEP Ahead Awards—Ferain as a Champion and Coffey as an Honoree. Ferain, who leads product development engineering, expanded the GlobalWomen employee resource group to eight chapters...
Earth Week 2026: Advancing Sustainable Manufacturing for the Essential Technologies the World Relies On
GlobalFoundries (GF) used Earth Week 2026 to detail its 2025 sustainability progress across greenhouse‑gas cuts, energy efficiency, water stewardship, and waste reduction. The company lifted its 2030 Scope 1‑2 emissions target to a 42% absolute reduction, delivering about 105,000 tCO₂e cut in...
A Conversation with GF’s Pioneer Silicon Photonics Leader and Optica Fellow Dr. Yusheng Bian
Dr. Yusheng Bian, GlobalFoundries’ silicon‑photonic pioneer, was recently named an Optica Fellow for his decade‑long work turning silicon photonics from research into high‑volume CMOS production. He explains how AI‑driven data‑center demand is displacing copper interconnects with pluggable and co‑packaged optical...
How GlobalFoundries Is Manufacturing Quantum at Scale
GlobalFoundries (GF) is positioning its specialty‑foundry capabilities to become the manufacturing backbone for quantum computers across all qubit modalities. By extending proven semiconductor platforms—such as 22FDX® FD‑SOI, high‑voltage/RF, and 300 mm silicon photonics—GF offers a repeatable, high‑yield path from prototype to...
Powering AI at Scale: How HVDC and GaN Are Transforming Hyperscale Data Centers
AI workloads are pushing XPU power consumption from roughly 1‑1.5 kW today to over 5 kW by 2030. To handle the surge, hyperscale data centers are replacing traditional AC‑DC‑AC distribution with high‑voltage direct current (HVDC) architectures, using ±400 V or 800 V DC links....