TDK Expands EMI Filter Portfolio with 1250 V DC Chokes
TDK Corporation has launched the B82722V6*B040 series of high‑voltage common‑mode chokes, rated for up to 1250 V DC (630 V AC). The compact 23 × 15.5 × 24 mm devices offer inductance values from 3.3 mH to 22 mH and currents up to 3 A, targeting power converters, motor drives and SMPS that use SiC and GaN semiconductors. A multilayer solid insulation structure is tested to 3,750 V line‑to‑line, and the chokes meet UL 94 V‑0, IEC 60938‑2, IEC/UL 60939‑3 and RoHS standards. TDK’s automated winding process delivers consistent performance and low stray inductance, facilitating space‑constrained, high‑frequency designs.
Enphase Scales Commercial Solar with GaN Microinverters
Enphase Energy announced expanded shipments of its commercial microinverter line, highlighted by the IQ9N-3P—the company’s first gallium‑nitride (GaN) device. The inverter delivers a CEC‑weighted efficiency of 97.5%, supports up to 600 W modules, and connects directly to three‑phase 480Y/277 V grids without...
PCIM Expo 2026 Highlights SiC, GaN and Data Center Power Trends
The PCIM Expo & Conference returns to Nuremberg from June 9‑11, 2026, occupying roughly 40,000 m² and featuring more than 650 exhibitors from 27 countries. A new AI & Data Centers stage highlights the rising power‑conversion challenges of artificial‑intelligence workloads alongside traditional...
What Rising Rack Densities Mean for Power Connectors
AI-driven workloads are pushing rack power densities from the historic 3‑8 kW range to well over 100 kW, with some hyperscalers eyeing 1 MW per rack. The surge forces data centers to abandon traditional air‑cooling for liquid and immersion solutions, which dramatically improve...
TDK Introduces High-Efficiency 1500 W AC-DC Modules
TDK has launched the third‑generation PFE1500FB series, a 1500 W AC‑DC power module that operates from 85 V to 305 V input. The units achieve up to 92% efficiency at 230 V and feature a metal baseplate for sealed or liquid‑cooled environments. A full‑read/write...
Join Us for the ESD Tech Forum Virtual Event in April
Embedded.com will host the annual Embedded Systems Design (ESD) Tech Forum virtually on April 28‑29, focusing on embedded architectures, edge AI, physical AI, and security. The two‑day program features keynotes from senior executives at Synaptics, Renesas, MIPS and Texas Instruments,...
RECOM Expands Portfolio with Discrete Power Solutions
RECOM has broadened its product line by launching a suite of discrete power ICs and surface‑mount transformers, enabling engineers to build custom isolated DC/DC converters from modular blocks. The new portfolio covers flyback, push‑pull and full‑bridge driver ICs, with options...
Magnetic Metals’ Tape Wound Cores Optimize the Performance of Sophisticated Electronic Components
Magnetic Metals announced its tape‑wound toroidal and cut magnetic cores, built from advanced soft‑magnetic alloys such as amorphous, nanocrystalline and cobalt‑iron. The cores deliver virtually complete magnetic circuits, lower electrical losses, and higher power density than traditional transformer laminations. They...
Sigenergy Debuts High-Power PV Inverter Platform
Sigenergy has launched its first utility‑scale photovoltaic inverter, a 506 kW unit built around silicon‑carbide (SiC) MOSFETs. The inverter delivers a 1000 V AC output and features an 18‑channel maximum power point tracking architecture that minimizes shading losses. Its high‑density hardware, fast...
ST Launches GaN Gate Drivers with Smart Protection
STMicroelectronics has unveiled two high‑speed half‑bridge gate drivers, the STDRIVEG212 and STDRIVEG612, aimed at enhanced‑mode GaN HEMTs for motion‑control and power‑conversion markets. The drivers support up to 220 V and 600 V on the high side, respectively, and integrate linear regulators, a...
The Case for GaN HEMTs in Class-D Audio
Class‑D audio amplifiers are overtaking linear topologies as efficiency demands rise across consumer, professional, and automotive markets. While silicon MOSFETs have traditionally handled the high‑speed switching, their parasitic capacitances and body‑diode recovery limit performance at higher frequencies. Gallium‑nitride (GaN) high‑electron‑mobility...
Infineon Talks Powering AI and Infrastructure
Infineon highlighted its strategy to power AI across the electrical grid and data‑center cores, emphasizing power electronics as a critical enabler for automotive, industrial and consumer applications. The company showcased its silicon‑carbide (SiC) and gallium‑nitride (GaN) product portfolio, along with...
At APEC 2026, AOS Showcases Its Expanding Portfolio with Advanced Controllers, Power Stages, and Protection Solutions
At APEC 2026, AOS unveiled a suite of new power‑management ICs aimed at AI‑centric workloads. The lineup includes the 16‑phase AOZ73216QI GPU controller, Intel‑compatible CPU controllers supporting up to nine phases, and compact Smart Power Stages for high‑performance compute. AOS...
Power Corner: Allegro’s Anuj Jain on TMR—The New Frontier in Magnetic Sensing
Allegro MicroSystems unveiled its XtremeSense tunnel magnetoresistance (TMR) platform, highlighting the ACS37100—the industry’s first 10 MHz magnetic current sensor. TMR delivers over 1,000‑times the signal of Hall sensors, five‑fold better temperature stability, and nanowatt power consumption. The technology is integrated via...
APEC 2026: AmberSemi’s Direct 48V-to-Load Architecture With CEO Thar Casey
AmberSemi announced a direct‑48‑volt‑to‑load power architecture for AI data centers, eliminating intermediate conversion steps and promising dramatically higher efficiency. The solution achieves a sub‑2‑millimeter Z‑height—down to 1.68 mm—and can scale beyond 10,000 amps, far surpassing trench‑FET and IVR offerings. The company taped...
Monolithic Bidirectional GaN Switch-Based Buck-Boost Converter
A novel condensed buck‑boost (CoBB) converter replaces the traditional multilevel flying‑capacitor architecture with a monolithic GaN bidirectional switch (BDS), cutting active device count and improving efficiency. The prototype, built with Transphorm (Renesas) GaN BDS devices, delivered over 95% efficiency at...
Vishay Launches Automotive PV MOSFET Driver
Vishay Intertechnology has released the VODA1275, an automotive‑grade photovoltaic MOSFET driver built in a compact SMD‑4 package with an 8 mm creepage distance and a CTI‑600 mold compound. The driver offers 20 V open‑circuit voltage, 20 µA short‑circuit current, and an 80 µs turn‑on...
EPC’s CEO Analyzes GaN’s Move Into Robotics and Data Centers
Over the past few years GaN HEMTs have moved beyond consumer chargers into high‑performance markets such as AI data‑center servers and humanoid robotics. EPC’s CEO Alex Lidow explained that the material’s low on‑resistance, ultra‑fast switching and high power density make it...
Infineon Launches TLVR Quad-Phase AI Power Module
Infineon Technologies has unveiled the TDM24745T, a quad‑phase power module built on its TLVR (trans‑inductor voltage regulator) architecture for AI‑focused data centers. The 9 × 10 × 5 mm³ device packs four power stages, a TLVR inductor and decoupling capacitors, achieving a current density above...
ST Introduces STripFET F8 MOSFET Series for Automotive
STMicroelectronics launched the Smart STripFET F8 MOSFET series targeting automotive power‑distribution and battery‑management applications. The first part, STL059N4S8AG, is a 40 V, 420 A N‑channel device with a record‑low 0.59 mΩ RDS(on) in a compact PowerFLAT 5×6 package. Its high thermal conductivity, 175 °C rating...
Mitsubishi Electric Enters ROHM–Toshiba Chip Integration Talks
Mitsubishi Electric has signed a memorandum of understanding to discuss integrating its power‑device operations with the semiconductor businesses of ROHM and Toshiba Electronic Devices, alongside Japan Industrial Partners and TBJ Holdings. The talks aim to create a globally competitive semiconductor...
Bourns Adds AEC-Q Option to SSA-2 Current Sensors
Bourns announced an AEC‑Q‑compliant assembly option for its SSA‑2 analog current sensors, giving automotive, industrial and energy designers a qualified part without restarting the qualification process. The SSA‑2 series delivers precise current measurement, ultra‑low insertion loss and electrically isolated outputs...
Power Corner: Analog Devices’ Etienne Moulin on the Convergence of Robotics and Automotive Power Requirements
Analog Devices’ high‑performance power team, led by Etienne Moulin, highlights the growing overlap between robotics and automotive power architectures, especially the shift to 48‑V systems. The company’s Silent Switcher technology delivers LDO‑level regulation with buck‑regulator efficiency, achieving up to 96%...
Vitrek Introduces V10X High-Voltage Safety Tester
Vitrek has launched the V10X, a high‑voltage safety tester delivering up to 30 kV AC output and 100 picoamp leakage resolution. The platform merges hipot, low‑resistance, and ground‑bond testing into one system, targeting automated production lines in sectors such as appliances, EV...