India Pushes Local Electronics Components Manufacturing with 75 ECMS Projects Approved
India has approved 75 projects under its Electronics Component Manufacturing Scheme (ECMS), committing roughly $6.65 billion in investment. The first round, announced in late March, includes global players such as TDK, Molex and Vishay Intertechnology, with 28 projects already breaking ground. ECMS links incentives to capital spending and output, aiming to shift the industry from assembly to domestic component production. The move seeks to curb the more‑than‑55% import share of electronics parts, largely sourced from China and Hong Kong.
Taiyo Yuden to Raise Prices Across Passive Components From May
Taiyo Yuden announced a price increase for a broad range of passive components effective May 1, 2026. The hike covers multilayer ceramic capacitors, inductors, ferrite beads, RF parts, FBAR/SAW devices, and select aluminum electrolytic capacitors. The company cites rising raw‑material costs...
ASE Ramps up Expansion with Six New Plants as AI Drives Packaging Demand
ASE Technology Holding announced its largest expansion yet, planning construction of six new advanced‑packaging plants this year to meet surging AI‑driven demand. The company may lift its capital spending beyond the previously targeted $7 billion, with a single Kaohsiung Renwu site...
Semtech to Raise IC Prices, Offers 30-Day Window Before Changes
Semtech announced it will raise prices on selected integrated‑circuit products in its Signal Integrity Products and Advanced Mixed Signal & Wireless divisions, effective May 4, 2026. Customers have a 30‑day window until May 3 to place orders at current rates, with existing backlog...
Global Chip Sales Jump over 60% in February on Strong Demand
Global semiconductor sales surged to $88.8 billion in February, a 7.6% rise from January and a 61.8% jump from a year earlier, according to the Semiconductor Industry Association. Growth was broad‑based, with Asia‑Pacific posting the steepest year‑over‑year increase at 93.5%, while...
Murata Starts Mass Production of High-Capacitance Automotive MLCCs
Murata Manufacturing has begun mass production of seven automotive‑grade multilayer ceramic capacitors (MLCCs) that deliver higher capacitance in smaller footprints. The new parts meet AEC‑Q200 standards, with five low‑voltage devices for ADAS and two 25 V power‑line models. Notably, Murata achieved...
Samsung Advances 2nm GAA Push with Taylor Fab Targeting 2026 Start
Samsung Electronics is moving its 2nm gate‑all‑around (GAA) production to the Taylor, Texas fab, where engineers began equipment setup in March after receiving a temporary occupancy certificate. ASML has deployed EUV lithography tools to support the new node, a critical...
Nexperia China Shifts to Local Wafer Supply, Targets Full Localization by 2026
Nexperia’s China unit is transitioning to fully domestic wafer sourcing, ending reliance on its Dutch operations. The move follows European wafer export restrictions introduced in October and aims for complete localization by the second half of 2026. Production currently runs...
Samsung Raises DRAM Prices by About 30% for Q2 Across All Segments
Samsung Electronics announced a roughly 30% price increase for all DRAM products in the second quarter, following a dramatic price surge in Q1 that doubled average rates. The cumulative effect pushes DRAM prices to about 2.6 times the levels seen...
Infineon Launches Digital Controller for 800V AI Server Power Systems
Infineon Technologies introduced the XDPP1188-200C digital power controller, aimed at 800‑volt AI server power architectures in data centers. The device enables conversion from 48 V to lower rails and from ±400 V/800 V DC to 48 V, 24 V, or 12 V, reducing bus‑bar losses and...
Global 300mm Fab Equipment Spending Set to Rise, AI Drives Semiconductor Investment
Global spending on 300 mm wafer fab equipment is projected to reach $133 billion in 2026, an 18 % rise. The upward trajectory continues to $151 billion in 2027, driven by surging AI chip demand in data centers and edge devices. Logic and micro‑devices...
Murata Completes New MLCC Production Facility in Izumo, Japan
Murata Manufacturing has finished a new 10‑story, 69,829 m² multilayer ceramic capacitor (MLCC) plant in Izumo, Japan, after two years of construction. The project cost about 47 billion yen (≈ $313 million) and expands Murata’s production footprint in the region. The facility complements Murata’s...
TSMC Plans GigaFab Cluster in Arizona, Aiming for Capacity Close to Taiwan
Taiwan Semiconductor Manufacturing Co. (TSMC) is accelerating its U.S. footprint by planning a GigaFab cluster in Arizona that would rival the output of its Hsinchu facilities in Taiwan. The project is part of a broader rollout of 12 plants across...
TSMC to Bring 3nm Production to Second Japan Fab by 2028
Taiwan Semiconductor Manufacturing Co. (TSMC) will equip its second Japanese fab for 3 nm production starting in 2028, targeting a monthly output of roughly 15,000 12‑inch wafers. The plant joins an existing Japanese facility that began mass production in late 2024,...
Vishay Launches First 8mm SMD-4 Automotive MOSFET Driver for EV Systems
Vishay introduced the VODA1275, an automotive‑grade MOSFET driver housed in an 8 mm SMD‑4 package with a 600 CTI mold compound, targeting high‑voltage EV and HEV systems. The device offers industry‑leading 80 µs turn‑on time—three times faster than rivals—alongside 1260 V peak isolation...
