VIS Sees Stronger Second-Half Demand as Foundry Capacity Remains Fully Utilized
Vanguard International Semiconductor (VIS) says second‑half 2026 demand will outpace supply, driven by expanding AI adoption across multiple end markets. The company’s foundry capacity is already fully utilized, prompting customers to lock in future allocations. Mature‑node products such as power‑management and automotive ICs are seeing renewed interest, while pricing remains under close review. VIS acknowledges rising operating costs but expects market dynamics to support modest price adjustments.
Infineon Issues Price Increase Notice Amid Rising Semiconductor Costs
Infineon Technologies announced price increases for selected semiconductor products effective July 1, 2026, citing rising energy, raw‑material, transportation and service costs amid accelerating demand. The company will speed up capacity expansion but can no longer absorb all cost pressures internally. Analysts expect...
Vishay Expands IHXL High-Current Inductors for Automotive and Renewable Power Systems
Vishay Intertechnology has added four high‑current devices to its IHXL series of radial through‑hole inductors, targeting automotive, industrial and renewable‑energy power systems. The new IHXL1500VZ‑3A, IHXL1500VZ‑31, IHXL2000VZ‑3A and IHXL2000VZ‑31 use a novel iron‑alloy core that trims core losses by roughly...
AI Server Demand Drives NAND Flash Revenue Surge as Enterprise SSD Orders Soar
Global NAND flash suppliers saw first‑quarter 2026 revenue surge to $38.9 billion, an 83.7% sequential jump, driven by exploding AI server demand and enterprise SSD adoption. Hyperscale cloud providers are buying high‑capacity QLC SSDs, pushing average selling prices above expectations. Samsung...
Samsung Labor Deal Sparks Internal Backlash as HBM Production Concerns Grow
Samsung Electronics reached a tentative profit‑sharing deal with its main semiconductor union, staving off an 18‑day strike but sparking backlash in non‑memory divisions. The agreement offers memory staff bonuses of roughly ₩600 million ($450,000) versus about ₩6 million ($4,500) for Device eXperience...
Amkor Expands Arizona Packaging Plans as AMD Joins Advanced Packaging Customers
Amkor Technology announced the acquisition of an additional 67 acres adjacent to its existing 104‑acre campus in Arizona, paving the way for a new advanced‑packaging fab slated to begin production in 2028. The company confirmed a partnership with AMD to...
Infineon Expands CoolGaN BDS Portfolio with Compact 40 V Bidirectional GaN Switches
Infineon Technologies has added two compact 40 V bidirectional GaN switches, the IGK048B041S and IGK120B041S, to its CoolGaN BDS family. The devices shrink PCB footprint by up to 82% and halve component count by integrating two MOSFET functions into a single...
Samsung Electronics Launches Emergency Semiconductor Production Plan Ahead of Union Strike
Samsung Electronics activated an emergency management plan for its semiconductor fabs ahead of a union strike slated for May 21. The company is trimming wafer input volumes and shifting capacity to high‑bandwidth memory (HBM) chips to protect critical AI‑related supply....
Memory Chip Prices Set to Ease in Late 2027 as AI Demand Drives Global Market Volatility
Memory chip prices, which have surged amid AI‑driven demand, are projected to soften in the second half of 2027. Former Samsung Device Solutions head Kye‑hyun Kyung cites expanding Chinese production and a projected global wafer capacity of 6 million units per...
Infineon Expands XHP 2 CoolSiC MOSFET Portfolio with 2300 V Modules for Renewable Energy
Infineon Technologies has added 2300 V CoolSiC™ MOSFET variants to its XHP 2 power‑module family, targeting high‑voltage renewable‑energy converters. The new modules support DC‑link voltages up to 1500 V, feature on‑resistance between 1 mΩ and 2 mΩ, and offer 4 kV or 6 kV isolation. Leveraging silicon‑carbide...
Murata to Expand Thermistor Production Capacity with New Japan Facility
Murata Manufacturing announced the construction of a new five‑story production building at its Yokaichi Plant in Shiga, Japan, slated to begin in May 2026 and finish by August 2028. The $113 million investment will add roughly 2,951 m² of ground space and 18,010 m² of...
Japan Power Chip Alliance Talks Slow as Rohm Resists Integration
Denso has withdrawn its bid to acquire Rohm, leaving Japan’s power‑semiconductor consolidation in limbo. Ongoing talks among Rohm, Toshiba and Mitsubishi Electric are stalled by concerns over joint management control and operational integration. Meanwhile Toshiba and Mitsubishi have each launched...
Diodes Launches PCIe 7.0 Clock Generator for AI Servers
Diodes Incorporated introduced the PI6CG33A06, a six‑output ultra‑low jitter clock generator built for PCI Express 7.0 platforms in AI servers and high‑performance data‑center equipment. The device delivers RMS jitter below 30 femtoseconds, comfortably beating the PCIe 7.0 maximum of 67 fs, and supplies stable 25 MHz...
VIS Says AI Demand Drives Growth as Singapore Fab Fully Booked
Vanguard International Semiconductor (VIS) says AI demand is fueling semiconductor growth, with its Singapore 12‑inch wafer fab's first phase already fully booked. The fab will begin sample shipments in July 2025 and target mass production in the first quarter of...
Microchip Launches Automotive SPE PHYs with MACsec Security
Microchip Technology has unveiled the LAN878x and LAN888x families of single‑pair Ethernet (SPE) PHY transceivers, targeting automotive, industrial and high‑reliability networking. The devices support 100BASE‑T1, 1000BASE‑T1 and dual‑speed 100/1000BASE‑T1 links, with pin‑compatible designs across speed grades. A standout feature is...