AI Demand to Push Global Semiconductor Packaging Market to $618.9 Billion
Korea Printed Circuit Association forecasts the global semiconductor packaging market will reach $618.9 billion in 2025, propelled by surging AI infrastructure demand. AI servers are driving growth in high‑bandwidth memory, 2.5D/3D chiplet packaging, and advanced PCB substrates such as FC‑BGA. The automotive sector adds momentum as electric and autonomous vehicles require robust, thermally stable packaging, while the OSAT market stays highly concentrated, with Taiwan and mainland China holding roughly 70% of capacity. South Korea’s PCB industry is projected to grow 19% to about $13 billion, reflecting heavy investment in HBM and wafer‑level advanced packaging.
TI to Raise Prices Across Product Portfolio
Texas Instruments announced a price increase across its analog and embedded semiconductor portfolio effective July 1 2026. The adjustments will apply to both new orders and shipments and are driven by rising material, technology and supply‑chain costs. TI did not disclose the...
ADATA Expects Memory Shortage to Continue as AI Demand Grows
ADATA Technology warned that AI‑driven demand is tightening the global memory market, keeping DRAM and NAND supplies scarce through next year. Prices for DRAM have already risen in the first half of 2025, while NAND flash is expected to gain...
Micron Says AI Memory Shortage Could Last Until 2028
Micron CEO Sanjay Mehrotra warned that the AI‑driven memory shortage could persist until 2028 as demand for DRAM and NAND outpaces production capacity. AI‑related memory now accounts for more than half of the industry’s addressable market this year, while traditional...
Vishay Launches Compact Proximity Sensor with 600 Mm Detection
Vishay Intertechnology has launched the VCNL36758, a compact high‑sensitivity proximity sensor that can detect objects up to 600 mm away. The device integrates an IR emitter, photodiode, amplifiers and a 12‑bit ADC in a package 65 % smaller than previous models, and...
AI Demand Keeps 3nm and CoWoS Capacity Tight Through 2027
AI-driven demand for high‑performance chips is tightening supply of advanced 3nm wafers and 2.5D/3D CoWoS packaging through 2027. TrendForce reports that TSMC remains the dominant supplier of 3nm capacity, making its fab slots a critical bottleneck for AI GPUs, data‑center...
Murata Introduces Bulk Case Packaging to Replace T&R, Improving MLCC Supply Chain Efficiency
Murata Manufacturing has launched a bulk‑case packaging system that replaces traditional tape‑and‑reel for multilayer ceramic capacitors (MLCCs). The new containers feed directly into pick‑and‑place machines, supporting ultra‑small 01005 and 0201 parts at densities up to 500,000 units per case. Murata...
STMicroelectronics Launches Low-Power Image Sensors for Always-On Vision Devices
STMicroelectronics has launched two low‑power global shutter image sensors, the VD55G4 and VD65G4, targeting always‑on vision in battery‑constrained devices. The sensors claim up to ten times lower power consumption than conventional global shutters, thanks to an event‑driven wake‑up mode and...
Denso Drops Rohm Acquisition Plan, Keeps Focus on SiC Collaboration
Denso Corporation withdrew its $8.2 billion offer to acquire Rohm Semiconductor after the two sides could not agree on valuation and deal terms. The Japanese automotive supplier retains roughly a 5 % equity stake in Rohm and will continue a joint silicon‑carbide...
Murata Ramps up Ultra-Low Power AMR Sensor Output for Wearable and IoT Use
Murata Manufacturing has started mass production of two ultra‑low power anisotropic magnetoresistance (AMR) sensors, the MRMS166R and MRMS168R, aimed at wearables, healthcare devices, and IoT applications. The MRMS166R draws only about 20 nA at 1.2 V, enabling standby periods of over two...
ADI Rolls Out A²B 2.0 for Automotive Audio with Higher Bandwidth
Analog Devices announced that its A²B 2.0 automotive audio bus has entered full production. The new version boosts bandwidth to 98.3 Mbps in full‑duplex mode while keeping latency around 62 µs. It adds Ethernet tunneling via an OASPI interface and remains compatible with...
Microchip Expands Atomic Clock Production Capacity with New Alabama Facility
Microchip Technology has opened a 15,000‑square‑foot manufacturing plant in Tuscaloosa, Alabama, to increase output of atomic‑clock products such as hydrogen masers and high‑performance oscillators. The new facility focuses on ultra‑stable timing solutions that support power‑grid management, 5G networks, satellite communications...
Nexperia China Says Operations Stable After Parent Risk Warning
Nexperia China announced that its manufacturing and financial operations in China remain stable despite a risk warning issued to its parent, Wingtech Technology, after the latter’s latest financial disclosure. The company emphasized that the warning stems from external factors affecting...
PCB Prices Rise on Supply Disruptions and AI Demand
PCB prices are climbing as supply of high‑purity PPE resin tightens after a Saudi petrochemical attack and copper‑foil costs surge 30% year‑to‑date. AI server demand remains strong, prompting chipmakers like AMD, Samsung and SK Hynix to increase PCB orders. Daeduck Electronics...
Microchip Launches PQC-Ready Root of Trust Controllers for Secure Platforms
Microchip Technology unveiled the TS1800 root‑of‑trust controller and the TS50x secure‑boot family, both engineered to run post‑quantum cryptography (PQC) algorithms. The TS1800 provides external root‑of‑trust functions with hardware acceleration for NIST‑standard PQC schemes such as ML‑DSA, LMS and ML‑KEM, while...
Intel Lifts Margins by Selling Lower-Grade Chips as AI Demand Tightens CPU Supply
Intel reported first‑quarter revenue of $13.6 billion, surpassing the $12.36 billion forecast, and a non‑GAAP gross margin of 41%, well above its 34.5% guidance. The margin lift stems from a new sales approach that packages lower‑yield, edge‑die CPUs as discounted SKUs instead...
ROHM Launches NFC Wireless Power Chipset for Compact Wearables
ROHM introduced the ML7670 receiver and ML7671 transmitter, an NFC‑based wireless power chipset that delivers up to 250 mW to compact wearables such as smart rings and bands. The solution operates in the 13.56 MHz NFC band, enabling a much smaller antenna...
Samsung Wafer Output Drops 58%, Memory Down 18% Amid Labor Dispute
Samsung’s South Korean wafer foundry output plunged 58% and memory production slipped 18% on April 23 after workers at the Pyeongtaek complex missed overnight shifts in protest. The dispute centers on pay and bonus structures; Samsung has offered a 6.2% base‑salary...
Power Semiconductor Lead Times Hit 30 Weeks as AI Drives 800V Shift
Rapid AI server expansion is forcing data centers to adopt higher‑voltage power architectures, with 800 VDC solutions gaining traction. Lead times for power semiconductors have stretched to roughly 30 weeks as demand outpaces capacity at mature process nodes. Suppliers such as...
Samsung Boosts GDDR6 Output for Tesla as Auto Memory Demand Rises
Samsung Electronics has tripled its monthly output of 8GB GDDR6 memory chips to satisfy Tesla’s growing in‑vehicle computing needs. Production was redirected in April to the Hwaseong plant, where capacity now supports Tesla’s infotainment and autonomous‑driving platforms. The ramp‑up follows...
Tesla Plans $3 Billion Chip R&D Fab in Texas, Eyes Terafab Project
Tesla will invest about $3 billion to build a semiconductor research fab at its Giga Texas campus, producing a few thousand wafers per month for design testing. The pilot line serves as a stepping stone to a larger “Terafab” effort, with...
AMD Taps GlobalFoundries for MI500 Photonics as It Advances CPO Design
AMD is developing a co‑packaged optics (CPO) version of its Instinct MI500 accelerator, using photonic integrated circuits fabricated by GlobalFoundries and multi‑chip‑module packaging from ASE. The CPO approach aims to boost bandwidth and cut power consumption by placing optical links directly...
Microchip Launches CLB MCUs to Improve Timing Control and Cut System Cost
Microchip Technology unveiled two new 8‑bit microcontroller families, the PIC16F13276 and PIC18‑Q35, that embed a configurable logic block (CLB) alongside traditional MCU functions. The CLB lets designers shift critical logic from software to hardware, cutting latency and improving predictability for...
EU to Launch Chips Act 2.0 in May to Speed Funding and Boost Local Ecosystem
The European Union will unveil Chips Act 2.0 on May 27, tightening the timeline for semiconductor funding and shifting subsidies toward home‑grown firms. The revised framework promises a more direct, faster disbursement process to avoid the delays that have hampered projects under...
Samsung Targets May Samples for HBM4E, Eyes Nvidia AI Demand
Samsung Electronics announced it will produce early samples of its seventh‑generation HBM4E memory as early as May 2026, with shipments to Nvidia slated after internal testing. The new HBM4E chip targets up to 16 Gbps per pin and roughly 4 TB/s total...
Japan Quake May Disrupt Semiconductor Supply Chain, Hit NAND and Photoresist Output
A magnitude 7.7 earthquake struck Japan’s northeast coast on April 20, prompting safety shutdowns at several semiconductor facilities. Kioxia halted production at its Iwate NAND flash plants, which represent roughly 5‑8% of global supply, while Tokyo Electron stopped operations at...
Shin-Etsu to Raise Silicone Prices as Costs Pressure Semiconductor Materials
Shin‑Etsu Chemical announced a worldwide price increase of more than 10% for all silicone products, effective May 1. The hike reflects rising crude oil, naphtha, energy, packaging and logistics costs that have squeezed margins. Silicone, a key material for thermal management...
UMC Plans Wafer Price Hikes in Second Half as Demand Stays Firm
United Microelectronics Corporation (UMC) announced it will raise wafer prices in the second half of 2026 as demand across communications, industrial, consumer and AI‑related applications stays robust. The Taiwanese foundry reports high utilization rates, indicating a tightening of mature‑node capacity....
KYOCERA AVX Rolls Out FFLK DC Capacitors for EV and Industrial Power
Kyocera AVX has launched the FFLK series of DC‑filtering film capacitors aimed at electric‑vehicle traction inverters and industrial motor drives. The new parts handle higher currents while staying compact, using cylindrical aluminum cases and metallized polypropylene film with a self‑healing...
Yageo Sees Steady AI Demand Supporting High-End Passive Component Growth
Yageo reported that AI‑related demand continues to underpin its Q2 outlook, with AI applications accounting for roughly 13%‑15% of Q1 revenue and order momentum staying steady. Tantalum capacitors, especially polymer‑based types, showed the strongest growth, and the company expects this...
TSMC Expands Global 3nm Capacity to Meet Rising AI Demand
TSMC announced an accelerated rollout of its 3nm process across three continents to satisfy surging AI and high‑performance computing demand. A new 3nm fab at the Tainan GIGAFAB site in Taiwan will begin mass production in the first half of...
Vishay Rolls Out Compact IHLP Inductor for High-Density Power Designs
Vishay Intertechnology has introduced the IHLP1212‑EZ‑1Z, a compact 1212‑package inductor designed for high‑density power designs. The 3 mm × 3 mm part delivers inductance from 0.22 µH to 3.3 µH, a low DCR of 8.6 mΩ, and supports up to 14.3 A across –55 °C to +125 °C. Its powdered‑iron...
Broadcom Expands AI Chip Deal with Meta to Support Data Centers
Broadcom announced an expanded AI chip partnership with Meta Platforms that will run through 2029. The agreement covers both training and inference workloads, with an initial deployment of more than 1 GW of compute capacity. Broadcom’s XPU platform will integrate with...
India Pushes Local Electronics Components Manufacturing with 75 ECMS Projects Approved
India has approved 75 projects under its Electronics Component Manufacturing Scheme (ECMS), committing roughly $6.65 billion in investment. The first round, announced in late March, includes global players such as TDK, Molex and Vishay Intertechnology, with 28 projects already breaking ground....
Taiyo Yuden to Raise Prices Across Passive Components From May
Taiyo Yuden announced a price increase for a broad range of passive components effective May 1, 2026. The hike covers multilayer ceramic capacitors, inductors, ferrite beads, RF parts, FBAR/SAW devices, and select aluminum electrolytic capacitors. The company cites rising raw‑material costs...
ASE Ramps up Expansion with Six New Plants as AI Drives Packaging Demand
ASE Technology Holding announced its largest expansion yet, planning construction of six new advanced‑packaging plants this year to meet surging AI‑driven demand. The company may lift its capital spending beyond the previously targeted $7 billion, with a single Kaohsiung Renwu site...
Semtech to Raise IC Prices, Offers 30-Day Window Before Changes
Semtech announced it will raise prices on selected integrated‑circuit products in its Signal Integrity Products and Advanced Mixed Signal & Wireless divisions, effective May 4, 2026. Customers have a 30‑day window until May 3 to place orders at current rates, with existing backlog...
Global Chip Sales Jump over 60% in February on Strong Demand
Global semiconductor sales surged to $88.8 billion in February, a 7.6% rise from January and a 61.8% jump from a year earlier, according to the Semiconductor Industry Association. Growth was broad‑based, with Asia‑Pacific posting the steepest year‑over‑year increase at 93.5%, while...
Murata Starts Mass Production of High-Capacitance Automotive MLCCs
Murata Manufacturing has begun mass production of seven automotive‑grade multilayer ceramic capacitors (MLCCs) that deliver higher capacitance in smaller footprints. The new parts meet AEC‑Q200 standards, with five low‑voltage devices for ADAS and two 25 V power‑line models. Notably, Murata achieved...
Samsung Advances 2nm GAA Push with Taylor Fab Targeting 2026 Start
Samsung Electronics is moving its 2nm gate‑all‑around (GAA) production to the Taylor, Texas fab, where engineers began equipment setup in March after receiving a temporary occupancy certificate. ASML has deployed EUV lithography tools to support the new node, a critical...
Nexperia China Shifts to Local Wafer Supply, Targets Full Localization by 2026
Nexperia’s China unit is transitioning to fully domestic wafer sourcing, ending reliance on its Dutch operations. The move follows European wafer export restrictions introduced in October and aims for complete localization by the second half of 2026. Production currently runs...
Samsung Raises DRAM Prices by About 30% for Q2 Across All Segments
Samsung Electronics announced a roughly 30% price increase for all DRAM products in the second quarter, following a dramatic price surge in Q1 that doubled average rates. The cumulative effect pushes DRAM prices to about 2.6 times the levels seen...
Infineon Launches Digital Controller for 800V AI Server Power Systems
Infineon Technologies introduced the XDPP1188-200C digital power controller, aimed at 800‑volt AI server power architectures in data centers. The device enables conversion from 48 V to lower rails and from ±400 V/800 V DC to 48 V, 24 V, or 12 V, reducing bus‑bar losses and...
Global 300mm Fab Equipment Spending Set to Rise, AI Drives Semiconductor Investment
Global spending on 300 mm wafer fab equipment is projected to reach $133 billion in 2026, an 18 % rise. The upward trajectory continues to $151 billion in 2027, driven by surging AI chip demand in data centers and edge devices. Logic and micro‑devices...
Murata Completes New MLCC Production Facility in Izumo, Japan
Murata Manufacturing has finished a new 10‑story, 69,829 m² multilayer ceramic capacitor (MLCC) plant in Izumo, Japan, after two years of construction. The project cost about 47 billion yen (≈ $313 million) and expands Murata’s production footprint in the region. The facility complements Murata’s...
TSMC Plans GigaFab Cluster in Arizona, Aiming for Capacity Close to Taiwan
Taiwan Semiconductor Manufacturing Co. (TSMC) is accelerating its U.S. footprint by planning a GigaFab cluster in Arizona that would rival the output of its Hsinchu facilities in Taiwan. The project is part of a broader rollout of 12 plants across...
TSMC to Bring 3nm Production to Second Japan Fab by 2028
Taiwan Semiconductor Manufacturing Co. (TSMC) will equip its second Japanese fab for 3 nm production starting in 2028, targeting a monthly output of roughly 15,000 12‑inch wafers. The plant joins an existing Japanese facility that began mass production in late 2024,...
Vishay Launches First 8mm SMD-4 Automotive MOSFET Driver for EV Systems
Vishay introduced the VODA1275, an automotive‑grade MOSFET driver housed in an 8 mm SMD‑4 package with a 600 CTI mold compound, targeting high‑voltage EV and HEV systems. The device offers industry‑leading 80 µs turn‑on time—three times faster than rivals—alongside 1260 V peak isolation...
MGC Raises Semiconductor Materials Prices 30% as Packaging Material Costs Rise
Japan's Mitsubishi Gas Chemical (MGC) announced a roughly 30% price increase across its electronic materials portfolio, including copper‑clad laminates, prepreg, and resin‑coated copper, effective April 1, 2026. The company attributes the hike to higher raw‑material costs, rising labor expenses, and increased...
DRAM Pauses After Rally as NAND Extends Gains, Q2 Rebound Expected
DRAM prices stalled in March at $13 per 8 Gb DDR4 after an 11‑month rally, as supply agreements capped movement. Q1 pricing was largely set earlier, but quarterly contract prices still rose sharply from Q4. Samsung signaled a 40‑45% price hike...