MGC Raises Semiconductor Materials Prices 30% as Packaging Material Costs Rise
Japan's Mitsubishi Gas Chemical (MGC) announced a roughly 30% price increase across its electronic materials portfolio, including copper‑clad laminates, prepreg, and resin‑coated copper, effective April 1, 2026. The company attributes the hike to higher raw‑material costs, rising labor expenses, and increased logistics charges that have squeezed margins in its semiconductor materials segment. The move mirrors a concurrent 30% price rise by fellow Japanese supplier Resonac, indicating broader cost pressures in Japan's advanced electronic materials industry. The adjustments aim to preserve supply stability and support long‑term operations as demand for high‑performance CCL substrates grows with AI and GPU chips.
DRAM Pauses After Rally as NAND Extends Gains, Q2 Rebound Expected
DRAM prices stalled in March at $13 per 8 Gb DDR4 after an 11‑month rally, as supply agreements capped movement. Q1 pricing was largely set earlier, but quarterly contract prices still rose sharply from Q4. Samsung signaled a 40‑45% price hike...
Infineon Launches TLVR Power Module for AI Server Power Demand
Infineon Technologies has launched the TDM24745T, a quad‑phase power module designed for AI server platforms. The compact 9 × 10 × 5 mm device integrates four power stages, a TLVR inductor and decoupling capacitors, achieving current densities above 2 A/mm² and peak currents up to 320 A....
Fujitsu, Rapidus Team up on 1.4nm AI Chip for Servers
Fujitsu and Rapidus announced a joint development of a 1.4 nm neural processing unit (NPU) aimed at AI inference in servers. The project, costing roughly 58 billion yen, will leverage Rapidus’s advanced node roadmap and Fujitsu’s Arm‑based Monaka CPU built on a...
South Korea Sees Helium Supply Stable Through June Despite Concerns
South Korea’s helium reserves are projected to last through June, calming fears of a supply crunch for its semiconductor sector. The industry ministry confirmed minimal shortage risk in the first half of 2026, while major chipmakers like Samsung have built...
Apple Expands U.S. Chip Supply Chain with New Partner Investments
Apple announced a $400 million investment with U.S. suppliers Bosch, Cirrus Logic, TDK and Qnity Electronics to broaden domestic chip production, extending its broader $600 billion manufacturing plan. TDK will start U.S. sensor component fabrication for smartphone cameras, while Bosch will produce...
Kioxia to Phase Out Older NAND Flash Products
Japanese memory maker Kioxia announced it will discontinue a range of older NAND flash products built on 32 nm, 24 nm and 15 nm process nodes, including floating‑gate and BiCS FLASH gen.3 devices. The phase‑out covers SLC, MLC and TLC variants in wafer, BGA, TSOP,...
Nanya Raises $2.5 Bln, Signs DRAM Supply Deals with Kioxia and SanDisk
Nanya Technology raised roughly $2.5 billion via share sales and private placements to expand its DRAM production capacity. Kioxia invested T$15.6 billion for a 2 % equity stake and a long‑term DRAM supply agreement, while SanDisk committed T$31 billion and signed a multi‑year supply...
