Tech Xplore – Semiconductors - Latest News and Information
Researchers at North Carolina State University and an international team have unveiled a new technique to generate orbital currents using chiral phonons. The method transfers angular momentum from circularly vibrating atoms directly to electrons in non‑magnetic, inexpensive materials. Published in Nature Physics, it is the most efficient orbital‑current generation to date and eliminates the need for magnets, batteries, or external voltage. This breakthrough could accelerate the development of cost‑effective orbitronic technologies.
Rice University researchers have engineered a multilayered 2D metal‑halide perovskite that approaches perfect crystal symmetry, enabling exciton diffusion beyond 2 µm—an order of magnitude improvement over prior perovskites and comparable to monolayer transition‑metal dichalcogenides. The material is produced via a high‑temperature...
Nexperia’s China unit is on the cusp of achieving fully localized semiconductor manufacturing, according to internal sources. The move will enable the Dutch‑headquartered, Chinese‑owned chipmaker to produce a broader portfolio of chips within mainland China. Local production is expected to...
Lingnan University researchers introduced a novel self‑assembled monolayer (SAM) molecule, CbzBT‑B, that immobilizes ligands to create a localized 2D/3D perovskite heterojunction. This interface engineering reduces defect density, aligns energy levels, and suppresses voltage loss, enabling a perovskite‑organic tandem cell to...
Researchers at UC Davis have demonstrated that halide perovskite crystals undergo rapid, reversible lattice distortions when illuminated, a phenomenon termed photostriction. Using laser excitation and X‑ray probing, they showed the effect can be tuned by adjusting the crystal composition, light wavelength,...
Researchers at the University of Science and Technology of China have created a single semiconductor diode that simultaneously senses light, stores data and performs processing. By inserting an aluminum‑gallium‑nitride layer into a GaN p‑n junction, the device can switch among...
NIST researchers have introduced hydroxide catalysis bonding (HCB) as a new packaging method for photonic integrated circuits, replacing traditional polymer adhesives with a glass‑like inorganic bond. The HCB‑packaged chips survived cryogenic temperatures, intense ionizing radiation, high‑vacuum conditions, and rapid thermal...
MIT engineers have created a soft, light‑activated gel that increases ion conductivity by 400‑fold when illuminated. The material embeds photo‑ion generators (PIGs) into a polyurethane matrix, turning an insulating gel into a highly conductive ionotronic medium. Published in Nature Communications,...
Queensland University of Technology researchers have engineered a soft hydrogel that converts body heat into electricity, achieving a record n‑type thermoelectric efficiency for flexible materials. A 10 mm square prototype produced about 0.46 volts, demonstrating practical power generation from modest temperature differences....
Researchers at National Taiwan University introduced a unified analytical framework that captures how channel thickness, trap states, interface quality, and surface roughness jointly dictate the performance of atom‑thin indium‑oxide and tungsten‑doped indium‑oxide transistors. The model accurately reproduces I‑V characteristics for...
KAIST researchers have unveiled a "smart gate" semiconductor structure that uses a novel boron oxynitride (BON) tunneling layer to overcome scaling limits in 3D V‑NAND flash memory. The asymmetric energy‑barrier design accelerates erase operations by up to 23‑fold while maintaining...
