Quanta Computer Selects Siemens Xcelerator to Advance Manufacturing Innovation
Quanta Computer, a leading consumer‑electronics OEM/ODM, has partnered with Siemens to deploy the Xcelerator portfolio across its global operations. The integration creates a unified digital thread that connects product design, PLM, and manufacturing execution, allowing teams to work on a single digital twin. Quanta expects the initiative to shave 20‑25% off new‑product introduction (NPI) timelines and improve data accuracy and cross‑site collaboration. Siemens will supply tools such as Polarion ALM, Teamcenter PLM, and Process Simulate to drive the transformation.
Adhesives for Satellites and Space Applications
The new Master Bond ebook highlights how advanced epoxy and adhesive systems are essential for satellite and spacecraft durability. It details performance requirements such as surviving cryogenic temperatures as low as 4 K, extreme radiation, wide thermal cycles, and high vacuum....
From AI Momentum to Manufacturing Reality
AI’s rapid expansion is moving from hype to concrete pressure on manufacturing, especially in photonics and advanced packaging. Development cycles are tightening, forcing manufacturers to accelerate time‑to‑production while maintaining high precision, repeatability, and yield. Mycronic highlights its ability to partner...
The Need for Speed: How Domestic Manufacturing Accelerates Delivery of Mission-Critical Technology
Intel’s Government Technologies VP argues that U.S. defense superiority now hinges on speed, not just capability. He highlights how legacy acquisition models and offshore supply chains slow microelectronics delivery, jeopardizing deterrence. Emerging practices—hardware‑accurate digital twins, emulation, and Intel’s domestic 18A...
Cost-Effective High-Performance Flip Chip MicroLeadFrame®(fcMLF®) Package Introduction
Amkor Technology unveiled its flip‑chip MicroLeadFrame (fcMLF) package, merging flip‑chip interconnects with traditional leadframe construction. The solution targets automotive and commercial markets that demand smaller footprints, superior thermal and electrical performance, and proven reliability. By using copper‑pillar bumps and a...
Koh Young Webinar to Show How Data Transparency Strengthens SMT Production Resilience
Koh Young, a leader in True3D inspection technology, is hosting a webinar on May 20, 2026, titled “From Quality to Resilience: How Data‑Driven Transparency Ensures Delivery Capability.” The session will show how AI‑enabled inspection and process‑optimization tools can be deployed...
When Cleaning Gets Hard, Collaboration Gets to Work: KOKI and ZESTRON to Host Technical Webinar on Solving Low-Standoff Challenges
KOKI Solder America and ZESTRON Corporation will co‑host a technical webinar on May 12 at 10 a.m. PT to address low‑standoff cleaning challenges in electronics manufacturing. The session will showcase how low‑residue, no‑clean solder pastes paired with optimized cleaning chemistry can...
StratEdge Honored with a Partner 2 Win Gold Tier Award From BAE Systems
StratEdge Corporation announced it has received a Gold Tier Award from BAE Systems’ Partner 2 Win program, recognizing its 2025 performance in the Electronic Systems supply chain. The award highlights StratEdge’s delivery of high‑reliability ceramic and gold‑plated tab packaging for RF, microwave...
Micross Components Appoints James J. Cannon as President and Chief Executive Officer
Micross Components announced James J. "Jim" Cannon as its new President and Chief Executive Officer, succeeding Vincent Buffa who will stay on as a senior executive advisor and board member. Cannon brings more than 25 years of leadership experience, most recently as...
SWAP Hub Earns DoW Year 2 Award Investment From NSTXL
The Department of War’s second‑year awards channel an additional $200 million into the Microelectronics Commons, with the Southwest Advanced Prototyping (SWAP) Hub securing roughly $25.4 million for five high‑impact projects. Funding supports an integrated RF GaN effort for next‑generation 5G/6G defense amplifiers,...
Spirit Electronics Named Authorized Distributor for Microchip Technology, Expanding High Reliability Semiconductor Access for Defense and Aerospace Programs
Spirit Electronics announced it is now an authorized distributor for Microchip Technology in the Americas, giving defense and aerospace customers direct, DFARS‑compliant access to Microchip’s high‑reliability semiconductor portfolio. The partnership covers radiation‑tolerant and radiation‑hardened MCUs, MPUs, FPGAs, power devices and...
ACM Research Ships First PECVD SiCN System for Advanced Semiconductor Applications
ACM Research announced the shipment of its first plasma‑enhanced chemical vapor deposition (PECVD) silicon carbonitride (SiCN) system to a leading semiconductor maker. The equipment, part of the Saturn Series, features a world‑first three‑station deposition architecture that splits film growth across...
Indium Corporation Joins India’s IDSPS Industry Consortium Partnership
Indium Corporation announced its participation in India’s Design, Semiconductor, Packaging and Systems (IDSPS) consortium, a government‑backed initiative to boost semiconductor R&D, workforce development and supply‑chain capacity. The program brings together roughly 50 leading faculty members from institutions such as the...
Attackers Exploit DVR Command Injection Flaw to Deploy Mirai-Based Botnet
A new campaign is using a command‑injection flaw in digital video recorders (DVRs) to spread a Mirai‑derived botnet. Attackers combine the vulnerability with default credentials and cross‑platform payloads, achieving persistence through scheduled tasks and firmware tweaks. Compromised DVRs join a...
Trends in Semiconductor Manufacturing: Wafer-Level and Panel-Level Packaging
The semiconductor packaging landscape is shifting from pure wafer‑level packaging (WLP) to a process‑centric model that emphasizes wet processing, electrochemical plating (ECP) and plasma‑enhanced CVD (PECVD). Heterogeneous integration and chiplet designs are pushing both WLP and emerging panel‑level packaging (PLP)...