What’s the Impact of AI on Analog Design
The article argues that the impact of AI on analog design is still uncertain, noting that past technology forecasts have often missed the mark. It highlights two concrete AI applications: using generative tools to streamline component selection, such as choosing op‑amps with specific trade‑offs, and a university‑led project that embeds neural‑network‑based reconstruction into a spectrometer‑on‑a‑chip, shrinking the device to a grain‑of‑sand size. The chip replaces bulky optics with 16 silicon detectors and a trained model that outperforms traditional algorithms (RMSE 0.046, Pearson R 0.87). While these examples show promise, the broader role of AI in analog design remains exploratory.
The System Architect’s Sketchbook: The Coherency Wall
Deepak Shankar, founder of Mirabilis Design, released a cartoon titled “The system architect’s sketchbook: The coherency wall” to illustrate the growing challenges of memory‑coherency in modern multi‑core chip designs. The illustration, shared on EDN, visualizes how increasing core counts create...
Simulation Tool Tests Assembly Processes Upfront
Keysight Assembly simulation software lets automotive manufacturers virtually test shop‑floor processes, catching issues before physical production. The tool replicates part positioning, clamping and spot‑welding without requiring finite‑element expertise, giving early visibility into distortion and dimensional risk. Integration with Keysight’s stamping...
SMT DIP Switches Fit Space-Constrained PCBs
Littelfuse introduced the TDB series, a line of miniature surface‑mount DIP switches that use a 1.27 mm half‑pitch layout to dramatically shrink PCB footprints. The family offers 2‑ to 10‑position SPST configurations with body lengths from 3.67 mm to 13.83 mm, supporting up...
Wilkinson Divider/Combiner Reduces Insertion Loss
Vishay introduced the WLKN-000, a two‑way Wilkinson power divider/combiner that covers 15 GHz‑20 GHz with a center frequency of 18 GHz. The surface‑mount device delivers insertion loss below 0.5 dB under 19 GHz and return loss between 10 dB and 15 dB, while maintaining output‑to‑output isolation better...
Digital Isolators Strengthen Industrial Systems
Diodes introduced the API782x series, a dual‑channel digital isolator that delivers 5.7 kVRMS isolation for one minute per UL 1577. The devices meet VDE, UL and CQC standards, offering 8 kV peak isolation and 12.8 kV surge capability, with a predicted 40‑year operational life....
Give Bare-Metal Multicore Processing a Try
The article demonstrates that adding multicore processing to bare‑metal firmware is both practical and inexpensive, using the $5 RP2040 dual‑core microcontroller as a reference platform. By calling multicore_launch_core1() in the Arduino IDE, developers can run independent code on each core...
8 Wi-Fi Security Guidelines Issued by Wireless Broadband Alliance
The Wireless Broadband Alliance (WBA) has published eight security guidelines aimed at elevating Wi‑Fi networks to carrier‑grade protection. The recommendations span certificate‑based authentication, WPA3‑Enterprise encryption, privacy‑preserving identities, end‑to‑end credential safeguards, hardened access‑network infrastructure, and secure AAA signaling. They also stress...
How System-Level Validation Compresses Schedule Risk in Device Design
Flagship consumer‑electronics launches face massive schedule volatility because manufacturing constraints are often introduced late in the design cycle. Embedding system‑level validation early transforms it from a downstream quality checkpoint into a proactive risk‑compression tool, exposing integration and yield issues before...
Memory Solutions for Firmware OTA Updates
Firmware‑over‑the‑air (FOTA) updates are becoming essential for extending device functionality, fixing bugs, and reducing recall costs, but growing firmware sizes increase erase and program times. The article compares internal dual‑bank flash with external NOR flash solutions, highlighting that external NOR...
Tiny Filters Curb 5-GHz Audio-Line Noise
TDK introduced the MAF0603GWY series, ultra‑small ferrite filters that attenuate 5‑GHz noise on audio lines. The components measure just 0.6 × 0.3 × 0.3 mm, making them suitable for smartphones and wearables with Bluetooth and Wi‑Fi audio. They achieve up to 3220 Ω impedance at 5 GHz...
Photovoltaic Driver Streamlines EV Power Designs
Vishay introduced the VODA1275, a photovoltaic MOSFET driver designed for high‑voltage automotive applications. It offers a 20 V open‑circuit output, 20 µA short‑circuit current, and an 80 µs turn‑on time—about three times faster than rival parts. The AEC‑Q102‑qualified device targets EV pre‑charge circuits,...
Shielded Inductors Reduce Emissions in Tight Layouts
Bourns has launched the SRP2008DP series of shielded power inductors, featuring a ultra‑low 2.0×1.6×0.8 mm footprint. The eight‑part family spans 0.24 µH to 4.70 µH, IRMS 1.10‑3.50 A and saturation currents up to 5.5 A. A metal‑alloy powder core and full shielding contain magnetic flux,...
RISC-V SoC Supports Voice-Enabled IoT Devices
Espressif Systems began sampling its new ESP32‑S31, a dual‑core RISC‑V SoC that bundles Wi‑Fi 6, Bluetooth 5.4, Thread, Zigbee and Ethernet. Running at 320 MHz, the chip delivers 6.86 CoreMark/MHz, a 128‑bit SIMD path, 512 KB SRAM and up to 8‑bit DDR PSRAM for edge...
Leveling up Industry 4.0
The March/April 2026 EDN issue spotlights the next wave of Industry 4.0, highlighting event‑based vision, wide‑bandgap power electronics, smart motor‑control ICs, edge AI, and new cybersecurity mandates. Event‑based sensors reduce latency and data load, while SiC and GaN devices boost efficiency...