Making the Case for MRAM in Software-Defined Vehicles
Software-defined vehicles (SDVs) demand frequent over‑the‑air (OTA) updates, yet embedded non‑volatile memory (eNVM) has not kept pace with rapid MCU advances. Conventional flash eNVM provides roughly 1,000 write cycles and page‑level writes, causing wear, memory waste, and longer update times. Magnetoresistive RAM (MRAM) delivers up to 1 million write cycles, byte‑level writes and speeds up to 20 times faster without an erase step, meeting automotive temperature and retention standards. NXP’s MRAM‑based S32K5 MCUs illustrate how the technology can underpin future SDV architectures.
Single Switch Controls Sequential Operation of Multiple Power Supplies
A simple analog circuit uses a charging capacitor and comparators to sequence the power‑up and power‑down of multiple DC supplies with a single ON/OFF switch. The design first enables 5 V, then after a programmable delay adds 15 V, and reverses the...
Robots: Why AI Alone Will Not Deliver the Next Leap in Automation
The article argues that artificial intelligence alone cannot drive the next leap in industrial automation because mechanical reliability gaps dominate robot downtime. Engineers at firms like Amazon Robotics observe that wear, thermal drift, misalignment and fatigue cause far more failures...
RF Amplifiers Expand High-Power Range
Rohde & Schwarz has broadened its BBA300 broadband amplifier family with two new single‑band models delivering 500 W and 1 kW P1dB output power. The BBA300‑DE500 and BBA300‑DE1000 operate continuously from 1 GHz to 6 GHz without the need for band switching, improving efficiency...
Controllers Bring PQC to Boot and Root of Trust
Microchip introduced the TS1800 root‑of‑trust controller and the TS50x secure‑boot controller, expanding its TrustShield portfolio with hardware‑accelerated post‑quantum cryptography (PQC). The TS1800, built on a 192 MHz Cortex‑M4F, offers full platform root‑of‑trust features, OCP compliance, and up to double the processing...
UWB: Why Angle-of-Arrival Positioning Hinges on Antenna Isolation
Ultra‑wideband (UWB) is transitioning from research labs to mainstream products, driven by the IEEE 802.15.4z standard and smartphone integration. While time‑of‑flight ranging provides ~10 cm accuracy, manufacturers are shifting to angle‑of‑arrival (AoA) techniques to reduce anchor density and enable new use...
From Edge AI to Physical AI in Smart Factories: A Shift in How Machines Perceive and Act
The article outlines the evolution of smart factories from centralized, cloud‑based AI to edge and physical AI that can perceive, decide, and act directly on the factory floor. Real‑time latency, massive multimodal data, and security concerns are pushing inference closer...
Transceivers Boost In-Vehicle Audio Bandwidth
Analog Devices introduced the ADAA245x series of A2B 2.0 automotive audio bus transceivers, delivering 98.3 Mbps full‑duplex bandwidth—four times that of A2B 1.0. The devices support up to 119 audio channels and can tunnel Ethernet data via an Open Alliance SPI interface. They...
Timing Module Enables vRAN Synchronization
Microchip introduced the MD-990-0011-B, an M.2 plug‑in timing module built with Intel for Xeon 6‑SoC server platforms. The module delivers sub‑microsecond synchronization across GNSS, SyncE and PTP networks, targeting 5G virtualized RAN (vRAN) and low‑latency AI workloads. Integrated components include dual...
The System Architect’s Sketchbook: The Buildout Frenzy
Deepak Shankar, founder of Mirabilis Design, released a cartoon titled “The system architect’s sketchbook: The buildout frenzy” on EDN. The illustration spotlights the accelerating pressure on electronics design engineers to integrate ever‑more functions, components, and software into a single system....
AFE ICs Accelerate Industrial Image Scanning
Cirrus Logic introduced the CS82L4x family of analog front‑end ICs for CIS and CCD sensors used in scanners and industrial imaging platforms. The series—CS82L41, CS82L44, and CS82L46—offers one, four, or six channels with a 24 Msps per‑channel SAR ADC and 16‑bit...
Compact Inductors Meet Tight Layout Demands
Vishay introduced the IHLP1212‑EZ‑1Z series of power inductors, packaged in a 3 × 3 mm 1212‑size footprint with profile options of 1.2 mm, 1.5 mm and 2.0 mm. The line offers 24 variants covering 0.22 µH‑3.3 µH inductance and 8.6‑50.4 mΩ DC resistance, with a saturation current of 14.3 A...
Signal Generators Enable Pulsar Signal Testing
Rohde & Schwarz has released a software option for its SMBV100B and SMW200A vector signal generators that can simulate Xona Space Systems’ Pulsar LEO satellite signals. Pulsar is a planned low‑Earth‑orbit constellation delivering high‑precision positioning, navigation and timing services while...
Linearly Variable Two-Wire Loop Current Generator
A new two‑wire loop current generator delivers a linearly adjustable 0.5 mA to 23.5 mA signal, directly proportional to a multiturn potentiometer voltage. The design handles source or sink loads up to 500 Ω without recalibration and includes a 30 mA safety limit. By using an...
How to Implement OTA Firmware Update on MCUs
The article walks design engineers through implementing over‑the‑air (OTA) firmware updates on NXP’s RW612 MCU using a “staging + copy” workflow. Because the RW612 stores its application image in external serial NOR flash, the update routine relies on NXP’s ROM‑resident FlexSPI API...
What’s the Impact of AI on Analog Design
The article argues that the impact of AI on analog design is still uncertain, noting that past technology forecasts have often missed the mark. It highlights two concrete AI applications: using generative tools to streamline component selection, such as choosing...
The System Architect’s Sketchbook: The Coherency Wall
Deepak Shankar, founder of Mirabilis Design, released a cartoon titled “The system architect’s sketchbook: The coherency wall” to illustrate the growing challenges of memory‑coherency in modern multi‑core chip designs. The illustration, shared on EDN, visualizes how increasing core counts create...
Simulation Tool Tests Assembly Processes Upfront
Keysight Assembly simulation software lets automotive manufacturers virtually test shop‑floor processes, catching issues before physical production. The tool replicates part positioning, clamping and spot‑welding without requiring finite‑element expertise, giving early visibility into distortion and dimensional risk. Integration with Keysight’s stamping...
SMT DIP Switches Fit Space-Constrained PCBs
Littelfuse introduced the TDB series, a line of miniature surface‑mount DIP switches that use a 1.27 mm half‑pitch layout to dramatically shrink PCB footprints. The family offers 2‑ to 10‑position SPST configurations with body lengths from 3.67 mm to 13.83 mm, supporting up...
Wilkinson Divider/Combiner Reduces Insertion Loss
Vishay introduced the WLKN-000, a two‑way Wilkinson power divider/combiner that covers 15 GHz‑20 GHz with a center frequency of 18 GHz. The surface‑mount device delivers insertion loss below 0.5 dB under 19 GHz and return loss between 10 dB and 15 dB, while maintaining output‑to‑output isolation better...
Digital Isolators Strengthen Industrial Systems
Diodes introduced the API782x series, a dual‑channel digital isolator that delivers 5.7 kVRMS isolation for one minute per UL 1577. The devices meet VDE, UL and CQC standards, offering 8 kV peak isolation and 12.8 kV surge capability, with a predicted 40‑year operational life....
Give Bare-Metal Multicore Processing a Try
The article demonstrates that adding multicore processing to bare‑metal firmware is both practical and inexpensive, using the $5 RP2040 dual‑core microcontroller as a reference platform. By calling multicore_launch_core1() in the Arduino IDE, developers can run independent code on each core...
8 Wi-Fi Security Guidelines Issued by Wireless Broadband Alliance
The Wireless Broadband Alliance (WBA) has published eight security guidelines aimed at elevating Wi‑Fi networks to carrier‑grade protection. The recommendations span certificate‑based authentication, WPA3‑Enterprise encryption, privacy‑preserving identities, end‑to‑end credential safeguards, hardened access‑network infrastructure, and secure AAA signaling. They also stress...
How System-Level Validation Compresses Schedule Risk in Device Design
Flagship consumer‑electronics launches face massive schedule volatility because manufacturing constraints are often introduced late in the design cycle. Embedding system‑level validation early transforms it from a downstream quality checkpoint into a proactive risk‑compression tool, exposing integration and yield issues before...
Memory Solutions for Firmware OTA Updates
Firmware‑over‑the‑air (FOTA) updates are becoming essential for extending device functionality, fixing bugs, and reducing recall costs, but growing firmware sizes increase erase and program times. The article compares internal dual‑bank flash with external NOR flash solutions, highlighting that external NOR...
Tiny Filters Curb 5-GHz Audio-Line Noise
TDK introduced the MAF0603GWY series, ultra‑small ferrite filters that attenuate 5‑GHz noise on audio lines. The components measure just 0.6 × 0.3 × 0.3 mm, making them suitable for smartphones and wearables with Bluetooth and Wi‑Fi audio. They achieve up to 3220 Ω impedance at 5 GHz...
Photovoltaic Driver Streamlines EV Power Designs
Vishay introduced the VODA1275, a photovoltaic MOSFET driver designed for high‑voltage automotive applications. It offers a 20 V open‑circuit output, 20 µA short‑circuit current, and an 80 µs turn‑on time—about three times faster than rival parts. The AEC‑Q102‑qualified device targets EV pre‑charge circuits,...
Shielded Inductors Reduce Emissions in Tight Layouts
Bourns has launched the SRP2008DP series of shielded power inductors, featuring a ultra‑low 2.0×1.6×0.8 mm footprint. The eight‑part family spans 0.24 µH to 4.70 µH, IRMS 1.10‑3.50 A and saturation currents up to 5.5 A. A metal‑alloy powder core and full shielding contain magnetic flux,...
RISC-V SoC Supports Voice-Enabled IoT Devices
Espressif Systems began sampling its new ESP32‑S31, a dual‑core RISC‑V SoC that bundles Wi‑Fi 6, Bluetooth 5.4, Thread, Zigbee and Ethernet. Running at 320 MHz, the chip delivers 6.86 CoreMark/MHz, a 128‑bit SIMD path, 512 KB SRAM and up to 8‑bit DDR PSRAM for edge...
Leveling up Industry 4.0
The March/April 2026 EDN issue spotlights the next wave of Industry 4.0, highlighting event‑based vision, wide‑bandgap power electronics, smart motor‑control ICs, edge AI, and new cybersecurity mandates. Event‑based sensors reduce latency and data load, while SiC and GaN devices boost efficiency...
METCASE Expands Accessory Options for Enclosures
METCASE has released a new accessories brochure that broadens its enclosure portfolio with metal tilt/swivel bail arms, molded ABS feet, PCB mounting kits, 19‑inch rack panels, shelves and hardware. The components are universal, fitting METCASE and third‑party enclosures as well...
Metasurface Enables Supersensitive, Superfast Thermal-Based Photodetector
Researchers at Duke University have created a metasurface‑enhanced pyroelectric photodetector that operates at a record‑breaking 3‑dB bandwidth of 2.8 GHz, equivalent to a 125 picosecond rise time. The device uses an ultra‑thin array of silver nanocubes atop a gold mirror, separated by...
Lightning-Resistant TVS Diodes Safeguard Avionics
Littelfuse introduced two new TVS diode families, the SM15KPA‑HR/HRA and SM30KPA‑HR/HRA, delivering DO‑160 Waveform 5A Level 5 lightning protection for avionics, military and mission‑critical platforms. The devices provide 15 kW and 30 kW peak pulse power (10/1000 µs) respectively, with sub‑picosecond response times and 30‑kV...
TLVR Power Module Supplies 320 A for AI Processors
Infineon unveiled the TDM24745T quad‑phase power module, featuring a trans‑inductor voltage regulator (TLVR) architecture that delivers up to 320 A peak current in a 9×10×5 mm footprint. The module integrates four power stages, proprietary magnetics, and decoupling capacitors, achieving a current density...
MOSFET Ensures Automotive Thermal Reliability
Diodes has introduced the DMTH10H1M7SPGWQ, a 100‑V MOSFET that joins its existing 40‑80 V lineup for automotive applications. The device offers a low 1.5 mΩ on‑resistance, making it ideal for 48‑V BLDC motor drives in power‑steering and braking systems. Packaged in a...
High-Res Linear Sensor Tracks Small Displacements
Vishay’s 40 LHE linear position sensor delivers 12‑µm resolution across a 0‑40 mm stroke with ±1% full‑stroke accuracy. Built on Hall‑effect technology, it endures over 10 million cycles and operates in harsh environments from –40 °C to +85 °C with IP67 sealing. The device offers...
Isolated DC/DC Modules Raise Power Density
Texas Instruments introduced two isolated DC/DC modules—UCC34141-Q1 and UCC33420—built on its IsoShield multichip packaging. The architecture co‑packs a planar transformer with the power stage, delivering up to three times the power density of traditional discrete solutions and shrinking board area...