Microchip DSC Family Designed for High-Density AI Data Center Power, Intelligent Sensing
Microchip Technology has added the dsPIC33AK256MPS306 to its dsPIC33A digital signal controller family. The new DSC combines a 200 MHz 32‑bit core with a double‑precision FPU, 78 ps PWM, 40 MSPS 12‑bit ADCs, high‑speed comparators and DACs, and hardware security for post‑quantum cryptography. Designed for power‑dense AI data‑center converters, SiC/GaN motor drives and intelligent sensing, the part reduces BOM and accelerates time‑to‑market. It is supported by Microchip’s MPLAB ecosystem, Zephyr RTOS and a range of development modules.
ASRock AiUAC Copilot Accelerates IEC 61499 Automation From Concept to Deployment
ASRock Industrial unveiled AiUAC Copilot, an AI‑assisted tool that transforms high‑level control specifications into IEC 61499‑compliant function block code. The solution automates the translation from natural language to deployable logic, cutting manual effort and shortening development cycles. It has been validated...
Consumer DRAM Price Surges in March Amid Limited Capacity, Order Shifts
TrendForce reports that consumer DRAM contract prices are set to surge 45‑50% QoQ in Q2 2026 as Taiwanese manufacturers curtail capacity for legacy nodes and shift production toward DDR4. In March, DDR4 4‑Gb chips jumped over 20% MoM, while DDR3...
Ennostar Showcases Micro LED Optical Communication Technology with AUO and Tyntek
Ennostar Corp. unveiled a GaN‑based Micro LED optical communication solution at Touch Taiwan 2026, co‑developed with AUO and Tyntek. The system pairs a Micro LED transmitter with Tyntek’s micro photodetector inside AUO’s co‑packaged optics (CPO) module, targeting ultra‑short‑reach links under...
AiM Future and Metsakuur Collaborate on NPU-Integrated Hardware
AiM Future has teamed up with Vision‑AI specialist Metsakuur to create NPU‑integrated hardware for edge AI applications. The deal combines AiM’s low‑power, high‑efficiency neural processing unit—already used in LG home appliances—with Metsakuur’s proprietary AI algorithms. Together they aim to deliver...
QuickLogic Showcases RadPro FPGA Dev Kit at HEART Conference
QuickLogic Corp. unveiled its first RadPro FPGA development kit at the 41st HEART Conference in Shreveport, Louisiana. The RadPro FPGA is fabricated in the United States on GlobalFoundries' proven 12nm process, the same node used for many defense‑grade ASICs. The...
Rohm, Toshiba and Mitsubishi Join Forces to Create a Power Chip Unit
Rohm Semiconductor, Toshiba Electronic Devices & Storage, and Mitsubishi Electric have signed an MoU to explore a joint power‑semiconductor unit, aiming to create Japan's second‑largest player after Infineon. The trio currently holds about 11% of the global power‑chip market, versus...
NearLink’s Next Phase: From Smartphones to Peripherals, but Still China-Centric
NearLink, branded as SparkLink, is gaining traction in China’s IoT market, anchored by an estimated 12 million NearLink‑enabled smartphones slated for 2026, primarily within Huawei’s ecosystem. Peripheral categories such as earbuds, smartwatches and PC accessories are projected to add another 11 million...
China’s Humanoid Robot Output to Nearly Double in 2026
The global humanoid robot market is set to surge in the second half of 2026, with China driving a 94% increase in annual output. TrendForce identifies Unitree Robotics and AgiBot as dominant players, together accounting for almost 80% of shipments....
Microchip Now Certified to IEC 62443-4-1 ML2 Standards
Microchip Technology announced that its product development process has earned IEC 62443‑4‑1 Maturity Level 2 certification from UL Solutions. The certification confirms that Microchip follows a secure‑by‑design lifecycle covering threat modeling, design, implementation controls, verification and long‑term patch management. By meeting this...
ST Machine Learning Software Pack Accelerates AI-Enhanced Motor Control
STMicroelectronics introduced the FP-IND-MCAI1 function pack, a motor‑control software suite that embeds AI for optimization and predictive maintenance. The pack runs on the EVLSPIN32G4‑ACT evaluation board, which drives up to 250 W three‑phase brushless motors and supports vibration‑sensing modules. It includes...
NDS Taiwan to Showcase Integrated Warpage Control Solution for PLP at SEMICON SEA 2026
NDS Taiwan unveiled an integrated warpage‑control solution for panel‑level packaging (PLP) at SEMICON Southeast Asia 2026. The approach coordinates stress‑compensating materials, temporary glass carriers, precision grinding, advanced polishing and clean debonding to manage deformation across the entire panel workflow. By...
SEMI: Global Semiconductor Equipment Billings Up 15% YoY in 2025
SEMI reports global semiconductor equipment billings rose 15% year‑over‑year to $135.1 billion in 2025, up from $117.1 billion in 2024. Front‑end wafer processing equipment grew 12% while other front‑end segments rose 13%, and back‑end test equipment surged 55% as AI and high‑bandwidth...
Power Module Packaging Evolution Amid Material Innovation, Supply Chain Shifts
Electrification is propelling the power module market toward a $20 billion valuation by 2031, growing at roughly 10% annually. As power densities rise, packaging technologies are shifting toward copper interconnections, silver‑copper sintering, and silicon‑nitride substrates, while packaging still accounts for about...
Microchip Hybrid MCU Targeted at Automotive, E-Mobility HMI Applications
Microchip Technology introduced the SAM9X75D5M, an AEC‑Q100 Grade 2‑qualified System‑in‑Package that combines an Arm926EJ‑S processor with 512 Mbit DDR2 SDRAM. The hybrid MCU targets automotive and e‑mobility human‑machine interfaces, supporting up to 10‑inch XGA displays via MIPI DSI, LVDS or parallel RGB....
