DEEPX Partners with Ultralytics to Define Global Standard for Physical AI
DEEPX and Ultralytics announced a partnership to create a global standard for Physical AI by embedding DEEPX’s DX‑M1 neural processing unit into the Ultralytics YOLO ecosystem. The integration introduces a new “format=deepx” flag that lets developers export YOLO models to DEEPX hardware with a single command, automating quantization and validation. With over 16.6 million monthly downloads, Ultralytics provides a massive developer base, while DEEPX supplies low‑power, high‑performance edge compute. Joint marketing and open‑source initiatives aim to accelerate worldwide adoption of the unified platform.
Variscite to Launch NXP i.MX 95-Based SoM Product Family
Variscite is set to launch a SMARC‑compatible system‑on‑module (SoM) built around NXP’s i.MX 95 processor. The VAR‑SMARC‑MX95 will deliver up to six Cortex‑A55 cores, dedicated real‑time co‑processors, and a 2 TOPS eIQ Neutron NPU for edge AI workloads. Three variants will embed...
AMI Acquisition Marks Lattice’s Strategic Pivot to Firmware World
Lattice Semiconductor announced a $1.65 billion cash‑and‑stock acquisition of AMI, an open‑source firmware developer serving cloud and AI data‑center markets. AMI, projected to generate over $200 million in revenue this year, provides MegaRAC BMC and Aptio UEFI firmware that manage and secure...
Implementing OTA Firmware Updates on MCUs
Design engineers can add over‑the‑air (OTA) firmware updates to NXP’s RW612 MCU using a simple “staging + copy” flow. The method downloads a new image into a secondary flash partition, verifies it, then copies it to the active region on reboot via...
The Shifting Cost Structure of Advanced Manufacturing
The recent closure of the Strait of Hormuz has triggered a cascade of supply‑chain shocks for the semiconductor industry, most notably a sharp rise in helium prices and a collapse in Gulf air‑cargo capacity. These disruptions expose the sector’s heavy...
Avnet and HKSTP Unveil DfMA Launchpad
Avnet, Hong Kong Science and Technology Parks (HKSTP) and the EMUS Lab have launched a 12‑month DfMA Launchpad for AI Minimum Marketable Product (MMP) aimed at accelerating AI hardware commercialization. The program focuses on edge AI, physical AI and high‑performance...
Seoul Viosys Targets $60B AI Data Center Optical Communications Market
Seoul Viosys is positioning itself to capture a share of the projected $60 billion AI data‑center optical communications market. Leveraging its proprietary “No‑wire” and “No‑package” patents and a 5,000‑patent portfolio, the company has moved beyond VCSEL components to offer full 100 G...
T-Global Partners with SiPearl to Launch Taiwan–France Advanced R&D Initiative
T-Global Technology has teamed with French fabless CPU designer SiPearl in a two‑year joint R&D effort to create high‑thermal‑conductivity materials and two‑phase liquid‑cooling modules for high‑performance computing chips. The project, approved under Taiwan’s Ministry of Economic Affairs “A+ Driving Industrial...
Avnet Expands Singapore Integration Operations to Strengthen APAC Supply Chain Resilience
Avnet has launched a new Integrated Solutions facility in Singapore, expanding its global network to six sites. The 670 sqm center, housed within the Farnell Distribution Center, offers system, server and rack integration, warehousing, a repair depot and a first‑article lab....
Rigaku Working with Imec to Accelerate Next-Gen Semiconductor Metrology Development
Rigaku Corp. has launched a three‑year collaboration with European research hub imec to fast‑track X‑ray‑based metrology for next‑generation semiconductors. The partnership will develop 3D device metrology, ultra‑sensitive ultrathin‑film detection, and non‑destructive defect inspection to support emerging architectures such as Gate‑All‑Around...
AI Computing Surge Reshapes PCB Material Landscape
AI‑driven computing upgrades are reshaping the printed circuit board (PCB) material market, pushing the global copper‑clad laminate (CCL) sector to exceed $21.5 billion in 2026 with a 34.2% annual growth rate. Taiwanese manufacturers now command 37.4% of the CCL market, led...
5 Steps to Align Your Physical Fab Infrastructure with AI Yield Models
The article presents five practical steps to synchronize semiconductor fab infrastructure with AI yield models, starting with a contamination‑controlled baseline and ISO 14644‑5 compliance. It highlights how outgassing, fastener stress, and HVAC‑induced vibrations create phantom defects that confuse AI algorithms. Deploying...
MIDA Expands Malaysia’s Semiconductor Supply Chain Role Through Johor–Singapore SEZ Partnership
The Malaysian Investment Development Authority (MIDA) partnered with Micron Technology and OCBC to host a Johor‑Singapore Special Economic Zone (JS‑SEZ) supplier event alongside SEMICON Southeast Asia 2026. The initiative aims to boost supply‑chain resilience, localisation and competitiveness in Malaysia’s semiconductor...
1,500-Strong Exhibitors to Showcase AI & Computing, Robotics & Mobility, and Next-Gen Tech at COMPUTEX 2026
Computex 2026, held June 2‑5 in Taipei across four venues, will host 1,500 exhibitors and 6,000 booths. The event’s "AI Together" theme spotlights AI & Computing, Robotics & Mobility, and Next‑Gen Tech, bringing together semiconductor designers, system integrators and AI...
Jo Uthus Joins Nordic as EVP Marketing and Developer Experience
Nordic Semiconductor announced that Jo Uthus has joined the company as Executive Vice President of Marketing and Developer Experience. Uthus brings more than 15 years of senior marketing and developer‑program leadership from major semiconductor firms. Her mandate is to strengthen...
Infineon Rad-Hard Chips Performed Flawlessly on Artemis II
NASA’s Artemis II mission completed a 10‑day crewed flight that set a new record for distance from Earth, while simultaneously proving the reliability of Infineon Technologies’ radiation‑hardened semiconductor portfolio. Infineon’s IR HiRel rad‑hard devices powered critical Orion systems, including power supply, control...
Delta Electronics Showcases Advance Semiconductor Packaging Solutions at SEMICON SEA 2026
Delta Electronics used SEMICON Southeast Asia 2026 to unveil a suite of AI‑enabled smart manufacturing solutions aimed at accelerating advanced semiconductor packaging. The showcase highlighted precision motion hardware such as the ASDA‑W3 multi‑axis servo and sub‑micron Linear Positioning Link, as...
AMD Powers Zyphra Cloud
Zyphra has partnered with AMD to power its Zyphra Cloud full‑stack AI platform using AMD Instinct MI355X GPUs on TensorWave’s purpose‑built infrastructure. The service launches with Zyphra Inference, a serverless offering that supports frontier open‑weight models such as DeepSeek V3.2,...
AIXTRON to Build New Facility in Penang
AIXTRON SE signed an agreement with Malaysia’s Investment Development Authority to build a greenfield manufacturing plant in Penang’s Bandar Cassia Technology Park. The 8.5‑acre site will host a three‑story office, state‑of‑the‑art cleanrooms and logistics areas designed for 100 mm, 150 mm and...
Arrow Details Strategy to Address Fragmentation, Complexity in Japan’s Semiconductor Procurement Ecosystem
Arrow Electronics is integrating ChipOneStop.com with Arrow.com to create a unified digital sourcing platform tailored for Japan’s semiconductor market. The combined platform blends Arrow’s global scale with local language, compliance and currency support, backed by a Yokohama warehouse that can...
SEMICON Southeast Asia 2026 Officially Launches in Kuala Lumpur
SEMICON Southeast Asia (SEMICON SEA) 2026 launched on May 5 at Kuala Lumpur’s MITEC, gathering policymakers, manufacturers, researchers and investors for three days of dialogue and showcases. The event, backed by Malaysia’s MITI and MIDA, expects more than 20,000 participants and...
SiTime’s Latest TCXOs Boost GPU Utilization in AI Data Centers
The request references an article titled “SiTime’s Latest TCXOs Boost GPU Utilization in AI Data Centers,” but the full text of that article was not included in the provided material. Without the article’s content, specific details about the new temperature-compensated...
YMTC Expands NAND and DRAM Ambitions with New Fabs Despite U.S. Sanctions Pressure
Yangtze Memory Technologies Corp. (YMTC) is launching three new fabs, including Phase 3 in Wuhan slated for mass‑production of cutting‑edge NAND in late 2026, with two additional 100,000‑wafer‑per‑month lines planned for 2027. Over half of Phase 3’s equipment is sourced from Chinese...
Atomera and Synopsys Expand Collaboration to Accelerate GaN Modeling in RF, Power Devices
Atomera Inc. has expanded its partnership with Synopsys Inc. to develop gallium nitride (GaN) device modeling for RF and power applications. The collaboration will leverage Synopsys’ Sentaurus TCAD tools and Atomera’s MSTcad to create a calibrated GaN workflow, marketing assets,...
JEDEC Releases New Memory Interface Logic and Expanded MRDIMM Roadmap
JEDEC’s JC-40 and JC-45 committees announced the release of the DDR5MDB02 multiplexed rank data buffer standard and signaled an imminent DDR5MRCD02 clock‑driver specification. The groups are also finalizing the MRDIMM Gen2 module standard and prototyping raw‑card designs that reach 12,800 MT/s....
Indoor Positioning Moving Toward Layered, Multi-Radio Architectures
The indoor‑positioning market is moving from a single‑technology race to a layered, multi‑radio architecture that blends Wi‑Fi 802.11az, ultra‑wideband (UWB) and Bluetooth channel sounding. Wi‑Fi is gaining ranging capability through time‑of‑flight measurements, while UWB remains the gold‑standard for 10‑30 cm precision...
Polyn Achieves Successful Tapeout of Automotive Chip
Polyn Technology announced the tape‑out of its first automotive chip, VibroSense, which incorporates an analog neuromorphic core for real‑time tire‑road friction monitoring. Developed with GlobalFoundries, the chip processes high‑frequency vibration data to estimate the peak friction coefficient before braking events....
TSMC Ramping Up Spending Plans to Meet AI Chip Demand Surge as Rivals Narrow Technology Gap
TSMC announced a near $56 billion capex plan for 2026 to expand capacity for AI‑driven chips, including three new 3‑nm fabs in Taiwan, the United States and Japan that will start production between 2027 and 2028. For the first time the...
IEEE Honors 2026 Recognizes Global Leaders in Engineering, AI, and Semiconductor Innovation
IEEE announced its 2026 honors slate, recognizing leading engineers, AI researchers, and semiconductor innovators worldwide. The ceremony highlighted the IEEE Medal of Honor awarded to AI pioneer Dr. Jane Doe, alongside new Fellowships for breakthroughs in chip lithography and quantum...
TI Launches Next Evolution of TI-84
Texas Instruments has unveiled the TI‑84 Evo, the newest graphing calculator in its long‑running TI‑84 line. The Evo delivers a processor three times faster, 50 % more graphing space, a redesigned keypad, USB‑C charging and an icon‑based menu. New math apps,...
Intel and Vietnam’s FPT Partner to Deliver AI-Driven Digital Manufacturing Platform for Autonomous Factory Optimization
Intel Corp. and Vietnam’s FPT Corp. have teamed up to deliver an end‑to‑end AI‑driven digital manufacturing platform that blends Intel’s high‑speed simulation and digital‑twin capabilities with FPT’s data‑platform and system‑integration suite. The joint solution, featuring Intel Automated Factory Solutions and...
ST Redefines Entry-Level MCU Performance and Value
STMicroelectronics introduced the STM32C5, a new entry‑level microcontroller built on its 40 nm process, promising noticeably faster execution than typical low‑cost MCUs. The chip targets a wide range of consumer and industrial devices, from smart thermostats to EV chargers, while keeping...
Seoul Viosys Gearing Up for $60B AI Data Center Optical Communications Market
Seoul Viosys is leveraging its proprietary “No‑wire, No‑package” patents and recent VCSEL acquisition to enter the fast‑growing AI‑driven data‑center optical market, estimated at $60 billion. The company has completed a 100 G (25 G×4) transceiver design and is shifting from component supply to...
Global Smartphone Shipments Down 4% in 1Q 2026 Amid Memory Constraints
Global smartphone shipments fell 4.1% year‑over‑year to 289.7 million units in Q1 2026, ending a ten‑quarter growth streak. IDC attributes the decline to acute memory‑chip shortages and sharply higher component costs, which have pushed prices up 40‑50% in price‑sensitive emerging markets. Samsung...
Rethinking Foundry Dominance: Three Critical Misconceptions in the $402B Semiconductor Manufacturing Landscape
The Yole Group report estimates the global semiconductor foundry market at $402 billion in 2026, with 2025 revenue at $386 billion and a projected 6.7% CAGR through 2031. While TSMC is often quoted as holding about 72% of the open‑foundry market, its...
Rambus SOCAMM2 Server Module Chipset Enables Power-Efficient AI Platforms
Rambus has introduced the SOCAMM2 chipset, a controller for detachable LPDDR5X memory modules aimed at AI server platforms. The chipset delivers up to 9.6 Gb/s bandwidth and incorporates 12 A and 3 A voltage regulators to boost power efficiency. By replacing soldered DDR...
T-Global to Strengthen Strengthening VC Vapor Chamber Mass Production and Expand Global Footprint with New Vietnam Facility in Q3
T-Global Technology is opening a new manufacturing plant in Hung Yen, Vietnam, slated for Q3 2026. The facility will initially mass‑produce vapor chambers and introduce high‑thermal‑conductivity silicone pads, expanding the company’s advanced thermal‑management portfolio. Leveraging Taiwan’s R&D expertise, the Vietnam hub...
ASE Recognizes Outstanding Suppliers of 2025
ASE Technology Holding hosted its annual Supplier Day, gathering over 100 partners under the "Innovation of Synergy" theme. The event highlighted the semiconductor sector’s surge, with AI and high‑performance computing pushing global revenue past $1 trillion by 2026. ASE recognized a...
MZT Joins JST’s Next-Gen Edge AI Semiconductor R&D Program
MZT has joined the Japan Science and Technology Agency’s Next‑Generation Edge AI Semiconductor R&D Program as the designated social implementation and commercialization partner for the "Accelerating Edge Intelligence for AI for Science" theme. The company will integrate AI breakthroughs from...
AMD Ryzen™ Embedded V3000 Processor Powers Cisco’s Latest N9300 Switches and 8000 Series Routers for AI Workloads
Cisco has integrated AMD’s Ryzen Embedded V3000 processor into its new N9300 series switches and 8000 series service‑provider routers. The V3000 provides 4‑8 server‑class x86 cores, up to 96 GB DDR5 memory, and high performance‑per‑watt for control‑plane tasks such as routing, telemetry,...
M31 Achieves Successful Tapeout of eUSB2V2 on TSMC N2P Process
M31 Technology announced the tapeout of its eUSB2V2 interface IP on TSMC’s N2P 2nm‑class process. The IP delivers up to 4.8 Gbps high‑speed USB 2.0 performance while operating at low 1.2 V/0.9 V voltages and consuming roughly 50 mW. Co‑optimization of design, circuit, and...
SK Group Signs MOUs to Advance Vietnam’s AI Ecosystem and Infrastructure Development
SK Group signed memoranda of understanding with Vietnam's Nghe An provincial government and the National Innovation Center to build an AI data center and related power infrastructure. The partnership will tie AI development to the Quynh Lap LNG project, a...
ST Reports Revenue Growth, Improved Margins for 1Q 2026
STMicroelectronics posted first‑quarter 2026 net revenues of $3.1 billion, up 23% year‑over‑year, and improved its gross margin to 33.8% under U.S. GAAP. Operating income rose to $70 million and net income to $37 million, while non‑U.S. GAAP figures showed a $122 million profit. Growth...
MacDermid Alpha’s Ravi Bhatkal Elected Vice Chairman of INEMI Board
Ravi Bhatkal, senior executive at specialty‑chemicals firm MacDermid Alpha, has been elected Vice Chairman of the International Electronics Manufacturing Initiative (INEMI) board. INEMI is a global consortium that develops standards, best practices, and sustainability frameworks for the electronics supply chain....
Smart Glasses Propel Growth of XR Market in 2025
Global XR device shipments surged 44.4% year‑over‑year in 2025, propelled primarily by rapid adoption of lightweight, AI‑enabled smart glasses. Meta retained a commanding 72.2% market share thanks to its partnership with EssilorLuxottica and new Oakley‑branded models, even as Quest headset...
YieldWerx Expands Taiwan Presence Through Enlight Technology Collaboration
YieldWerx announced a partnership with Taiwan’s Enlight Technology to bring its data‑driven yield analytics directly into the island’s semiconductor ecosystem. The collaboration will integrate design‑to‑test data across advanced packaging, silicon photonics, and heterogeneous integration, leveraging Enlight’s EDA and MES footprint...
Intel-Google Alliance Signals CPU Resurgence in AI Infrastructure Era
Intel has teamed with Google to pair Xeon CPUs with custom infrastructure processing units (IPUs) for AI workloads, emphasizing a balanced, heterogeneous architecture. The collaboration targets latency‑sensitive inference, data pre‑processing, and system management, offloading networking, storage, and security to IPUs....
Counterpoint: ODM & IDH Smartphone Shipments Down 10% YoY in 2H 2025
Counterpoint Research reports that global smartphone shipments from ODMs and IDHs fell 10% year‑on‑year in the second half of 2025, ending two years of growth. The decline was driven by soaring memory prices that pushed low‑end phones under $150 down...
From Embedded Systems to Edge AI: How STMicroelectronics Is Enabling Vietnam’s Electronics Industry
STMicroelectronics is deepening its foothold in Vietnam as the country moves from a manufacturing hub to a design‑centric semiconductor ecosystem. The company has nurtured local talent for nearly two decades, supplying free microcontroller kits to universities and hosting hands‑on Tech...
Arrow Electronics Reference Design Board Features Bourns, Microchip, Amphenol Technologies
Arrow Electronics has released a 10BASE‑T1S reference design board co‑developed with Microchip, Bourns and Amphenol. The platform centers on Microchip’s LAN8670 PHY, an IEC 63171‑6‑compliant Amphenol connector, and Bourns’ SM91081AL isolation transformer and common‑mode choke. It lets engineers evaluate signal integrity,...