Park Systems Cements Leadership in Nanometrology with New Global HQ
Park Systems Corp. has inaugurated a 27,000 m² global headquarters in Gwacheon, South Korea, featuring a 35‑system industrial cleanroom for semiconductor and advanced‑packaging metrology. The campus houses research and demonstration labs that let customers conduct live measurements on AFM, spectroscopic ellipsometry, and digital holographic microscopy. Over a quarter of the company’s workforce now focuses on R&D, supporting its 26% CAGR from 2015‑2025 and three‑year reign as the global AFM market leader. Employee amenities underscore a long‑term innovation strategy.
Inside Taiwan’s Semiconductor Supremacy
Taiwan now supplies about 92% of the world’s most advanced logic chips (5 nm and below), cementing its role as the linchpin of the global tech supply chain. TSMC, the island’s pure‑play foundry, posted a 62.3% gross margin in Q4 2025 and...
Global OLED Monitor Shipment Surges 92% in 2025
Global OLED monitor shipments reached 2.735 million units in 2025, up 92 percent YoY, driven by aggressive Q4 promotions and the popularity of 27‑inch 240 Hz QHD models plus new 280 Hz offerings. ASUS reclaimed market leadership with a 21.6 percent share, overtaking Samsung, while...
Renesas Rad-Hard ICs Aboard NASA’s Artemis II
Renesas Electronics’ radiation‑hardened integrated circuits are aboard NASA’s Artemis II mission, which launched on April 1 from Kennedy Space Center. The Intersil‑branded rad‑hard ICs are embedded in Orion’s avionics and the Space Launch System, managing power distribution, signal integrity and onboard computing...
Keysight Adds Assembly Simulation to Virtual Manufacturing Portfolio
Keysight Technologies has launched Keysight Assembly, a virtual process simulation tool that lets manufacturers model shop‑floor assembly steps such as positioning, clamping and joining without specialized FEM skills. Developed with automotive OEM partners, the solution links stamped‑part data from forming...
EPC Expands Portfolio of 100V Integrated GaN Power Stage ICs
Efficient Power Conversion (EPC) has launched a 100 V GaN power‑stage IC family—EPC23108, 23109, 23110 and 23111—targeted at high‑performance motion and power‑dense platforms such as humanoid robots and drones. Each device integrates high‑side and low‑side eGaN FETs, gate drivers and level‑shifting...
Former Tenstorrent Execs Launch AI& to Build Japan’s Full-Stack AI Infrastructure
Former Tenstorrent executives David Bennett and Shimpei Hara have launched AI&, a vertically‑integrated Japanese AI company. The startup secured $50 million in seed funding and $2 billion in infrastructure capital to build a full‑stack AI platform, including data centers, orchestration software, models...
Altera and Arm Partner on Programmable Solutions for AI Data Centers
Altera Corp. is deepening its two‑decade partnership with Arm by integrating its data‑center‑grade FPGAs with Arm’s new AGI CPU built on the Neoverse CSS V3 architecture. The combined solution targets AI‑focused data centers, promising low‑latency, highly flexible and scalable compute...
Molex Completes Acquisition of Smiths Interconnect
Molex announced the completion of its acquisition of Smiths Interconnect, the UK‑based subsidiary of Smiths Group, marking the largest deal in Molex’s history. The purchase adds a portfolio of ruggedized connectors, RF components, optical transceivers and semiconductor‑test expertise, extending Molex’s...
SEMI Forecasts Chip Equipment Investments to Reach Beyond $150B in 2027
SEMI projects worldwide 300mm fab equipment spending to rise 18% to $133 billion in 2026 and surpass $150 billion in 2027, reaching $172 billion by 2029. The surge is driven by exploding AI chip demand for data‑center and edge workloads and by regional...
Taiwan Advances WBG Strategy Through Integrated Power Device and System-Level Innovation
Taiwan is shifting its wide‑bandgap (WBG) strategy from pure device innovation to integrated packaging, testing, and system deployment. NIKO‑SEM, a fabless power‑semiconductor designer, has broadened its portfolio from silicon MOSFETs to silicon‑carbide (SiC) and gallium‑nitride (GaN) power modules. The island...
Advanced Nodes to Dominate 2026 SoC Shipments
Advanced nodes (5nm and below) accounted for over 50% of smartphone SoC shipments in 2025 and are projected to reach nearly 60% in 2026, according to Counterpoint Research. Samsung debuted its 2nm Exynos 2600 in the Galaxy S26, while Apple,...
Arrow Electronics Launches Omnichannel Platform for Components Business
Arrow Electronics has unified its global components business under a redesigned, omnichannel arrow.com platform, retiring the legacy MyArrow portal. The new site merges product selection, purchasing, services, and account management into a single digital workflow. It also embeds direct access...
Arm’s First-Ever Silicon Products Targeted at AI Data Centers
Arm Holdings has launched the Arm AGI CPU, its first production silicon product aimed at AI data‑center workloads. The chip packs up to 136 Neoverse V3 cores, a 300‑watt TDP and can deliver more than twice the rack performance of...
Display Driver IC Suppliers Mull Price Hikes Amid Rising Foundry, OSAT Costs
Display driver IC (DDIC) suppliers are confronting mounting cost pressure as foundry and outsourced semiconductor assembly and test (OSAT) expenses rise. Foundry services account for roughly 60‑70% of DDIC costs, while backend packaging contributes about 20%, and limited 8‑inch wafer...
