Quality Digest

NIST Researchers Develop Photonic Chip Packaging

Researchers at NIST have introduced a new packaging method for photonic integrated circuits that uses hydroxide catalysis bonding, an inorganic glass‑like technique originally developed by NASA. The HCB process creates a molecular‑level bond between optical fibers and chips, allowing the assembly to endure extreme conditions such as cryogenic temperatures, rapid thermal cycling, high radiation, and high vacuum while maintaining optical performance. Laboratory tests confirmed the packaged chips remained functional after exposure to these stresses, demonstrating viability for harsh‑environment applications. Although the current process requires several days, NIST says the bonding time can be reduced for large‑scale production.