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Embedded World 2026 showcased five new edge‑AI boards and modules aimed at industrial and IoT markets. Variscite’s VAR‑SMARC‑MX8M‑PLUS brings a 2.3 TOPS NPU and dual Gigabit Ethernet, while congatec’s Conga‑SMX95 pairs an NXP i.MX 95 CPU with a 2 TOPS eIQ Neutron accelerator and the aREADY.COM software stack. SECO’s SODIMM‑220 Genio 360/360P delivers up to 8+ TOPS AI and 4K video, Grinn’s compact GenioSOM‑360 offers 7.4 TOPS in a 30 mm package, and Octavo’s OSD62x‑PM provides a postage‑stamp‑sized solution with TSN‑enabled Ethernet. Together these platforms expand performance‑per‑watt and integration options for smart‑vision, robotics, HMI, and medical edge applications.
Tektronix unveiled a new isolated current probe tip for its IsoVu TICP series, capable of accurate current measurement from –40 °C to 125 °C. The tip maintains up to 700 MHz bandwidth and handles currents from microamps to kiloamps, using a shunt and...
Renesas introduced the TP65B110HRU, a 650‑V bidirectional GaN switch, at APEC 2026. The device merges a d‑mode GaN chip with silicon MOSFETs, offering 110 mΩ on‑resistance, a 3‑V gate threshold, and ±20‑V gate margin. Its true bidirectional operation enables single‑stage 500‑W solar...
Columbia University researchers repurposed a thin‑film platinum resistor, already used as a microheater, to function simultaneously as an on‑chip temperature sensor for a high‑Q photonic microcavity. By closing the loop with a second identical resistor as a heater, they achieved...
A working group proposes replacing traditional laminated glass windshields with a large, curved video screen that can display forward‑view video, side‑mirror feeds, and dynamic data tiles. The screen would switch to a transparent mode or be manually shattered if electronics...
Lirpa Labs announced a prototype “re‑injection” system that captures the so‑called magic smoke released when electronic components fail and injects it back into the damaged parts, promising near‑original performance. The method uses specialized capture cells and injector needles, supplemented with...
A public‑private partnership in Randolph, New Jersey will convert a 470,000‑square‑foot warehouse into a hybrid data‑detention facility. The project pairs Planeteer’s AI data center with a 1,500‑bed detention center, where detainees power treadmill generators to supply most of the server farm’s...
Urgency‑sensing circuits (USCs), once common in 1970s office equipment, are being revived for electric vehicles. A partnership between BOTCH and YoYo Dyne has produced programmable, single‑chip USCs with CAN‑bus and OTA capabilities, allowing automakers to modulate reliability on demand. BMW...
The article introduces On‑Earth Orbit (OEO), a proposed satellite architecture that operates at ground level while remaining geosynchronous, promising near‑zero latency for internet services. By staying close to users, OEO eliminates the 300 ms lag typical of GEO and avoids the...
Teledyne LeCroy unveiled the CP1000, a 1,000‑A RMS current probe with a 1.5 MHz bandwidth, 33‑mm split‑core aperture and contactless AC/DC measurement. The probe combines transformer‑based and Hall‑effect sensing and integrates via ProBus to display amperes and compute watts automatically. Designed for...
STMicroelectronics has launched two phase‑shift control ICs, the STNRG599A and STNRG599B, targeting resonant‑converter power supplies and lighting drivers. The devices operate up to 750 kHz, provide zero‑voltage switching, and improve no‑load efficiency while offering built‑in safety features such as X‑capacitor discharge...
STMicroelectronics introduced the Stellar P3E, an automotive microcontroller that embeds a Neural‑ART accelerator for on‑chip AI inference. The MCU consolidates multiple ECUs, features six Cortex‑R52+ cores up to 500 MHz, and includes high‑density xMemory. By offloading machine‑learning tasks to the NPU, the...
Dean Technology has launched two new high‑voltage diode families, the FH and SH series, expanding its medium‑power portfolio. The FH series delivers a reverse‑recovery time as low as 40 ns, a substantial improvement over the legacy 2CL line’s 100 ns, while supporting...
The National Institute of Standards and Technology released SP800‑193, a framework for platform firmware resiliency (PFR) that guides data‑center operators in protecting, detecting, and recovering from firmware attacks. The standard distinguishes secured boot, which blocks untrusted code, from measured boot,...
Alpha & Omega Semiconductor (AOS) launched the AOTL037V60DE2, a 600‑V superjunction MOSFET built on its new MOS E2 platform. The device offers a low 37 mΩ on‑resistance, a robust intrinsic body diode with reduced reverse‑recovery charge, and a wide safe operating area,...
