Toradex OSM and Lino SoMs – 30×30mm NXP i.MX 93/i.MX 91 Modules with Solder-Down or B2B Connector Designs

Key Takeaways

• 30×30 mm OSM and Lino modules use NXP i.MX 91/93
• OSM solders directly; Lino adds B2B connectors for modularity
• Up to 2 GB LPDDR4, 256 GB eMMC, extensive I/O
• Prices start $25.55 (OSM iMX91) and $30.65 (Lino iMX91)
• Supports Torizon Linux, Yocto; optional FreeRTOS, Zephyr, QNX, Android

Summary

Toradex introduced two ultra‑compact 30 × 30 mm System‑on‑Module families, OSM and Lino, built around NXP i.MX 91 and i.MX 93 processors for edge industrial and IoT use cases. OSM follows the OSM Size‑S standard with a 332‑ball LGA that is soldered directly to a carrier board, while Lino retains the same footprint but adds two board‑to‑board connectors for easier replacement or upgrades. Both modules support up to 2 GB LPDDR4, up to 256 GB eMMC, and a rich set of I/O including Ethernet, USB, CAN FD, and optional display and camera interfaces. Pricing starts at roughly $25.55 for the OSM i.MX 91 version and $30.65 for the Lino i.MX 91 version, with evaluation kits that include a 10.1‑inch touch display and a 5 MP camera.

Pulse Analysis

The edge computing market has been gravitating toward ever‑smaller form factors that can still deliver AI‑ready performance. Toradex’s 30 × 30 mm OSM and Lino modules tap into this trend by pairing NXP’s i.MX 91 and i.MX 93 SoCs—featuring Cortex‑A55 cores, optional Ethos‑U65 NPU, and EdgeLock security—with a compact footprint that fits tight mechanical envelopes. This size reduction opens new possibilities for legacy equipment retrofits, wearable industrial sensors, and densely packed smart‑factory panels, where board space and thermal budgets are at a premium.

From a design perspective, the OSM and Lino families address two distinct integration philosophies. OSM adheres to the OSM Size‑S standard, offering a 332‑ball LGA that is soldered directly onto a custom carrier, which minimizes assembly steps and reduces bill‑of‑materials costs. Lino, by contrast, adds two board‑to‑board connectors while preserving the same dimensions, granting engineers the ability to swap modules without desoldering—a valuable feature for field upgrades or rapid prototyping. Both variants provide up to 2 GB of ECC‑protected LPDDR4 memory, 256 GB eMMC storage, and a comprehensive I/O matrix that includes dual Ethernet with TSN support, USB 2.0, CAN FD, multiple I²C/I³C, SPI, UART, PWM, and analog inputs, ensuring they can meet the diverse connectivity needs of modern IoT gateways.

Pricing and ecosystem support further strengthen Toradex’s proposition. With OSM i.MX 91 starting at $25.55 and Lino i.MX 91 at $30.65, the modules are competitively priced against rivals such as ADLINK and AVNET. Out‑of‑the‑box support for Torizon Linux and the Yocto Project, plus optional ports for FreeRTOS, Zephyr, QNX, and Android, lowers software development barriers and accelerates time‑to‑revenue. As edge AI workloads grow, the combination of a tiny form factor, flexible upgrade paths, and robust software tooling positions Toradex’s new SoMs as attractive building blocks for the next wave of industrial IoT and smart‑edge solutions.