Cloudberry VC Launches Europe's First Semiconductor Venture Fund
Cloudberry VC, a Helsinki‑London venture firm, has launched Europe’s first dedicated semiconductor fund, closing an initial €30 million (~$32.5 million) round. About 85% of the capital came from international investors, and strategic limited partners such as GlobalFoundries and Radiant Opto‑Electronics are on board. The fund will back early‑stage startups in semiconductors, photonics and advanced materials, investing €300 k‑€1 M per deal and reserving roughly 70% for follow‑on financing. By embedding deep chip‑building expertise, Cloudberry aims to bridge Europe’s historic gap between lab breakthroughs and commercial scale.
Greenock Semiconductor Plant Boosts Efficiency Through Smarter Use of Data
Engineers at Diodes Incorporated’s Greenock wafer fab have teamed with the National Manufacturing Institute Scotland to overhaul how production data is captured and analysed. By swapping manual spreadsheet workflows for Python‑based pipelines and specialist semiconductor tools, the plant now generates...
New Wafer Inspection and Metrology Platform From TRI
TRI unveiled the AI‑powered TR7950Q SII wafer metrology and inspection platform, targeting back‑end process and advanced‑packaging applications. The modular system handles 6‑inch to 12‑inch wafers on a high‑stability granite base and offers automated visual inspection for particles, scratches, and contamination....
Advantest Introduces Pin Scale 5000B Digital Test Solution
Advantest unveiled the Pin Scale 5000B digital test card, boosting vector memory and delivering up to 5 Gbps bandwidth for AI and HPC semiconductor testing. The solution supports chiplet‑based and heterogeneous architectures, enabling concurrent testing of multiple IP cores with a...
Arteris and MIPS Partner
Arteris and MIPS, a GlobalFoundries subsidiary, have announced a collaboration to speed the creation of physical AI computing platforms. MIPS will incorporate Arteris’ FlexGen smart NoC IP and Magillem SoC integration automation tools into its RISC‑V processor offerings, targeting high‑growth...
AGI Infinity Reveals Patent‑ready Optical Architecture
AGI Infinity announced that its patent‑ready "Wires to Waves" platform has completed two simulations confirming that holographic optical conductors (HOC) and holographic optical transistors (HOT) can operate together in a fully volumetric 3‑D construct. The technology seeks to replace selected...
Semiconductor EUV Photoresist Market to Hit $10.8 Billion by 2033
The global semiconductor EUV photoresist market is forecast to reach $10.8 billion by 2033, propelled by the shift to sub‑7 nm and sub‑3 nm process nodes. Accelerated adoption of extreme ultraviolet lithography, driven by AI workloads, data‑center expansion, and electric‑vehicle demand, underpins the...
Infineon Wins “AI Impact Award 2026”
Infineon Technologies received the AI Impact Award 2026 from manager magazin and Porsche Consulting for its "GenAI for Test Engineering – Automated Test Programming" project. The solution uses purpose‑built AI agents and multimodal large language models to automate test code generation...
Rising Memory Costs Already Affecting Most IT Buyers
Rising DRAM prices, driven by AI workloads, are already affecting 53% of IT decision‑makers, with another 39% expecting impact soon. The shortage has forced 72% of affected firms to delay or cancel projects slated for 2026, while 49% are extending...
Infineon Contributes Industrialisation Know-How to European Quantum Pilot Lines
Infineon Technologies is contributing its semiconductor‑manufacturing expertise to three European quantum pilot lines—CHAMP‑ION (ion‑trap chips), SUPREME (superconducting qubits) and SPINS (CMOS‑based quantum nano‑systems). The initiatives, backed by the EU Chips for Europe programme, aim to move quantum hardware from laboratory...
Beebolt Welcomes Jameel Haralson as Chief Product Officer
Beebolt, the supply‑chain technology scale‑up, announced Jameel Haralson as its new Chief Product Officer. Haralson arrives with more than 20 years of product leadership, most recently steering Meta Business Platforms that serve over 60,000 companies, and prior senior roles at Zynga and...
CEA-Leti to Present Advances in Next-Gen Chip Integration at ECTC 2026
CEA‑Leti will showcase breakthrough hybrid‑bonding technologies at ECTC 2026, including a die‑to‑wafer test vehicle with a 1 µm pitch and ultra‑low‑temperature annealing down to 100 °C. The research targets ultra‑fine vertical interconnects that overcome the scaling limits of traditional micro‑bump approaches. Presentations also...
Wooptix Breaks Ground on New Semiconductor Cleanroom Facility
Wooptix announced the groundbreaking of a new 200‑square‑meter facility in Tenerife, Spain, featuring a 70‑square‑meter cleanroom and dedicated testing space. The hub will support assembly, validation, and customer demonstrations of semiconductor metrology equipment, with construction slated to begin soon and...
Safe and Secure Technologies, the New BSC and UPC Spin-Off
Safe and Secure Technologies S.L., the 15th spin‑off from Barcelona Supercomputing Center (BSC) and the Universitat Politècnica de Catalunya (UPC), has been launched to design RISC‑V based chips for safety‑critical sectors such as aviation, rail and automotive. The company’s flagship...
Cyient Semiconductor Makes Majority Investment in Kinetic Technologies
Cyient Semiconductors completed an $85 million majority‑stake investment in Kinetic Technologies, a global power‑semiconductor solutions provider. The deal adds Kinetic’s portfolio of over 100 silicon‑proven IPs and 250 high‑volume custom and ASSP products to Cyient’s platform. It positions the combined entity...
Advantest Opens Strategic Innovation Centre
Advantest, a leading semiconductor test equipment maker, opened its Innovation Center in San Jose, with a second site in Sunnyvale slated for later this summer. The facility houses clean rooms, advanced test insertions and state‑of‑the‑art laboratories designed for AI, high‑performance...
ACM Research Introduces ACM Planetary Family™ Product Portfolio Structure
ACM Research has rebranded its expanding suite of semiconductor equipment into the ACM Planetary Family, a process‑based structure that groups eight product series under planetary names. The new layout aligns each series with a core step in wafer fabrication, from...
Northeast Microelectronics Coalition Awards $1m to Eight Startups
The Northeast Microelectronics Coalition (NEMC) announced its 2026 PROPEL cohort, granting $1,013,287 to eight startups across the United States. The awards support projects ranging from silicon‑based long‑wave infrared sensors to AI‑optimized photonic chips and RF design automation platforms. Since its...
Faraday Delivers IP Solutions to Enable Endpoint AI Based on UMC's 28nm SST eFlash
Faraday Technology announced a comprehensive 28 nm SST‑ESF4 eFlash IP solution that bundles a flash controller, built‑in self‑test, and silicon‑proven analog and high‑speed PHYs. The offering also includes a suite of peripheral IPs—SRAM, USB, PLL, ADC/DAC, RTC, temperature sensor, oscillator and...
Liquid Cooling Option STR Provides SLT and BI Solution for HPC, AI and Automotive Devices
Advantest unveiled the TAS 7038 Single Test Rack (STR), a compact, liquid‑cooled system‑level test platform aimed at AI, automotive and high‑performance computing devices. The STR retains full compatibility with the larger 7038 family while shrinking the footprint to a single‑rack configuration,...
Trelleborg Sealing Solutions Breaks Ground on Expanded Manufacturing Facility in Bengaluru
Trelleborg Sealing Solutions broke ground on a 50,000‑square‑meter (540,000‑sq‑ft) campus in Bengaluru, slated for completion in 2027. The new site consolidates manufacturing, R&D, supply‑chain, IT and customer‑service functions under one roof, covering PTFE, rotary shaft, mechanical face and polyurethane seals....
TDLAS vs CRDS: Which Gas Analysis Technology Truly Performs in the Fab?
Semiconductor fabs need ultra‑trace gas analysis to prevent contamination that can cripple yields. Two optical‑spectroscopy methods dominate: Tunable Diode Laser Absorption Spectroscopy (TDLAS) and Cavity Ring‑Down Spectroscopy (CRDS). TDLAS delivers sub‑second, in‑situ measurements with minimal maintenance, making it the workhorse...
Pfeiffer Vacuum+Fab Solutions to Showcase Semiconductor Solutions at SEMICON Southeast Asia 2026
Pfeiffer Vacuum+Fab Solutions will exhibit its full semiconductor‑fab portfolio at SEMICON Southeast Asia 2026, booth 1718. The showcase features the UltiDry multi‑stage roots pump, the Ambient Multi‑Port Controller (AMPC) for real‑time contamination monitoring, and the Automated Pod Analyzer (APA) for FOUP...
Nordic Semiconductor Strengthens Executive Team
Nordic Semiconductor has named Jo Uthus as Executive Vice President of Marketing and Developer Experience, effective April 1, 2026. The appointment merges marketing with developer experience to accelerate the company’s developer‑first strategy. Uthus brings more than 25 years of senior roles at Atmel...
SkyeChip Berhad Inks Underwriting Agreement
SkyeChip Berhad announced a public offering of 400 million new ordinary shares, representing 22.3% of its post‑IPO capital, with no existing shareholder sell‑down. The proceeds will be deployed over three years, with roughly 60% earmarked for research and development of custom...
Innatera Launches Synfire
Innatera unveiled Synfire, an open, community‑driven platform aimed at unifying the neuromorphic AI ecosystem. Launched at Edge AI San Diego 2026, the service provides a centralized model registry, hardware‑aware metadata, and end‑to‑end pipeline tools for spiking neural networks. Synfire leverages...
CEA-Leti and Fraunhofer IPMS Validate Wafer Exchange for Ferroelectric Memory Materials
A five‑year EU pilot line led by CEA‑Leti has successfully demonstrated wafer exchange between its cleanroom and Fraunhofer IPMS, proving that complex HZO ferroelectric stacks can be processed across multiple 300 mm CMOS fabs. The collaboration validated contamination‑control protocols using VPD‑ICP‑MS...
Everspin Technologies Expands On-Shore MRAM Manufacturing Capacity
Everspin Technologies has signed a 10‑year manufacturing agreement with Microchip Technology to expand on‑shore production of MRAM and tunnel‑magnetoresistive (TMR) sensor wafers. The partnership will replicate Everspin’s Chandler, AZ line at Microchip’s Oregon fab, creating a domestic second source and...
New ZEISS Crossbeam 750 FIB-SEM Designed for High-Accuracy Sample Preparation Workflows
ZEISS unveiled the Crossbeam 750 FIB‑SEM, featuring Gemini 4 electron optics and a high‑dynamic‑range Mill + SEM that provides a live, high‑resolution view during milling. The system delivers sub‑nanometer precision and real‑time endpointing for TEM lamellae, enabling uniform first‑pass cuts in advanced semiconductor nodes....
CEA-Leti, CEA-List and PSMC Collaborate
CEA‑List, CEA‑Leti and PSMC announced a collaboration to merge RISC‑V processor IP with silicon‑photonic interconnects on PSMC’s 3D‑stacking platform, targeting next‑generation AI systems. The joint effort will embed customizable RISC‑V compute blocks and microLED‑based optical links into high‑bandwidth chiplet architectures,...
Q.ANT Appoints Michael Krueger as Vice President Commercials
Q.ANT, a developer of photonic processors for energy‑efficient high‑performance computing and AI, announced Michael Krueger as its new Vice President of Commercials, effective April 1, 2026. Krueger joins from a two‑decade tenure at Intel, where he led data‑center and AI sales in...
AI Compute Boom Propels Foundry 2.0 Market to $360 Billion
The AI‑driven compute boom is pushing the Foundry 2.0 market toward a $360 billion valuation in 2026, with advanced nodes and CoWoS packaging remaining scarce. TSMC raised its 3 nm capacity target to 165,000 wafers per month and aims for a 44% market...
Gartner Forecasts Worldwide Semiconductor Revenue to Exceed $1.3 Trillion in 2026
Gartner projects worldwide semiconductor revenue to exceed $1.3 trillion in 2026, reflecting a 64 % year‑over‑year increase. Memory revenue is expected to triple as DRAM and NAND flash prices surge 125 % and 234 % respectively, a phenomenon Gartner dubs “memflation.” AI semiconductors will...
OMRON Appoints Virendra Shelar as President and CEO of Its Industrial Automation Business in EMEA
Omron has appointed Virendra Shelar as President and CEO of its Industrial Automation business in Europe. Shelar, who joined Omron in 2014, brings more than 25 years of high‑tech leadership, having overseen the Management Center in Asia‑Pacific, Europe, and global...
UK Semiconductor Centre Appoints Two New Directors to Its Leadership Team
The UK Semiconductor Centre has hired Martin O’Sullivan as Director of Investment and Steve Taylor as Director of Strategic Marketing to accelerate growth and visibility of the UK chip sector. Their appointments come as global semiconductor demand, driven by AI...
Digital Twin Semiconductor Supply Chain Market to Reach $7.9 Billion by 2033
The Digital Twin Semiconductor Supply Chain market is forecast to reach $7.9 billion by 2033. Growing demand for end‑to‑end visibility, faster time‑to‑market and resilient operations is driving adoption across the industry. Digital twins provide real‑time simulation, predictive analytics and process automation,...
SmartRay Sensor Unites ECCO X Innovations with High-Precision Glass Inspection Capabilities
SmartRay unveiled the ECCO X 050G sensor, extending its ECCO X family with high‑resolution inline metrology for glass, reflective and transparent surfaces. The sensor delivers up to 40 kHz scan rates, 2.2–2.9 µm vertical and 11–13 µm lateral resolution, and generates 163 million 3‑D points per second...
Quantum Diamonds Expands to Asia
QuantumDiamonds announced the launch of a new regional hub in Taiwan, marking its first major foothold in Asia. The company appointed Peter Lemmens, a veteran with over 25 years in semiconductor leadership, to spearhead commercial and technical operations across the...
CEA-Leti and Fraunhofer IPMS Validate Wafer Exchange for Ferroelectric Memory Materials
CEA‑Leti and Fraunhofer IPMS have successfully demonstrated a wafer‑exchange pilot line for hafnium‑zirconium‑oxide ferroelectric stacks, proving that complex material stacks can be processed across multiple advanced fabs without contamination. The program used 300 mm CMOS cleanrooms, standardized VPD‑ICP‑MS and TXRF checks,...
Imec Names NVIDIA's Jensen Huang as Recipient of the 2026 Imec Lifetime of Innovation Award
Imec announced that Jensen Huang, founder and CEO of NVIDIA, will receive the 2026 imec Lifetime of Innovation Award. The award honors Huang’s pivotal role in creating the programmable GPU, which has evolved from gaming graphics to the core engine...
Keysight Introduces Hands-On Semiconductor Teaching Labs for Universities
Keysight Technologies unveiled three semiconductor teaching lab solutions—Basic Design and Measurement, Parametric Test and On‑Wafer Measurement, and Photonics IC Measurement—to give university students hands‑on experience with professional‑grade tools. The kits replicate real‑world test workflows, letting students set up equipment, perform...
Cosmic Is Born
Cosmic Group has unified its recently acquired semiconductor test companies under a single global brand, creating two complementary divisions—Cosmic Equipment and Cosmic Services. The restructuring follows acquisitions of Test Inspire, Gedec, RoodMicrotec, ipTEST, and Focused Test, expanding the group to...
Nordson Electronics Solutions to Demonstrate Automated Fluid Dispensing and Plasma Treatment Systems
Nordson Electronics Solutions will demonstrate its ASYMTEK Vantage fluid dispensing system with a new Class‑100 cleanroom configuration at Productronica China. The company will also showcase the stand‑alone MARCH FlexTRAK plasma system, which provides high‑throughput surface treatment in a compact footprint....
Metallic Oxide Semiconductor Field Effect Transistor Market to Surpass $15.5 Billion by 2033
The global metallic oxide semiconductor field‑effect transistor (MOSFET) market is projected to exceed $15.5 billion by 2033, driven by surging demand for energy‑efficient consumer electronics, electric vehicles, and renewable‑energy systems. Wide‑bandgap silicon‑carbide and gallium‑nitride technologies are accelerating performance gains, while miniaturization...
Plansee Group Increases Stake in Molymet
Plansee Group has raised its ownership in Molymet to a 31 percent stake, cementing its position as the largest single shareholder in the world’s leading molybdenum and rhenium processor. The move underscores Plansee’s strategy to secure a stable, independent supply...