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Emerging Chiplet Designs Spark Fresh Cybersecurity Challenges

Chiplet technology is reshaping semiconductor design by allowing modular, mix‑and‑match silicon components, accelerating AI data‑center and autonomous‑vehicle development. However, the distributed manufacturing model creates new supply‑chain vulnerabilities, as a single compromised chiplet can introduce hardware Trojans that affect entire systems. Industry leaders such as Synopsys and Athos Silicon stress the need for robust identity, authentication, and traceability across multi‑die assemblies, especially under automotive standards like ISO 26262 and ISO 21434. Companies are increasingly pulling design in‑house to mitigate these risks.