HARDWARE PULSE
Friday, February 20, 2026
Market Intelligence for Hardware Professionals
🎯 Today's Hardware PulseUpdated 1h ago
What's happening: Samsung, KT achieve record 3 Gbps 6G downlink in 7 GHz band
Samsung Electronics, carrier KT and test‑equipment firm Keysight reported a record 3 Gbps downlink in the 7 GHz band, a core frequency earmarked for 6G. The speed was achieved using a prototype base station with massive MIMO architecture that transmitted eight data streams simultaneously, demonstrating X‑MIMO coverage comparable to today’s 5G networks.
Also developing:
- •India joins US‑led Pax Silica alliance to secure chips, AI and critical minerals
- •Amazon earmarks $200B capex for 2026, boosting AWS custom‑chip revenue past $10B
- •Google reportedly developing Titan M3 security coprocessor for upcoming Tensor G6 chip
- •USB‑C flash drives often limited to legacy USB 2.0 speeds despite premium pricing
By the numbers: Western Digital to sell partial stake in SanDisk for $3.17B
🚀 Top Hardware Headlines
Google’s Tensor G6 Rumored to Be Paired with New Titan M3 Security Coprocessor
Google initially debuted its Titan M security chip back in 2018 with the Pixel 3 before following it up with Titan M2 in its first-gen Tensor launch. Now, as we approach the tenth anniversary of Pixel and the five-year anniversary of that step into custom silicon, Google is rumored to be working on yet another step forward for its security coprocessor. more…
9to5Google
India Has 100M Weekly Active ChatGPT Users, Sam Altman Says
OpenAI CEO Sam Altman says India has the largest number of student users of ChatGPT worldwide.
TechCrunch AI
The 'USB-C' Label on Flash Drives Is a Trap: How Manufacturers Hide Ancient USB 2.0 Speeds
Modern port, ancient speeds: Why your new USB-C flash drive transfers files so slowly
How-To Geek
Samsung Electronics, KT Hit Record 6G Speeds in 7GHz Band
Samsung Electronics said Friday it had achieved record data transmission speeds in the 7-gigahertz band — a core frequency for 6G networks — in a test with Korean telecom operator KT and US electronics test equipment firm Keysight Technologies. The ultrahigh-density multiple-antenna technology is based on massive multiple-input multiple-output architecture, which integrates a large number of antennas into a single system to improve efficiency and speed. Under the partnership, Samsung developed a
The Korea Herald – Business
Pax Silica Pact: India Plugs Into US Tech Alliance to Secure Chips, AI and Critical Minerals
Pax Silica pact: India has taken a significant leap forward by joining the US-led Pax Silica initiative, aimed at revolutionising fields such as artificial intelligence and semiconductor manufacturing. The formal signing took place at the India AI Impact Summit, marking a crucial moment for international tech collaboration.
The Economic Times (India) – Economy
💰 Hardware Fundraising
Freeform Future Corp Raises $67M for 3D Metal Printing System
Freeform Future Corp., a startup that builds custom 3D metal printers, announced a $67 million funding round. Investors include Nvidia’s NVentures, Boeing’s AE Ventures, Founders Fund, Apandion, Linse Capital, Threshold Ventures and Two Sigma Ventures. The capital will fund upgrades to its GoldenEye system and development of the next‑generation Skyfall printer.
UndisclosedFreeform Future Corp.
SEALSQ Corp Finalizes Second Strategic Investment in Quantum Hardware Startup EeroQ
SEALSQ Corp announced a follow‑on strategic investment in U.S. quantum hardware company EeroQ, marking its second capital injection after a December 2025 entry. The funding will support EeroQ’s electron‑on‑superfluid‑helium architecture and a joint proof‑of‑concept at SEALSQ’s Quantum Center of Excellence in Geneva. Deal terms were not disclosed.
CorporateEeroQ
💬 Top Hardware Social Posts
Tweet by @TDaytonPM
Taalas etches AI model weights in ROM with big SRAM memory, claims 50X more performance at 1/50th the cost per token with 1/36th the latency of a GPU – at 1/6th the energy. https://t.co/S4eyD94p5X
by Timothy Prickett Morgan•
Thread by @Chetanarvindpatil
#Technology #Thread #Semiconductor #Manufacturing #EPDT The Semiconductor EPDT Article On Warehouse-Scale Computing: 1/ - Published In Electronic Product Design And Test (EPDT), My Latest Article Explains Why Warehouse Scale Computing (WSC) Is Emerging As A Foundational Architecture Driving Modern Semiconductor Demand And Infrastructure Evolution.
by Chetan Arvind Patil•
