AMD Announces More Than $10B in Taiwan Ecosystem Investments to Accelerate AI Infrastructure
AMD announced more than $10 billion in investments across Taiwan’s semiconductor ecosystem to scale advanced‑packaging and silicon technologies for next‑generation AI infrastructure. The funding supports development of Elevated Fanout Bridge (EFB) interconnects, 2.5D panel‑based packaging, and the Helios rack‑scale platform slated for high‑volume production in the second half of 2026. Key Taiwan partners—including ASE, SPIL, PTI, and major ODMs such as Sanmina, Wiwynn and Inventec—will collaborate on manufacturing AMD Instinct MI450X GPUs and 6th‑gen EPYC CPUs. The initiative aims to boost bandwidth, power efficiency and time‑to‑market for AI data‑center solutions.
Amkor Expands Arizona Packaging Plans as AMD Joins Advanced Packaging Customers
Amkor Technology announced the acquisition of an additional 67 acres adjacent to its existing 104‑acre campus in Arizona, paving the way for a new advanced‑packaging fab slated to begin production in 2028. The company confirmed a partnership with AMD to...
Imec Says AI Scaling Needs More Orchestration Across Research, Design, Manufacturing
At ITF World 2026, imec CEO Patrick Vandenameele likened AI scaling to a violin that needs an orchestra, stressing that research, design, and manufacturing must operate in concert. He urged deeper collaboration among foundries, fabless firms, EDA vendors, equipment suppliers,...
Beijing Bans Nvidia’s Top Graphics Card to Back Domestic Rivals
Beijing has added Nvidia's RTX 5090D V2 graphics card to its banned‑goods list, ending the sale of a Blackwell‑based GPU that was marketed to Chinese gamers and AI hobbyists. The ban follows the Trump‑Xi summit and reflects escalating U.S. export controls that...
EC Approves €66m for German SiC Facility
The European Commission has approved a €288 million (≈$314 million) state‑aid package for two German semiconductor projects. €66 million (≈$72 million) will fund Zadient Materials Europe’s new plant in Bitterfeld to produce high‑purity silicon‑carbide (SiC) source material using a circular gas‑recovery process. The remaining...
Meta, Broadcom and Others to Launch $125 Million Semiconductor Research Hub at UCLA
Meta, Broadcom, Applied Materials, GlobalFoundries and Synopsys are investing $125 million to launch a five‑year Semiconductor Hub at UCLA's Samueli School of Engineering. The center will support research across chip design, equipment, software and manufacturing, aiming to accelerate AI‑powered chip innovations....
Armada Raises $230M Series B to Expand Mobile Data Center Production
Armada, a maker of mobile data centers housed in shipping containers, secured $230 million in a Series B funding round to expand manufacturing at its Arizona facility and increase production of its Leviathan data center modules. The new capital will...