Technology Videos

Reimagining 3D IC Design with AI

In this Silicon Grapevine episode, Seaman’s Digital Industries software’s Sudashan Deo discusses how artificial intelligence is reshaping 3D integrated‑circuit (3D IC) design. Deo traces his journey from computer‑science graduate to leading R&D manager across Intel, Synopsys, Cadence and now Siemens, highlighting the global, multi‑site team that fuels the effort. He explains that 3D ICs stack multiple active dies, shortening interconnects to boost performance, improve power efficiency, and shrink form‑factor. However, the approach introduces severe thermal hotspots, power‑integrity issues, mechanical stress, testability hurdles, and massive data volumes that strain traditional EDA flows. AI enters as a “co‑pilot,” using reinforcement learning and intelligent optimization to explore the combinatorial design space, identify optimal die‑stack configurations, and reconcile thermal, electrical, and mechanical constraints. Deo likens the architecture to a multi‑storey building and AI to a fast lift that moves data between floors, dramatically cutting design cycles from years to months. The implications are clear: AI‑augmented 3D IC tools promise faster time‑to‑market, lower development costs, and the ability to meet the compute demands of modern AI workloads, positioning chipmakers that adopt these methods at a strategic advantage.