Hardware Blogs and Articles
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Broadcom announced the start of shipments for the industry’s first 2nm custom compute SoC built on its 3.5D eXtreme Dimension System in Package (XDSiP) platform. The chip leverages Face‑to‑Face (F2F) 3D integration to combine 2.5D and 3D‑IC techniques, delivering unprecedented compute density and power efficiency. The first customer, Fujitsu, will use the silicon for its FUJITSU‑MONAKA initiative, with broader XPU rollouts slated for the second half of 2026. Broadcom positions the technology as a cornerstone for gigawatt‑scale AI and high‑performance computing clusters.
CIQ announced Rocky Linux from CIQ Pro (RLC Pro), a commercially supported Enterprise Linux subscription that bundles long‑term support, FIPS 140‑3 validation, indemnification and direct bug‑fix services. The offering targets AI, high‑performance computing and regulated industries, promising 3‑5 year lifecycle stability without forced...
Apple’s macOS 26 Tahoe no longer offers the historic Security Options button in Disk Utility, effectively dropping the GUI‑based secure erase feature for spinning‑disk hard drives. The official user guide still references the option, creating confusion for users who need to meet...
Microsoft released DirectX Shader Compiler version 1.9, adding production support for Shader Model 6.9. The update focuses on substantial SPIR‑V backend enhancements, including improved layout, ABI correctness, expanded type‑system support, and more reliable code generation. These changes tighten interoperability with Vulkan...
Walmart is extending its low‑cost Onn brand into smart‑TV territory by introducing Google TV‑powered models for the first time. A Bluetooth certification filing reveals three series—SGQ, MQP and SQ—offering 55‑, 65‑ and 75‑inch 4K screens. Pricing is expected to stay...
Pawsey Supercomputing Research Centre has doubled the high‑memory CPU nodes on its Setonix system from eight to sixteen, each equipped with dual 64‑core AMD EPYC 7763 processors and 1 TB of shared RAM. The expansion responds to a user‑survey‑identified demand for...
Lenovo unveiled a Legion Go Fold concept at Mobile World Congress, featuring a foldable pOLED screen that measures 7.7 inches when closed and expands to 11.6 inches unfolded. The device runs on an Intel Core Ultra 7 258V processor with 32 GB LPDDR5x memory and integrated Arc 140V...
Lawrence Berkeley National Laboratory researchers unveiled a thermodynamic computing prototype that harnesses thermal noise to generate simple images, mimicking generative AI behavior. By exploiting fluctuations instead of suppressing them, the system flips conventional digital logic and operates via Langevin dynamics....
Microsoft’s Windows 365 cloud PC platform is expanding as Asus and Dell unveil dedicated mini‑PC terminals designed specifically for the service. The Asus NUC 16 for Windows 365 packs a compact 0.7 L chassis, DDR5 memory, and a 20 Gbps USB‑C port, while the Dell...
Synopsys is leveraging its Foundation IP platform to let semiconductor designers tailor standard cells, memory compilers, and EDA flows for specific workloads. In hyperscale AI servers, customized IP and optimized flows delivered up to 51% power reduction and a 5%...
Silicon photonics is emerging as a viable alternative to copper interconnects for high‑performance computing (HPC) systems that power agentic AI workloads. Nvidia’s NVL72 uses copper‑based NVLink, but its bandwidth and latency are straining under next‑generation inference demands. French startup Scintil...
Supermicro unveiled its MicroBlade platform, the industry’s first blade server built around AMD’s EPYC 4005 series and delivering the highest compute density on the market. The 6U chassis can host up to 40 nodes, while a standard 48U rack can...
Akeana Inc. has teamed with formal‑verification specialist Axiomise to exhaustively verify its 4 nm super‑scalar RISC‑V test chip, Alpine. Using Axiomise’s CoreProve® framework, the collaboration identified functional bugs and redundant logic within months, enabling RTL optimizations before tape‑out. The formal approach...
A recent MIT Technology Review analysis highlighted the massive energy footprint of generative‑AI inference, prompting a search for more efficient silicon. VSORA responded with a purpose‑built Matrix Processing Unit (MPU) that abandons the GPU‑centric SIMT model in favor of tensor‑level...
HONOR unveiled the MagicPad 4, its first tablet to ship with Qualcomm's Snapdragon 8 Gen 5 mobile platform, positioning it against the iPad Pro and Galaxy Tab S series. The 12.3‑inch OLED screen offers a 165 Hz refresh rate, 2,400‑nit peak brightness, and a 4.8 mm thin chassis...
HONOR unveiled the MagicPad 4, its first tablet powered by Qualcomm’s Snapdragon 8 Gen 5 mobile platform, and slated for a global launch on 2 March 2026. The 12.3‑inch OLED display delivers a 165 Hz refresh rate, 2,400 nits peak brightness, and a 93 % screen‑to‑body ratio while the...
Exaviz has introduced the Cruiser carrier board for the Raspberry Pi Compute Module 5, delivering an 8‑port PoE+ switch, 2.5 GbE WAN, NVMe storage, dual HDMI, USB connectivity, and ESP32‑C6 wireless. The lineup includes three variants: the full‑feature Cruiser with eight...
Mindfactory’s latest sales data shows NVIDIA’s GeForce RTX 5080 has become the top‑selling card within the RTX 50 lineup, outpacing the RTX 5070 Ti and other 16 GB variants. AMD retains overall market leadership at the retailer, with the Radeon RX 9070 XT and RX 9060 XT leading the...
NCC Croatia partnered with Lürssen Design Centre Kvarner to embed computational fluid dynamics (CFD) and high‑performance computing (HPC) into superyacht ventilation design. Engineers received hands‑on training and used OpenFOAM on NCC’s supercomputer to model a real‑world duct network. The simulations...
Ciena introduced the Vesta 200 6.4T CPX, a pluggable co‑packaged optical (CPO) engine that delivers the industry’s highest density and up to 70% lower power consumption. The module supports 200 Gb/s per lane, retimer‑free linear‑drive operation and a 20 dB electrical loss budget, enabling...
Simon Fraser University has signed memoranda of understanding with Cerio, Corix and Moment Energy to deepen the sustainability of its Cedar Supercomputing Centre, Canada’s most powerful academic HPC system. The centre already runs on clean hydroelectric power and boasts a...
The LLVM Clang 22 compiler was benchmarked on an AMD EPYC 9655P Zen 5 server and showed performance largely identical to Clang 21 across a suite of open‑source C/C++ workloads. Tests also confirmed that Clang 22 remains neck‑and‑neck with GCC on the same hardware, with only modest,...
Caspia Technologies announced the general availability of CODAx V2026.1, an AI‑enhanced RTL security analyzer that checks over 150 insecure coding practices against more than 1,000 hardware vulnerability references. The tool can scan half‑million lines of RTL in under an hour,...
At the 2026 Chiplet Summit, Synopsys unveiled an AI‑driven, agentic approach to multi‑die design that promises to automate and accelerate the entire workflow. The semiconductor industry is shifting toward heterogeneous chiplet architectures and 3‑D stacking, creating unprecedented design complexity. AI...
AMD announced the EPYC 8005 “Sorano” series, a Zen 5‑based, single‑socket processor line succeeding the 8004 “Siena” family. Designed for 1P servers, the chips target telco and radio‑access‑network workloads with a focus on performance‑per‑dollar and performance‑per‑watt. The series promises high core counts,...
Infineon’s recent paper introduces Saarthi, an autonomous AI formal verification engineer that leverages multi‑agent LLM frameworks to generate, prove, and analyze RTL properties. The system creates English‑language verification plans, refines SystemVerilog assertions, and runs Cadence’s Jasper model‑checker in an iterative...
Arm and Linaro have unveiled the CoreCollective consortium, an open‑source‑focused alliance aimed at accelerating the Arm software ecosystem. The group is financially backed by Arm and invites any vendor to join for free. Founding members include AMD, Ampere, Canonical, Google,...
Astera Labs reported record FY2025 revenue of $852.5 million, a 115% year‑over‑year increase, and a Q4 revenue of $270.6 million, up 17% sequentially. GAAP operating margin reached 20.3% for the year, while non‑GAAP margin was 39.2%, reflecting strong profitability. The company began...
Nimbus Data introduced FlashMax, a next‑generation multiprotocol all‑flash platform that consolidates block, file and object storage into a single namespace. The system adds DirectLink PCIe expansion, hardware‑accelerated deduplication and compression, and rack‑level resiliency, supporting up to 20 PB raw (100 PB effective)...
Intelligent Memory Ltd. (IM) has launched a new low‑density eMMC product line, offering 8 GB and 16 GB capacities in a 153‑ball BGA package for industrial applications. The devices target environments requiring stability, longevity and right‑sized storage, such as factory automation, medical...
NXP has introduced two 10BASE‑T1S Physical Medium Dependent transceivers – the automotive‑grade TJA1410 and the industrial‑grade TJF1410 – that offload only the analog front‑end while the digital PHY resides in the host MCU or switch. Both devices use a three‑pin...
Ericsson announced at MWC 2026 that it will showcase live 6G demonstrations in partnership with Apple and MediaTek. The Apple demo will feature Multi‑RAT Spectrum Sharing (MRSS) to illustrate seamless 5G‑to‑6G coexistence, while MediaTek will present a 6G centimeter‑wave data‑call prototype...
AMD announced a multi‑year AI infrastructure partnership with Meta, delivering next‑generation Instinct GPUs, EPYC processors, and rack‑scale systems tailored for Meta’s data centers. The deal includes up to 6 GW of GPU capacity and a performance‑based warrant for up to 160 million...
OptiScaler’s test build 0.9.0‑pre10 adds FSR 4 support to Vulkan games by routing the upscaler through a DirectX 12 bridge, effectively bypassing AMD’s official limitation to RDNA 4 GPUs and DX12 titles. The community‑driven implementation works in titles such as Doom: The Dark...
ASUS unveiled the 2026 ROG Zephyrus Duo, the first dual‑screen gaming laptop designed for practical use rather than a novelty. It features two 16‑inch 3K OLED panels with 120 Hz refresh, an RTX 5090 GPU running at 135 W, and a five‑mode hinge...
Marvell Technology announced it will showcase a PCIe 8.0 SerDes operating at 256 GT/s during DesignCon 2026 in Santa Clara. The demo, presented at booth #904, uses the TE Connectivity AdrenaLINE Catapult connector and the Alaska P PCIe 6.0 retimer platform. PCIe 8.0, slated for finalization...
QEC4QEA, a new Quantum Excellence Centre funded by EuroHPC JU and Horizon Europe, receives roughly €4.9 million to accelerate quantum‑enhanced application development across Europe. The centre links end‑users with quantum developers, experts and computing providers, offering guidance, tools, training and hybrid quantum‑HPC resources....
Optical fingerprint scanners remain common on mid‑range and premium Android phones despite slower performance. Ultrasonic sensors cost only $6‑8 more per unit, yet manufacturers like Samsung and Google continue to use cheaper optical units in $400‑700 devices. Xiaomi demonstrates feasibility...
At the 2025 RISC‑V Summit, DeepComputing CEO Yuning Liang argued that AI will shift from cloud‑centric models to on‑device intelligence, leveraging aggressive quantization to run multiple models on a smartphone. He envisions a lightweight AI operating system that orchestrates models,...
Prusa Research announced a $200 price reduction for the assembled Original Prusa XL, positioning it as the most affordable multi‑material tool‑changer in its lineup. The XL retains its active tool‑changing architecture, supporting up to five full heads, while the newer INDX...
D7VK 1.4 has been released, extending the open‑source layer that translates Direct3D 5‑7 calls to Vulkan on Linux. The update introduces depth write‑back support, color‑key transparency, and a consolidated legacy DDraw interoperability path. Compatibility for older Direct3D 5 and 6 titles has been...
Tesla is set to roll out a software update (2026.2.xxx) that upgrades its Matrix Headlights with two‑stage pixel dimming and enhanced detection of highly reflective objects such as road signs. The new code will allow the system to dim individual...
Mibro launched the Explorer S Titanium, a rugged outdoor smartwatch priced at $249.99. It features an aerospace‑grade titanium unibody that is 40% lighter than stainless steel and meets MIL‑STD‑810H durability standards. The watch offers dual‑frequency GNSS, offline maps, 10 ATM water...
Dyze Design has filed a patent proposing a modular motion‑control architecture that separates command streams into priority queues and splits telemetry into real‑time and archival channels. The design adds edge‑processing modules for sensors, stepper and BLDC drives, and even a...
Morehouse College has secured an initial $5 million award from the National Science Foundation to host Horizon, a flagship supercomputer within the $457 million Leadership-Class Computing Facility. The project, led by the Texas Advanced Computing Center, will place one of the Southeast’s...
Siemens announced the acquisition of ASTER Technologies, a specialist in PCB test and reliability solutions, to bolster its electronic design automation (EDA) portfolio. ASTER’s design‑for‑test, design‑for‑manufacturing, and design‑for‑reliability tools will be integrated into Siemens’ end‑to‑end digital‑thread platform, enabling earlier validation...
The Lemhi supercomputer, deployed through a partnership between Idaho National Laboratory and the state’s three public research universities, replaces the aging Falcon system and delivers markedly faster performance. Hosted at INL’s Collaborative Computing Center, Lemhi provides remote, on‑demand high‑performance computing...
Google Cloud’s new N4A series, powered by the in‑house Axion ARM64 processor, was benchmarked against the existing N4 Intel Xeon and N4D AMD EPYC instances. All three tests used 16 vCPU configurations, 400 GB storage and Ubuntu 25.10. The Axion chips lack simultaneous...
StarTech’s Thunderbolt 5 Universal Docking Station offers a surprisingly low‑priced entry into the emerging TB5 ecosystem, retailing around £253. It supports three simultaneous 4K displays, 2.5 GbE Ethernet, and delivers up to 140 W of power to connected laptops. Performance tests show 3,130 MB/s...
The Startech Thunderbolt 5 Universal Docking Station delivers high‑bandwidth connectivity, triple‑4K display support, 2.5 GbE networking, and up to 140 W laptop charging at a price well below most competitors. In real‑world tests it handled three external monitors, SSD transfers near 3 GB/s, and...
