Hardware Blogs and Articles
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EMAIL DIGESTS
Daily
Every morning
Weekly
Tuesday recap
Paul Lagier unveiled a DIY Tiny E‑Reader that combines a 3D‑printed shell with an energy‑efficient e‑ink display, USB‑C charging, and wireless file transfer. The pocket‑sized device costs roughly $30 to build and delivers up to two weeks of battery life on a single charge. Navigation is reduced to a single mechanical button, emphasizing a distraction‑free reading experience. Comprehensive open‑source instructions make the project accessible to hobbyists and beginners alike.
SpotSee introduced WarmMark QR, a battery‑free, QR‑enabled temperature sensor designed for cold‑chain logistics. The device delivers affordable, real‑time, package‑level temperature data, replacing error‑prone visual indicators. By allowing remote data access, it improves recipient adoption and streamlines monitoring for shippers. The...
Engicam unveiled the SmarCore iQ6 SMARC 2.2 module, powered by Qualcomm’s Dragonwing IQ‑6 series IQ‑615 SoC. The module offers an 8‑core heterogeneous CPU, up to 8 GB LPDDR4X memory, 8 GB eMMC storage, and an integrated Adreno GPU capable of 4K video decoding...
Deutsche Telekom announced a partnership with Elon Musk’s Starlink to launch direct‑to‑device satellite mobile service in Germany starting in 2028. The initiative targets the remaining 1.2% of the country without 2G coverage, offering basic voice, data and messaging where terrestrial...
Polish embedded‑systems firm Grinn unveiled the ReneSOM‑V2H, the world’s smallest System‑on‑Module built around Renesas’ RZ/V2H vision AI processor. The 37 × 42.6 mm board combines four Cortex‑A55 cores, two Cortex‑R8 real‑time cores, a Cortex‑M33 MCU and an 8 TOPS DRP‑AI3 accelerator for edge‑AI workloads....
The ninth video in the Performance‑Aware Programming series highlights that a CPU’s ability to extract instruction‑level parallelism is bounded by dependency chains. When later instructions must wait for earlier results, the pipeline stalls, limiting throughput. The post underscores the need...
TCL CSOT unveiled its Super Pixel display at MWC 2026, promising up to 25% lower power consumption while delivering sharper images and faster refresh rates. The technology swaps the traditional SPR sub‑pixel rendering for a Real RGB layout, adding only 1.8% more...
NTT DATA’s Global Data Centers business secured four capacity commitments totaling nearly 115 MW across campuses in Gainesville, Virginia; Chicago, Illinois; and Sacramento, California. The deals include more than 90 MW for a major hyperscale provider and roughly 20 MW from three enterprise...
Computex 2026 will run June 2‑5 in Taipei across four venues, featuring 1,500 exhibitors and 6,000 booths, positioning the event as a global AI benchmark. The show’s “AI Together” theme spotlights AI & computing, robotics & mobility, and next‑gen technologies,...
Ayar Labs announced a $500 million Series E round led by Neuberger Berman, bringing total funding to $870 million and valuing the company at $3.75 billion. The capital will be used to scale high‑volume production and testing of its co‑packaged optics (CPO) solution, expand...
Fujitsu Spain and the BCN Port Innovation Foundation have launched a proof‑of‑concept to build an ocean digital twin for the Port of Barcelona. The project combines autonomous underwater drones with AI‑driven analytics to capture high‑resolution seabed imagery, quantify biodiversity, and...
A request‑for‑comments patch series introduced the AMD Dynamic Power and Thermal Configuration Interface (DPTCi) driver to the Linux kernel, aiming to improve power, performance, and thermal tuning for Ryzen‑based gaming handhelds. The driver exposes seven tuning parameters via a standard...
Zio Robot Co. announced it will replace its Chinese‑sourced batteries with high‑energy lithium‑ion cells from Canada’s NEO Battery Materials for its Mobile Worker (MW) autonomous mobile robots. The partnership aims to boost energy density, high‑rate discharge capability, and overall robot...
Bump and TSV planning underpins the electrical and mechanical fabric of multi‑die systems, enabling the ultra‑high bandwidth and low latency required for chiplet architectures. As interconnect pitch shrinks, designs can involve millions of contacts, making manual spreadsheet methods infeasible and...
The GNOME project released the Mutter 50 release candidate two weeks ahead of the GNOME 50 stable launch, delivering a suite of performance and visual enhancements. Key changes include dramatic latency reductions for the NVIDIA R590 driver, support for SDR‑Native color mode, and...
CHERI (Capability Hardware Enhanced RISC Instructions) introduces a hardware‑enforced capability architecture that replaces raw pointers with bounded, unforgeable references, making out‑of‑bounds memory accesses architecturally impossible. The design adds only about 4‑5% processor area and incurs minimal performance loss, while allowing...
Autobrains announced a strategic partnership with VinFast to develop an affordable autonomous robo‑car using a vision‑only system. The platform relies on six cameras, a single edge‑compute chip, and an agentic AI architecture that scales via modular skills. It replaces traditional...
Bluefors unveiled its Modular Cryogenic Platform, an expandable vacuum‑chamber system designed to meet the scaling demands of quantum computers. The architecture lets users add modules incrementally, increasing cooling capacity and qubit density without replacing the entire infrastructure. Each module supports...
The Illinois Quantum and Microelectronics Park (IQMP) launched an On‑Ramp program that places temporary, fully equipped labs in partner facilities to let future tenants start work immediately. Partner sites—mHUB, the UChicago Science Incubator at Hyde Park Labs, and the Discovery Partners Institute—provide...
Apple unveiled a refreshed Studio Display lineup, featuring a 27‑inch 5K base model with a 12 MP Center Stage camera, six‑speaker audio, Thunderbolt 5 ports, and up to four‑display daisy‑chain capability. The new Studio Display XDR replaces the Pro Display XDR, adding...
The RF power‑amplifier landscape has shifted from simple scalar load‑pull to sophisticated vector and simulated techniques as mmWave and sub‑THz designs demand tighter margins and wider bandwidths. Keysight’s two‑part masterclass introduces a VNA‑inspired load‑pull method that uses a‑ and b‑waves...
Intel engineers are revising the Linux Linear Address Masking (LAM) interface to align with the upcoming ChkTag memory‑tagging extension announced by the x86 Ecosystem Advisory Group. The new patches standardize LAM’s tag width to 4 bits—matching Arm’s MTE and the expected...
David Pogue’s forthcoming "Apple: The First 50 Years" offers an in‑depth look at the iPhone’s origin, and Wired has released an exclusive excerpt. The piece spotlights a 2003 collaboration with FingerWorks that produced a large multi‑touch pad, complete with projector‑based...
Intel has submitted its first “drm‑xe‑next” pull request to the DRM‑Next tree, targeting the upcoming Linux 7.1 kernel. The patch set introduces a suite of Xe driver enhancements, including hardware workarounds, SR‑IOV updates, and extensive Xe3(P) support for Crescent Island and...
Sonoff has launched firmware version 1.4.4 for its TRVZB Zigbee thermostatic radiator valve, adding a Proportional‑Integral‑Derivative (PID) control algorithm. The new "Smart Temperature Control" replaces the previous binary on/off logic with dynamic valve positioning that modulates heating output. This change curtails...
February 2026 was a whirlwind of AI‑focused announcements, with Meta teaming up with Nvidia to build a massive AI infrastructure and Brookfield unveiling a $100 billion AI‑infrastructure program. The month also saw Anthropic raise a record $30 billion in Series G funding, pushing its...
Meta announced a multi‑year strategic partnership with Nvidia to power its AI‑optimized data centers. The deal expands the use of Nvidia GPUs, Spectrum‑X Ethernet, and Confidential Computing across Meta’s infrastructure. Joint engineering teams will co‑design hardware and software to improve...
Pure Storage has rebranded as Everpure, signaling a strategic shift from pure storage hardware to comprehensive data‑management solutions. The new Everpure Fusion platform promises a people‑centric, policy‑driven enterprise data cloud that automates dataset lifecycle and governance. This week the company...
HyperBUNKER received US Patent No. 19/290,836 for its offline, hardware‑enforced Data Storage Security System that uses one‑way optocouplers, PLC‑governed drive cycling, and a multi‑vault architecture. The design physically isolates backups, eliminating network connections and login interfaces. It promises full system recovery...
QNAP Systems issued a security advisory warning that a fraudulent website, qfinder-pro.com, is impersonating its official Qfinder Pro utility. The fake site mimics QNAP branding to trick users into downloading tampered software, potentially exposing personal data and networks to malware....
AMD has released the rocprof‑trace‑decoder tool as open‑source under an MIT license. The decoder translates .att wave‑trace binary files into formats usable by profiling utilities, exposing GPU occupancy, instruction timing, and other metrics. This move removes one of the few...
At Mobile World Congress, IDEMIA Secure Transactions, Tele2 IoT and Cisco unveiled the first commercially available end‑to‑end IoT solution built on the GSMA SGP.32 eSIM standard. The offering combines IDEMIA’s certified eSIM ecosystem, Cisco’s Mobility Services Platform, and Tele2 IoT’s global connectivity...
MediaTek used Mobile World Congress 2026 to unveil its "AI For Life: From Edge to Cloud" showcase, highlighting breakthroughs from 6G radio interoperability to AI‑driven connectivity. The company demonstrated the world’s first 5G‑Advanced CPE with Wi‑Fi 8, delivering up to 40%...
Nordic Semiconductors unveiled the nRF93M1 LTE Cat 1bis IoT module at Mobile World Congress 2026, offering up to 10 Mbps downlink and 5 Mbps uplink speeds. The family includes two variants—LABA for Europe, Asia, Middle East and Africa, and LACA for global deployments—both supporting a...
U.S. Special Operations Command is urged to supplement its high‑signature, expensive military radios with disposable, low‑power commercial‑off‑the‑shelf (COTS) solutions such as LoRa. By operating in the unlicensed sub‑gigahertz ISM band and using chirp spread spectrum, these radios can hide below...
GMKtec unveiled the EVO T2 mini PC, claiming up to 180 AI TOPS powered by Intel’s Panther Lake Core Ultra X9 388H. The platform combines a Xe3‑based Arc iGPU (~122 TOPS), NPU5 (~50 TOPS) and CPU (~9 TOPS) to reach...
MSI has launched a refreshed version of its B850 TOMAHAWK MAX WiFi motherboard, designated the MAX WiFi II. The update is purely cosmetic, reducing the yellow hue on the PCB, while retaining the original’s feature set, including four M.2 slots...
AMD’s EPYC 9755 and EPYC 9745 are both 128‑core Turin processors, but the 9755 uses full‑fat Zen 5 cores at 500 W TDP while the 9745 packs dense Zen 5C cores into a 400 W (or 320 W cTDP) package. The 9755 clocks higher (2.1 GHz base, 4.1 GHz...
Researchers at Fermilab and MIT Lincoln Laboratory successfully trapped and manipulated ions using in‑vacuum cryoelectronic ASICs, demonstrating low‑power control with reduced thermal noise. The proof‑of‑principle experiment moved and held individual ions, proving that cryogenic electronics can replace some room‑temperature wiring....
Apple unveiled the latest iPad Air, now powered by the M4 chip and equipped with up to 8 GB of RAM. The new processor promises a substantial performance uplift over the previous generation, delivering faster CPU and GPU speeds. Apple kept...
Red Hat announced that Telenor has selected its cloud‑native and AI platforms to run the Telenor AI Factory, a sovereign AI service built on NVIDIA hardware. The factory uses Red Hat OpenShift AI, OpenShift Platform Plus, and Ansible Automation to...
Supermicro announced expanded AI‑RAN and sovereign AI infrastructure at MWC 2026, unveiling new 1U and 2U server models built on NVIDIA Grace CPUs and Blackwell GPUs. The ARS‑111L‑FR, ARS‑221GL‑NR, and ARS‑111GL‑NHR systems target distributed radio access networks and edge AI...
NTT, NTT DOCOMO and NTT DATA will showcase IOWN photonics‑based networking at MWC Barcelona 2026, highlighting its role in powering 6G and next‑generation AI workloads. The group announced a university‑industry project that merges 6G and IOWN to enable autonomous AI...
RISC‑V adoption drives the need for third‑party IP security. Arteris (formerly Cycuity) introduced a CWE‑based assurance framework that translates MITRE weaknesses into reusable security requirements, verification properties, and portable C‑tests. A pilot with SiFive’s X280 core analyzed 16 of 60...
Linux kernel 7.1 will automatically attempt to power off the system when a fatal ACPI error occurs. Earlier releases only logged the “_Fatal opcode executed_” message and kept running. The change aligns the OS behavior with the ACPI specification, which...
Independent teardowns confirm that Apple’s iPhone 17, 17 Pro and 17 Pro Max use Qualcomm’s QTM565 mmWave antenna‑in‑package module, which is fabricated on Soitec’s Fully Depleted Silicon‑On‑Insulator (FD‑SOI) substrate via GlobalFoundries’ 22FDX process. The finding validates FD‑SOI as a high‑volume substrate for FR2 5G...
Yunzii introduced the M1 Lightweight Tri‑Mode Wireless Mouse, offering 2.4 GHz, Bluetooth, and USB‑C wired connections for versatile, low‑latency use across gaming, office, and travel scenarios. The mouse features a PAW3311 sensor delivering up to 1000 Hz polling, 1 ms latency, and seven...
Intel confirmed its upcoming Arc Pro B70 “Battlemage” GPU, built on the long‑rumored BMG‑G31 die, featuring 32 Xe² cores, 32 GB of GDDR6 memory on a 256‑bit bus, and roughly 4,096 FP32 cores—double the B60’s capacity. A smaller Arc Pro B65 will use the same...
TSMC is urging its customers to submit applications for the N2 process node as most capacity is already booked through the end of 2027. Remaining slots carry a six‑quarter lead time, and even allocated customers face up to twelve months...
NanoIC, the imec‑coordinated European pilot line, announced the release of two advanced interconnect process design kits – a fine‑pitch redistribution layer (RDL) and a die‑to‑wafer (D2W) hybrid bonding kit. The RDL PDK supports line widths and spaces down to 1.3 µm...
