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Linux is integrating the IBPB‑on‑Entry feature for AMD SEV‑SNP guest VMs, slated for the upcoming 7.0 kernel and back‑porting to stable releases. The feature, native to AMD EPYC Zen 5 processors, inserts an Indirect Branch Predictor Barrier on VM entry to block speculative‑execution attacks. The patch modifies only a few lines, correcting a prior reservation of the IBPB bit. Its inclusion strengthens hardware‑based isolation without requiring guest‑side changes.
Razer announced the White Edition of its BlackShark V3 X HyperSpeed headset for both Xbox and PlayStation consoles. The new colorway retains the lightweight, wireless design and esports‑grade audio performance of the original model. It targets next‑generation console users seeking...
QNAP announced the TS-h1077AFU, a 10‑bay all‑flash NAS built on the ZFS‑based QuTS hero operating system and powered by AMD Ryzen PRO 7000 Series CPUs. The unit ships with ECC‑protected DDR5 memory, delivering enterprise‑grade performance and data integrity in a...
Huawei's New‑Gen OceanStor Dorado Converged All‑Flash Storage received technical validation from Enterprise Strategy Group (ESG). ESG's tests showed the system delivering over 876,000 IOPS with a 32 µs average latency in a high‑concurrency database workload. The architecture supports active‑active failover, tolerates...
Researchers unveiled four breakthrough technologies that could reshape communications and data‑center infrastructure. Columbia University’s "rainbow chip" creates a frequency‑comb, allowing dozens of precise light channels to travel simultaneously through a single fiber, promising massive bandwidth gains for broadband networks. The...
Memory manufacturers such as SK hynix, Samsung and Micron have moved to hourly DRAM pricing contracts, forcing OEMs to secure quotes within a single hour. The shift reflects soaring AI‑driven demand that makes prices fluctuate by the hour, prompting faster settlement...
ASUS announced price adjustments for its GeForce RTX 50 Series "Blackwell" GPUs in China, reflecting a broader memory component shortage. The flagship RTX 5090 D v2 sees a 500‑yuan (~$72) increase, while mid‑range models like the RTX 5080, 5070 Ti,...
Valve announced that Steam Deck restocks have resumed after the company resolved a RAM component shortage that had throttled production of higher‑capacity models. The 1TB and 512 GB variants are now appearing at their original MSRP, marking the first significant supply...
AMD’s VP of AI Software, Anush Elangovan, leveraged Claude Code to create a pure‑Python user‑space driver that talks directly to /dev/kfd and /dev/dri/renderD* via ctypes ioctls, bypassing the ROCm/HIP stack. The initial commit adds KFD ioctl bindings, SDMA copy engine...
Current AI, a $400 million public‑interest partnership, unveiled an open‑source handheld AI device at the India AI Impact Summit. The offline prototype, built with India’s Bhashini translation project, can see, speak, and answer questions in Hindi and English, even identifying candy...
The open‑source ATI R300 Gallium3D driver, originally reverse‑engineered for legacy Radeon hardware, received a critical occlusion‑query fix this week. Independent developer Pavel Ondračkar submitted a patch that avoids the HyperZ breakage of a 2012 attempt and uses a dummy Z‑buffer...
Electronic Arts announced it is hiring a senior engineer to port its Javelin kernel‑level anticheat to the Windows‑on‑Arm (WoA) platform. The move confirms that major publishers are preparing their security stacks for ARM‑based Windows 11 PCs. It coincides with NVIDIA's...
Tejas Networks introduced the TJ1600‑D3, a hyper‑scalable data‑center interconnect (DCI) platform, at MWC 2026 in Barcelona. The WDM optical transport system delivers line rates from 400 Gbps to 1.2 Tbps per wavelength and can scale to 51.2 Tbps of shelf capacity within a compact...
Maker LuckyBor has built a functional 4G smartphone using an ESP32‑S3 as its core processor. The device combines a SIMCOM A7682E modem, an OV2640 camera, a 3.5‑inch touchscreen and a 3.5 mm audio jack, delivering call, text and web capabilities despite...
AAEON’s UP brand unveiled the Intelli TWL01 Edge, an industrial‑grade multimedia PC that supports dual 4K HDMI displays and runs on Intel Core N‑series processors. The fanless, compact chassis measures 152 mm × 124.5 mm × 39 mm and offers DIN‑Rail, VESA, and wall‑mount options for rugged deployments. It...
10BASE‑T1L, defined in IEEE 802.3cg, delivers 10 Mbps full‑duplex Ethernet over a single twisted‑pair for up to 1 km. The standard lets BACnet/IP run directly on the link, eliminating gateways and allowing seamless integration with IT networks. Existing two‑wire fieldbus runs can be...
Paul Lagier unveiled a DIY Tiny E‑Reader that combines a 3D‑printed shell with an energy‑efficient e‑ink display, USB‑C charging, and wireless file transfer. The pocket‑sized device costs roughly $30 to build and delivers up to two weeks of battery life...
SpotSee introduced WarmMark QR, a battery‑free, QR‑enabled temperature sensor designed for cold‑chain logistics. The device delivers affordable, real‑time, package‑level temperature data, replacing error‑prone visual indicators. By allowing remote data access, it improves recipient adoption and streamlines monitoring for shippers. The...
Engicam unveiled the SmarCore iQ6 SMARC 2.2 module, powered by Qualcomm’s Dragonwing IQ‑6 series IQ‑615 SoC. The module offers an 8‑core heterogeneous CPU, up to 8 GB LPDDR4X memory, 8 GB eMMC storage, and an integrated Adreno GPU capable of 4K video decoding...
Deutsche Telekom announced a partnership with Elon Musk’s Starlink to launch direct‑to‑device satellite mobile service in Germany starting in 2028. The initiative targets the remaining 1.2% of the country without 2G coverage, offering basic voice, data and messaging where terrestrial...
Polish embedded‑systems firm Grinn unveiled the ReneSOM‑V2H, the world’s smallest System‑on‑Module built around Renesas’ RZ/V2H vision AI processor. The 37 × 42.6 mm board combines four Cortex‑A55 cores, two Cortex‑R8 real‑time cores, a Cortex‑M33 MCU and an 8 TOPS DRP‑AI3 accelerator for edge‑AI workloads....
The ninth video in the Performance‑Aware Programming series highlights that a CPU’s ability to extract instruction‑level parallelism is bounded by dependency chains. When later instructions must wait for earlier results, the pipeline stalls, limiting throughput. The post underscores the need...
TCL CSOT unveiled its Super Pixel display at MWC 2026, promising up to 25% lower power consumption while delivering sharper images and faster refresh rates. The technology swaps the traditional SPR sub‑pixel rendering for a Real RGB layout, adding only 1.8% more...
NTT DATA’s Global Data Centers business secured four capacity commitments totaling nearly 115 MW across campuses in Gainesville, Virginia; Chicago, Illinois; and Sacramento, California. The deals include more than 90 MW for a major hyperscale provider and roughly 20 MW from three enterprise...
Computex 2026 will run June 2‑5 in Taipei across four venues, featuring 1,500 exhibitors and 6,000 booths, positioning the event as a global AI benchmark. The show’s “AI Together” theme spotlights AI & computing, robotics & mobility, and next‑gen technologies,...
Ayar Labs announced a $500 million Series E round led by Neuberger Berman, bringing total funding to $870 million and valuing the company at $3.75 billion. The capital will be used to scale high‑volume production and testing of its co‑packaged optics (CPO) solution, expand...
Fujitsu Spain and the BCN Port Innovation Foundation have launched a proof‑of‑concept to build an ocean digital twin for the Port of Barcelona. The project combines autonomous underwater drones with AI‑driven analytics to capture high‑resolution seabed imagery, quantify biodiversity, and...
A request‑for‑comments patch series introduced the AMD Dynamic Power and Thermal Configuration Interface (DPTCi) driver to the Linux kernel, aiming to improve power, performance, and thermal tuning for Ryzen‑based gaming handhelds. The driver exposes seven tuning parameters via a standard...
Zio Robot Co. announced it will replace its Chinese‑sourced batteries with high‑energy lithium‑ion cells from Canada’s NEO Battery Materials for its Mobile Worker (MW) autonomous mobile robots. The partnership aims to boost energy density, high‑rate discharge capability, and overall robot...
Bump and TSV planning underpins the electrical and mechanical fabric of multi‑die systems, enabling the ultra‑high bandwidth and low latency required for chiplet architectures. As interconnect pitch shrinks, designs can involve millions of contacts, making manual spreadsheet methods infeasible and...
The GNOME project released the Mutter 50 release candidate two weeks ahead of the GNOME 50 stable launch, delivering a suite of performance and visual enhancements. Key changes include dramatic latency reductions for the NVIDIA R590 driver, support for SDR‑Native color mode, and...
CHERI (Capability Hardware Enhanced RISC Instructions) introduces a hardware‑enforced capability architecture that replaces raw pointers with bounded, unforgeable references, making out‑of‑bounds memory accesses architecturally impossible. The design adds only about 4‑5% processor area and incurs minimal performance loss, while allowing...
Autobrains announced a strategic partnership with VinFast to develop an affordable autonomous robo‑car using a vision‑only system. The platform relies on six cameras, a single edge‑compute chip, and an agentic AI architecture that scales via modular skills. It replaces traditional...
Bluefors unveiled its Modular Cryogenic Platform, an expandable vacuum‑chamber system designed to meet the scaling demands of quantum computers. The architecture lets users add modules incrementally, increasing cooling capacity and qubit density without replacing the entire infrastructure. Each module supports...
The Illinois Quantum and Microelectronics Park (IQMP) launched an On‑Ramp program that places temporary, fully equipped labs in partner facilities to let future tenants start work immediately. Partner sites—mHUB, the UChicago Science Incubator at Hyde Park Labs, and the Discovery Partners Institute—provide...
Apple unveiled a refreshed Studio Display lineup, featuring a 27‑inch 5K base model with a 12 MP Center Stage camera, six‑speaker audio, Thunderbolt 5 ports, and up to four‑display daisy‑chain capability. The new Studio Display XDR replaces the Pro Display XDR, adding...
The RF power‑amplifier landscape has shifted from simple scalar load‑pull to sophisticated vector and simulated techniques as mmWave and sub‑THz designs demand tighter margins and wider bandwidths. Keysight’s two‑part masterclass introduces a VNA‑inspired load‑pull method that uses a‑ and b‑waves...
Intel engineers are revising the Linux Linear Address Masking (LAM) interface to align with the upcoming ChkTag memory‑tagging extension announced by the x86 Ecosystem Advisory Group. The new patches standardize LAM’s tag width to 4 bits—matching Arm’s MTE and the expected...
David Pogue’s forthcoming "Apple: The First 50 Years" offers an in‑depth look at the iPhone’s origin, and Wired has released an exclusive excerpt. The piece spotlights a 2003 collaboration with FingerWorks that produced a large multi‑touch pad, complete with projector‑based...
Intel has submitted its first “drm‑xe‑next” pull request to the DRM‑Next tree, targeting the upcoming Linux 7.1 kernel. The patch set introduces a suite of Xe driver enhancements, including hardware workarounds, SR‑IOV updates, and extensive Xe3(P) support for Crescent Island and...
Sonoff has launched firmware version 1.4.4 for its TRVZB Zigbee thermostatic radiator valve, adding a Proportional‑Integral‑Derivative (PID) control algorithm. The new "Smart Temperature Control" replaces the previous binary on/off logic with dynamic valve positioning that modulates heating output. This change curtails...
February 2026 was a whirlwind of AI‑focused announcements, with Meta teaming up with Nvidia to build a massive AI infrastructure and Brookfield unveiling a $100 billion AI‑infrastructure program. The month also saw Anthropic raise a record $30 billion in Series G funding, pushing its...
Meta announced a multi‑year strategic partnership with Nvidia to power its AI‑optimized data centers. The deal expands the use of Nvidia GPUs, Spectrum‑X Ethernet, and Confidential Computing across Meta’s infrastructure. Joint engineering teams will co‑design hardware and software to improve...
Pure Storage has rebranded as Everpure, signaling a strategic shift from pure storage hardware to comprehensive data‑management solutions. The new Everpure Fusion platform promises a people‑centric, policy‑driven enterprise data cloud that automates dataset lifecycle and governance. This week the company...
HyperBUNKER received US Patent No. 19/290,836 for its offline, hardware‑enforced Data Storage Security System that uses one‑way optocouplers, PLC‑governed drive cycling, and a multi‑vault architecture. The design physically isolates backups, eliminating network connections and login interfaces. It promises full system recovery...
QNAP Systems issued a security advisory warning that a fraudulent website, qfinder-pro.com, is impersonating its official Qfinder Pro utility. The fake site mimics QNAP branding to trick users into downloading tampered software, potentially exposing personal data and networks to malware....
AMD has released the rocprof‑trace‑decoder tool as open‑source under an MIT license. The decoder translates .att wave‑trace binary files into formats usable by profiling utilities, exposing GPU occupancy, instruction timing, and other metrics. This move removes one of the few...
At Mobile World Congress, IDEMIA Secure Transactions, Tele2 IoT and Cisco unveiled the first commercially available end‑to‑end IoT solution built on the GSMA SGP.32 eSIM standard. The offering combines IDEMIA’s certified eSIM ecosystem, Cisco’s Mobility Services Platform, and Tele2 IoT’s global connectivity...
MediaTek used Mobile World Congress 2026 to unveil its "AI For Life: From Edge to Cloud" showcase, highlighting breakthroughs from 6G radio interoperability to AI‑driven connectivity. The company demonstrated the world’s first 5G‑Advanced CPE with Wi‑Fi 8, delivering up to 40%...
Nordic Semiconductors unveiled the nRF93M1 LTE Cat 1bis IoT module at Mobile World Congress 2026, offering up to 10 Mbps downlink and 5 Mbps uplink speeds. The family includes two variants—LABA for Europe, Asia, Middle East and Africa, and LACA for global deployments—both supporting a...
