Foundryecosystem Report: Capacity Shortages, Fabs, ASE, ATE
The latest Foundryecosystem Report highlights a severe shortage of leading‑edge foundry capacity for AI chips, as AMD, Nvidia and others scramble for wafers. Rising costs are also pressuring mature‑node display driver IC (DDIC) suppliers, prompting potential price hikes. Meanwhile, major players such as Micron, Lumentum, Arm, ASE and Analog Devices announce new fabs, acquisitions and product launches to expand supply and diversify the semiconductor ecosystem. The report underscores how supply‑chain constraints, not design, now dictate AI hardware commercialization.
Mitsubishi, Rohm, Toshiba To Merge Power Semi Businesses
Mitsubishi Electric, Rohm and Toshiba Electronic Devices & Storage have signed a memorandum of understanding with Japan Industrial Partners and TBJ Holdings to explore merging their power‑semiconductor businesses. The proposed joint venture would combine silicon, gallium‑nitride (GaN) and silicon‑carbide (SiC)...
Which Foundries Are Making Which AI Chips?
Jon Peddie Research tracks 133 active AI processor suppliers, with major players like Nvidia, AMD, Broadcom, Google and a host of startups operating fabless. Nvidia’s newest Rubin GPU is manufactured by TSMC using its N3P process, while its Groq 3...
GlobalFoundries Files Patent Suit Against Tower
GlobalFoundries has initiated legal actions against Tower Semiconductor in both the U.S. International Trade Commission and the Western District of Texas. The complaints allege that Tower is infringing on eleven of GF’s U.S. patents covering high‑performance analog, RF, and silicon‑photonics...
Cisco, Kioxia, Sandisk, Solidigm Invest $2.5B in Nanya
Cisco, Kioxia, Sandisk and Solidigm have collectively invested about $2.5 billion in Taiwan’s Nanya Technology through a private‑placement share offering. The capital will fund expansion of Nanya’s DRAM fabrication capacity, addressing a global memory shortage. Each investor also signed separate DRAM...
Tower Acquires 300mm Fab From JV Partner in Japan
Tower Semiconductor will acquire full ownership and operational control of the 300mm Fab 7 in Uozu, Japan, from its joint‑venture partner Nuvoton. The 65nm facility produces RF‑SOI, power‑management ICs, sensors and silicon‑photonics chips, and Tower aims to quadruple its capacity...
Advanced Packaging in the Semiconductor Industry
Advanced packaging is reshaping the semiconductor sector by enabling higher transistor density and heterogeneous integration through 2.5D, 3D, and fan‑out wafer‑level techniques. The global market is projected to exceed $30 billion by 2028, driven by demand for AI, high‑performance computing, and...