CEA-Leti and Fraunhofer IPMS Validate Wafer Exchange for Ferroelectric Memory Materials
A five‑year EU pilot line led by CEA‑Leti has successfully demonstrated wafer exchange between its cleanroom and Fraunhofer IPMS, proving that complex HZO ferroelectric stacks can be processed across multiple 300 mm CMOS fabs. The collaboration validated contamination‑control protocols using VPD‑ICP‑MS and TXRF, and electrical testing confirmed reliable ferroelectric switching. Results showed titanium nitride bottom electrodes outperform tungsten in 10⁷‑cycle reliability tests. The initiative sets the stage for broader European material testing and integration of ferroelectric memories into advanced 22 nm FDX production.
Everspin Technologies Expands On-Shore MRAM Manufacturing Capacity
Everspin Technologies has signed a 10‑year manufacturing agreement with Microchip Technology to expand on‑shore production of MRAM and tunnel‑magnetoresistive (TMR) sensor wafers. The partnership will replicate Everspin’s Chandler, AZ line at Microchip’s Oregon fab, creating a domestic second source and...
New ZEISS Crossbeam 750 FIB-SEM Designed for High-Accuracy Sample Preparation Workflows
ZEISS unveiled the Crossbeam 750 FIB‑SEM, featuring Gemini 4 electron optics and a high‑dynamic‑range Mill + SEM that provides a live, high‑resolution view during milling. The system delivers sub‑nanometer precision and real‑time endpointing for TEM lamellae, enabling uniform first‑pass cuts in advanced semiconductor nodes....
Open Broadcast Systems Unlocks IP Distribution for BBC World Service TV
Open Broadcast Systems announced that its low‑latency IP decoders have been chosen by BBC World Service TV for global distribution. The compact units support major IP video protocols—including SRT, RIST and Zixi—allowing flexible, reliable, and cost‑effective delivery to rebroadcast partners...
Veteran Windows Dev Shows Off AI Running on 47-Year-Old PDP11 with 6 MHz CPU and 64KB of RAM — 'Gloriously...
Veteran Windows developer Dave Plummer has demonstrated that a 47‑year‑old PDP‑11, equipped with a 6 MHz CPU and 64 KB of RAM, can train a functional transformer model written entirely in assembly. The single‑layer, single‑head model, dubbed “Attention 11,” contains 1,216 parameters and uses...
Will IME Be the Path for Printed Electronics to Break Into Automotives
In‑mold electronics (IME) is gaining traction in the automotive sector after Kronos Mechatronics captured the LOPEC 2026 Startup Award for Best Business Potential. At LOPEC 2026, several IME firms showcased how conductive traces can replace traditional wiring, delivering lighter, lower‑cost interiors and...
Germany: NGEN Starts Building 100MWh BESS, Harmony Energy Secures 3GWh Pipeline Financing
NGEN, a Slovenia‑based owner‑operator, has broken ground on a 50 MW/100 MWh battery energy storage system in Wilhelmshaven, Germany, in partnership with Uniper. The BESS will be commissioned in Q4 2026 and forms the core of the Energy Transformation Hub Nordwest, a renewable‑energy...
The Challenges of Scaling a Technology for Social Good
The Harvard Business School case study on the Single User Reinvented Toilet (SURT) examines how a breakthrough off‑grid sanitation technology, funded by the Gates Foundation, struggles to move from prototype to market. Engineers and academics debate three commercialization routes—independent pilots, licensing to appliance...
ASUS Launches 2026 Zenbook and Vivobook Series in India: Price, Specs, Features and Pre-Order Details
ASUS unveiled its 2026 Zenbook and Vivobook laptop lineups in India, priced between ₹98,990 and ₹299,990 (approximately $1,200–$3,600). The devices run AI‑ready Intel Core Ultra 3 and Qualcomm Snapdragon X2 Elite processors, feature OLED screens, up to 32 GB RAM, 1 TB PCIe 4.0 SSDs,...
Reducing Wires in Quantum Computers
A new theoretical study shows that time‑multiplexing control wires across multiple superconducting qubits can dramatically cut wiring density while adding only a modest speed penalty. By scheduling fast single‑qubit operations during the longer two‑qubit gate windows, the researchers found that...
Vietnam’s GG Power Opens 5GWh BESS Factory, Government Emphasises Support for Local Supply Chain
GG Power inaugurated a 5 GWh battery energy storage system (BESS) plant in Hung Yen, Vietnam, backed by a US$12 million investment and a technology‑transfer deal with Chinese firm Goldwind. The factory, over 90 % automated, aims to localise more than half of...
Is Mercedes Set to Source Battery Cells From Samsung SDI Soon?
Samsung SDI is in advanced negotiations with Mercedes‑Benz to supply prismatic battery cells for the automaker’s MMA platform, targeting compact EV models slated for a 2028 market launch. The talks cover a potential multi‑GWh order and the establishment of a...
Quantum and AI Begin to Converge in Hybrid Computing Experiments
Researchers are increasingly pairing artificial‑intelligence tools with quantum‑computing research to tackle the soaring cost of large AI models. Companies like Multiverse Computing are applying quantum‑inspired tensor networks to compress neural‑network parameters, while quantum‑software firm Classiq unveiled an AI‑driven coding assistant...
The Firmware Fallacy: Why Bridging the NTN Gap in Massive IoT Still Requires a Hardware Reality Check
The article warns that adding Non‑Terrestrial Network (NTN) connectivity to massive IoT devices cannot be achieved through a simple firmware‑over‑the‑air update. While 3GPP Release 17 introduces native NTN support for NB‑IoT and LTE‑M, the physical differences in antenna patterns, RF front‑end...
Detroit Aims to Become Center of U.S. Drone Manufacturing
Detroit is positioning itself as the United States' drone manufacturing hub, converting the vacant United Auto Workers training complex into a high‑tech production site. Start‑up Birdstop, which builds drones for infrastructure inspection, relocated from Alabama and California to take advantage...
The Hyperscalers Are Pricing Themselves Out of AI Workloads
Large cloud providers are losing AI customers as neoclouds and private alternatives offer comparable GPU performance at a fraction of the cost. Recent data shows NVIDIA H100 compute runs about $2.01 per hour on Spheron versus $6.88 on AWS, a...
Tieline Introduces Gateway Nexus
At the NAB Show, Tieline unveiled the Gateway Nexus, a 32‑channel, high‑density AoIP codec designed for low‑latency, deterministic multichannel audio transport. The unit natively supports AES67, ST2110‑30, ST2022‑7, Ravenna, Livewire, NMOS and Ember+, with optional Dante integration, and can be...
Off-Grid Power Play: Electrifying Opportunity in PPSI
Pioneer Power (NASDAQ:PPSI) is expanding from EV‑charging into off‑grid colocated power generation with its PRYMUS platform, which can be built from 1 MW to 10 MW and deployed in months. The company targets the fast‑growing data‑center and edge‑AI markets, a $100 billion opportunity...
The New Trump Phone Design Is Here
Trump Mobile has refreshed its brand and revealed the final design of its T1 smartphone. The gold handset features an American flag motif on the back, a 6.78‑inch OLED screen, and a triple‑camera array with a 50‑megapixel main sensor. It...
How System-Level Validation Compresses Schedule Risk in Device Design
Flagship consumer‑electronics launches face massive schedule volatility because manufacturing constraints are often introduced late in the design cycle. Embedding system‑level validation early transforms it from a downstream quality checkpoint into a proactive risk‑compression tool, exposing integration and yield issues before...
Software-Defined RF Sensors & SIGINT Payloads for Drones & UxVs
Cambridge Radio Frequency Systems (CRFS) joined Unmanned Systems Technology's global supplier ecosystem as a Gold member, showcasing its RFeye software‑defined RF sensors and SIGINT payloads for UAVs, UGVs and USVs. The modular suite covers 9 kHz‑40 GHz, offers edge AI processing, and...
GPU Prices Are Surging—3 Ways to Play the AI Chip Shortage
GPU rental rates have jumped 40‑50% as AI demand outpaces supply, spotlighting the ongoing AI chip shortage. The bottleneck centers on high‑bandwidth memory (HBM), keeping manufacturers like Micron at full order books through 2027. Investors can target three fronts: memory...
Realme Narzo 100 Lite 5G with 6.8-inch 144Hz Display and 7,000mAh Battery Launched, Price Starts at ₹13,999
Realme launched the Narzo 100 Lite 5G in India, offering a 6.8‑inch HD+ IPS LCD with a 144 Hz refresh rate, a MediaTek Dimensity 6300 processor, and a massive 7,000 mAh battery. The device ships in three configurations, with launch‑offer prices starting at roughly $150 (₹12,499)...
Research Bits: Apr. 14
Researchers from Hong Kong, Tsinghua and Southern University of Science and Technology unveiled CLAP, a memristor‑based platform that fuses physically unclonable function authentication with compute‑in‑memory, achieving 99.46% AUC on ECG data while shrinking area and power use. A separate team...
C-DoT to Commercialise Indigenously-Developed 5G Radio Network
India’s Centre for Development of Telematics (C‑DoT) has completed an indigenously developed 5G radio that operates in both non‑standalone and standalone modes, partnering with VVDN Technologies and WiSig Networks. The consortium is set to begin field trials in Ambala after...
Connected Healthcare IoT: Remote Monitoring, Medical Devices and Data Challenges
Connected Healthcare is emerging as a core segment of IoT, linking wearable sensors, implantable devices, and hospital equipment to cloud and edge platforms for real‑time patient monitoring. The architecture relies on multi‑layered connectivity—BLE, Wi‑Fi, LTE‑M, NB‑IoT, and 5G—and data standards...
China Quietly Profits From US AI Boom Despite Washington’s Tech Curbs: Research
The United States is embarking on a $2 trillion data‑centre build‑out to fuel its artificial‑intelligence surge, with three‑quarters of the cost tied to hardware such as semiconductors and servers. While Taiwan and South Korea dominate advanced chip exports, China is quietly...
![Remote Metre Reading by 2027: Retrofit Beats Replacement [Sponsored]](/cdn-cgi/image/width=1200,quality=75,format=auto,fit=cover/https://cdn.tech.eu/uploads/2026/04/acrios-703.png)
Remote Metre Reading by 2027: Retrofit Beats Replacement [Sponsored]
The EU Energy Efficiency Directive now requires every heat and hot‑water meter in existing buildings to be remotely readable by 2027. Most legacy meters already measure accurately but lack a digital back‑haul, creating a compliance gap. ACRIOS proposes retrofitting a...
Finnish Quantum Computing Champion IQM Determined to Make ‘Impossible’ Engineering Breakthrough
IQM, Europe’s largest quantum‑computing firm, is raising roughly €300 million (about $330 million) to fund R&D and acquisitions aimed at overcoming the engineering limits of superconducting qubits. CEO Jan Goetz argues that breakthroughs—especially in cabling‑free, tiled qubit architectures—can prove DARPA’s warning that current...
Chinese Team Shows Quantum Tech Can Disrupt AI in a Real World Task
Chinese researchers demonstrated a nine‑qubit nuclear magnetic resonance quantum reservoir that matched or exceeded a classical 10,000‑node network in multi‑step weather prediction. The experiment achieved comparable accuracy at less than 1 % of the $100 million cost of typical AI weather‑forecasting supercomputers....
CHC Navigation Debuts AlphaAir 6 Long-Range LiDAR for High-Relief Terrain & Aerial Surveying
CHC Navigation has launched the AlphaAir 6, a lightweight (1.35 kg) UAV‑mounted LiDAR system designed for high‑relief terrain mapping. The sensor offers a 2,100 m maximum range and operates at 400‑600 m flight altitude, delivering up to 2 MHz pulse repetition and 5th‑generation real‑time waveform...
Tetra-Networks-for-Mission-Critical-Voice-Communications
Motorola Solutions highlights TETRA private mobile radio (PMR) networks as essential for mission‑critical voice communications in public safety. Operating around 400 MHz, TETRA offers longer reach and better indoor penetration than 4G/5G, especially in reinforced concrete structures. Built‑in redundancy and direct‑mode...
New DJI Avata 360 Drone Is Finally Available to Buy in US
The DJI Avata 360 drone is now for sale in the United States, with the RC 2 combo priced at $719 and a Fly More bundle at $979. It pairs dual 1‑inch‑equivalent sensors to capture 8K/60 fps HDR 360° video and 120 MP stills, while...
Vertiq Releases Speed Firmware v0.3.0 for G2 Modules
Vertiq has launched Speed Firmware v0.3.0 for its G2 ESC modules, adding expanded DroneCAN configuration, health‑monitoring controls, and richer error reporting. The update, available for download now, will become the default on all G2 production units starting October 2026 after...
Telecom Network Market Rebounds to $215.8 Bn in 2025 as AI and 5G Investments Accelerate
Global telecom network infrastructure revenues hit $215.8 bn in 2025, up 4.2% year‑over‑year, with Q4 alone reaching $61.8 bn, a 7.2% rise. The rebound follows a slowdown in 2023‑24 and is driven by operator spending on 5G upgrades, fiber expansion and AI‑enabled...
XCharge Opens First European Assembly Plant in Spain
XCharge inaugurated a 3,000 m² assembly plant in Silla, Valencia, Spain, its first European manufacturing hub. The facility will assemble high‑power EV chargers such as the 400 kW C7 and the GridLink battery‑integrated solution, currently sold in North America. By localising production,...
How a Risky Move Paid Off for Nvidia
Nvidia’s two‑decade‑long gamble on AI‑focused GPUs finally paid off, delivering an 85% year‑over‑year jump in AI chip revenue to roughly $15 billion. The surge propelled the company’s stock up about 30% after it beat earnings expectations, confirming the value of its...
Why Power, Cooling, and Compute Are Now the Defining Challenge for Data Centers
India is positioning itself as a global data‑center hub, buoyed by tax incentives that now run through 2047. The AI boom, however, is exposing physical limits as compute density drives unprecedented power and cooling demands. Existing infrastructure—grids, water supplies, and...
Telecom News: RUCKUS Networks, Nokia, Telecom Italia (TIM), Jio, Airtel, Vi, BSNL
RUCKUS Networks and Nokia have introduced an early‑access Wi‑Fi 7 solution paired with Nokia’s fiber optical LAN, managed via the AI‑driven RUCKUS One platform, targeting enterprises and service providers. The integrated offering promises multi‑gigabit speeds, low latency, and plug‑and‑play deployment, with...
Motorola Teases Edge 70 Pro India Launch Teased: Expected Specs, Price, and Release Timeline
Motorola has opened a dedicated Flipkart microsite that teases the upcoming Edge 70 Pro for India, confirming three colour options—Blue, Green and White—and hinting at an April 26 reveal. The mid‑range handset is expected to upgrade the Edge 70 Fusion with a 6,500 mAh battery, 90 W...
Consumer DRAM Price Surges in March Amid Limited Capacity, Order Shifts
TrendForce reports that consumer DRAM contract prices are set to surge 45‑50% QoQ in Q2 2026 as Taiwanese manufacturers curtail capacity for legacy nodes and shift production toward DDR4. In March, DDR4 4‑Gb chips jumped over 20% MoM, while DDR3...
Ennostar Showcases Micro LED Optical Communication Technology with AUO and Tyntek
Ennostar Corp. unveiled a GaN‑based Micro LED optical communication solution at Touch Taiwan 2026, co‑developed with AUO and Tyntek. The system pairs a Micro LED transmitter with Tyntek’s micro photodetector inside AUO’s co‑packaged optics (CPO) module, targeting ultra‑short‑reach links under...
AiM Future and Metsakuur Collaborate on NPU-Integrated Hardware
AiM Future has teamed up with Vision‑AI specialist Metsakuur to create NPU‑integrated hardware for edge AI applications. The deal combines AiM’s low‑power, high‑efficiency neural processing unit—already used in LG home appliances—with Metsakuur’s proprietary AI algorithms. Together they aim to deliver...
QuickLogic Showcases RadPro FPGA Dev Kit at HEART Conference
QuickLogic Corp. unveiled its first RadPro FPGA development kit at the 41st HEART Conference in Shreveport, Louisiana. The RadPro FPGA is fabricated in the United States on GlobalFoundries' proven 12nm process, the same node used for many defense‑grade ASICs. The...
Rohm, Toshiba and Mitsubishi Join Forces to Create a Power Chip Unit
Rohm Semiconductor, Toshiba Electronic Devices & Storage, and Mitsubishi Electric have signed an MoU to explore a joint power‑semiconductor unit, aiming to create Japan's second‑largest player after Infineon. The trio currently holds about 11% of the global power‑chip market, versus...
I Followed the 'Plus 5' Rule for Wireless Charging, and It Fixed My iPhone's Charge Speeds
The ZDNET piece explains the “Plus 5” rule, which advises using a wall adapter that supplies five watts more than a wireless charger’s maximum output. Applying a 20 W (or higher) USB‑C adapter to a 15 W MagSafe‑compatible pad restores the advertised fast‑charging...
SemiLEDs Corp (LEDS) Q2 2026 Earnings Call Transcript
SemiLEDs Corp reported record Q2 2026 net sales of $257.6 million, a 20% year‑over‑year increase, driven by strong data‑center and high‑end consumer demand. The company slashed its net leverage to 1.6 times after reducing debt by $879 million, cutting quarterly interest expense by...
Bitmine Immersion Technologies Inc (BMNR) Q2 2026 Earnings Call Transcript
Bitdeer Technologies Group reported Q2 2026 revenue of $224.8 million, up 226% year‑over‑year, driven by a surge in self‑mining hash rate and SealMiner sales. Gross margin fell sharply to 4.7% as Bitcoin prices slipped, electricity costs rose and depreciation accelerated. Adjusted EBITDA...
Quantum Computing: A Tech Race Europe Could Win?
Alice & Bob, a French quantum‑computer startup, is spending $50 million on a new Paris‑area campus that will house larger cryostats and an in‑house chip‑fab. Co‑founder Théau Peronnin says the firm will soon link its machines to high‑performance computers, delivering exponential speed‑ups that could...
Analog Devices Opens Advanced Backend Facility in Thailand
Analog Devices (ADI) opened an advanced backend manufacturing facility in Chonburi, Thailand, upgrading its local operations from a test‑only site to a full‑scale production base that includes wafer‑level processing, chip‑scale packaging (CSP) and final IC testing. CEO Vincent Roche described...