Today's Semiconductors Pulse
AMD CEO says AI boom revives focus on CPUs
AMD CEO Lisa Su said the rapid expansion of AI workloads is refocusing attention on central processing units. AMD also announced it will invest more than $10 billion in Taiwan’s ecosystem to accelerate AI infrastructure deployment.
TSMC Plans GigaFab Cluster in Arizona, Aiming for Capacity Close to Taiwan
Taiwan Semiconductor Manufacturing Co. (TSMC) is accelerating its U.S. footprint by planning a GigaFab cluster in Arizona that would rival the output of its Hsinchu facilities in Taiwan. The project is part of a broader rollout of 12 plants across the United States, including two new wafer fabs and two advanced‑packaging sites, with a total investment of roughly $500 billion. TSMC aims to bring capacity close to Taiwan‑level levels, targeting about 70% of U.S. fabless customers. Although U.S. operating costs are two to three times higher than in Taiwan, the move secures TSMC’s role in the global AI‑computing supply chain.
Week 14, 2026
The semiconductor industry is riding a multi‑year AI‑driven expansion, with February 2026 sales growth, record 300 mm fab equipment spending, and a $360 billion Foundry 2.0 outlook. At the same time, upstream material shortages—particularly helium, naphtha, tungsten, and sulfur—are exposing new supply‑chain vulnerabilities....
Understanding the Different Types of Semiconductor Products
#Technology #Newsletter #Semiconductor #Manufacturing #Product NLOG-298 | Semiconductor And Beyond Newsletter | The Semiconductor Product Types: https://newsletter.chetanpatil.in/p/semiconductor-and-beyond-newsletter-298/
SiC Devices Power Next‑Gen Medium‑Voltage Solid‑State Transformers
Drew Baglino: "Medium voltage is the next frontier." "The latest SiC devices are more than a better switch. They are the foundation for solid-state transformers, or SSTs." #alwaysbecharging ⚡️⚡️⚡️ https://t.co/6ck5EnX9Sb
Silicon Photonics Market and Technology Report 2026
The Silicon Photonics Market and Technology Report 2026 highlights rapid growth in datacenter optical interconnects driven by AI workloads and the shift toward co‑packaged optics. It outlines a projected market size of roughly $12 billion by 2026, driven by expanding foundry...
Intel Intros New 16-Core Panther Lake CPU with Capable Arc B390 iGPU
Intel announced the Core Ultra X9 378H, a 16‑core Panther Lake processor that mirrors the X7 368H’s architecture but caps its turbo at 5 GHz, slightly below the X9 388H’s 5.1 GHz. It retains the Intel Arc B390 integrated GPU while stripping enterprise‑grade features such as vPro, AMT, and...
Intel's Upcoming 42-Core Nova Lake SKU Allegedly Upgraded to 44 Cores — New Config Frees up 6P+12E Tiles that Could...
Intel’s upcoming Nova Lake‑S desktop processor line has a leaked 44‑core SKU, replacing the previously announced 42‑core model by using two identical 8P+12E compute tiles. The change frees up 6P+12E tiles, which could be sold as lower‑priced, locked non‑K variants...
![[OFC 2026] Part 1 of 5: 300mm SiPh Foundry: Who Is Actually Ready?](/cdn-cgi/image/width=1200,quality=75,format=auto,fit=cover/https://substackcdn.com/image/fetch/$s_!FG3y!,w_256,c_limit,f_auto,q_auto:good,fl_progressive:steep/https%3A%2F%2Fsubstack-post-media.s3.amazonaws.com%2Fpublic%2Fimages%2F3201360a-f898-4593-8267-8cfc0766cc04_1280x1280.png)
[OFC 2026] Part 1 of 5: 300mm SiPh Foundry: Who Is Actually Ready?
At OFC 2026, Samsung, GlobalFoundries and NVIDIA each presented seven conference papers detailing their progress toward 300 mm silicon‑photonic (SiPh) foundry capabilities. The analysis highlights that the competition has moved beyond pure device performance to a broader contest of system‑level integration...
[OFC 2026] Part 1 of 5: 300mm SiPh Foundry: Who Is Actually Ready?
The OFC 2026 conference showcased seven papers from Samsung, GlobalFoundries and NVIDIA that dissect the state of 300 mm silicon‑photonic (SiPh) foundries. While the headline race to 200 Gbit/s per wavelength still dominates headlines, the papers reveal that success now hinges on...
From Silicon Chips to Integrated Systems: Industry Shift
#Technology #Blog #Semiconductor #Manufacturing #System BLOG-321 | The Semiconductor Shift From Silicon To System: https://www.chetanpatil.in/the-semiconductor-shift-from-silicon-to-system/
Opening the Door to More Efficient Orbitronic Devices
Researchers at North Carolina State University and an international team have unveiled a new technique to generate orbital currents using chiral phonons. The method transfers angular momentum from circularly vibrating atoms directly to electrons in non‑magnetic, inexpensive materials. Published in...
NVIDIA's Neural Texture Compression Cuts VRAM Use From 6.5 GB to 970 MB
NVIDIA unveiled Neural Texture Compression (NTC), an AI‑driven method that slashes GPU VRAM usage by up to seven times. In a GTC 2026 demo, the technology compressed a 6.5 GB texture set to just 970 MB while preserving visual fidelity. NTC replaces traditional...
Nvidia AI Tech Claims to Slash Gaming GPU Memory Usage by 85% with Zero Quality Loss — Neural Texture Compression...
Nvidia showcased Neural Texture Compression (NTC), an AI‑driven method that compresses game textures dramatically. In a demo, a scene that required 6.5 GB of VRAM with traditional block compression ran on just 970 MB using NTC, with no visible loss in image...
Linux 7.1 To Expose AMD Zen 6's AVX-512 BMM For Guest VMs
The Linux 7.1 kernel will include a patch that exposes AMD Zen 6’s new AVX‑512 Bit Matrix Multiply (BMM) instructions to KVM virtual machines. Zen 6’s ISA adds BMM and bit‑reversal operations, confirmed by recent Binutils, GCC and LLVM updates. The KVM patch...
Samsung Electronics Names KCTech, Wonik IPS Among Top Suppliers at 2026 Partner Day
Samsung Electronics held its 2026 Device Solutions Division Mutual Growth Cooperation Day, honoring 17 top suppliers for achievements in technology, cost efficiency and ESG performance. KCTech received the highest technology innovation award for advancing localized CMP equipment, while Wonik IPS...
The Latest News In Lithography
The U.S. Congress introduced the MATCH Act to tighten export controls on critical semiconductor manufacturing equipment, targeting entity‑based loopholes and allied asymmetry. Meanwhile, the Blue‑X consortium announced a shift to 3.1nm wavelength lithography, aiming to demonstrate a micro‑exposure tool within...
SEMI Appoints Mary Bischoping as Senior Director of Public Policy and Advocacy
SEMI announced Mary Bischoping as its new Senior Director of Public Policy and Advocacy, based in Washington, D.C. Bischoping will steer SEMI’s engagement with U.S. lawmakers on supply‑chain resilience, intellectual‑property protection, tax policy, and emerging technologies such as AI and...
Cohu Announces $30 Million Follow-On Orders for High-Performance Computing Test
Cohu announced two customers placed follow‑on orders worth $30 million for its Eclipse platform with active thermal control to test next‑generation high‑performance computing processors. The orders, to be delivered over the next few quarters, deepen Cohu’s footprint in the rapidly expanding...
ACM Research Introduces ACM Planetary Family Product Portfolio Structure
ACM Research announced a rebranding of its product line into the ACM Planetary Family, a process‑based portfolio organized around eight distinct series. Each series corresponds to a core step in semiconductor wafer and panel manufacturing, from cleaning to advanced packaging...
CEA-Leti, CEA-List and PSMC Collaborate to Integrate RISC-V and MicroLED Silicon Photonics Into 3D Stacking and Interposer for...
CEA‑Leti, CEA‑List and Powerchip Semiconductor Manufacturing Corporation (PSMC) announced a strategic partnership to fuse CEA‑List’s RISC‑V design expertise with CEA‑Leti’s silicon‑photonic microLED technology into PSMC’s 3D‑stacking and interposer platforms. The joint effort will embed short‑reach, high‑bandwidth optical links and customizable...
Infineon Launches TLVR Quad-Phase AI Power Module
Infineon Technologies has unveiled the TDM24745T, a quad‑phase power module built on its TLVR (trans‑inductor voltage regulator) architecture for AI‑focused data centers. The 9 × 10 × 5 mm³ device packs four power stages, a TLVR inductor and decoupling capacitors, achieving a current density above...
Intel Linux NPU Driver 1.32 Adds Wildcat Lake Support
Intel has launched Linux NPU Driver 1.32, adding official support for the upcoming Wildcat Lake platform in Core Ultra processors. The new driver mirrors the earlier IVPU kernel driver update, delivering user‑space components that interface with the accelerator hardware. It also drops the...
Memory Supply Chain Faces Growing Constraints, Market Unaware
The memory point is not the only interesting comment here, but we have had a range of supply chain chats on memory, and I don't think the market fully grasps what's coming. We are stacking constraints at this point. This...
OpenLight Pushes Photonic Integration as AI Networks Drive Optical Scaling
OpenLight unveiled a photonic design platform that lets customers create custom photonic integrated circuits using standard semiconductor design tools, with lasers integrated directly onto the chip. The model mirrors fabless semiconductor companies, aiming to bring silicon‑scale economies to optics and...
Peak Nano and Advanced Conversion Partner on DC-Link Capacitors for 800 V+ SiC EV Inverters
Peak Nano and Advanced Conversion have teamed up to co‑develop DC‑link capacitors tailored for 800 V+ silicon‑carbide (SiC) inverter systems in electric vehicles and other e‑mobility platforms. The solution pairs Peak Nano’s NanoPlex LDF film, which holds a dissipation factor below...
Modder Gets Intel Core 9 273PQE "Bartlett Lake" To Boot Windows 11 on Z790 Motherboard
A modder has successfully booted Intel’s Core 9 273PQE “Bartlett Lake” processor on a standard Z790 motherboard. The 12‑core, 24‑thread chip, originally sold only to industrial OEMs and lacking official BIOS support, previously stopped at POST. By modifying the motherboard firmware, the...
ST Introduces STripFET F8 MOSFET Series for Automotive
STMicroelectronics launched the Smart STripFET F8 MOSFET series targeting automotive power‑distribution and battery‑management applications. The first part, STL059N4S8AG, is a 40 V, 420 A N‑channel device with a record‑low 0.59 mΩ RDS(on) in a compact PowerFLAT 5×6 package. Its high thermal conductivity, 175 °C rating...
Intel Reportedly Planning Another CPU Price Increase in May Amid Massive Demand
Intel is preparing a third CPU price increase in May, following 10‑15% hikes in February and a further 15% rise in March. The cumulative adjustment aims for roughly a 30% premium over 2025 pricing and will affect both Core Ultra...
GMKtec Launches NucBox K17 Mini PC with Intel Core Ultra 5 226V
GMKtec unveiled the NucBox K17, a 127.5 mm square mini PC powered by Intel’s new Core Ultra 5 226V Lunar Lake processor built on a 3 nm TSMC node. The system delivers 97 TOPS of AI compute across CPU, Arc 130V iGPU and a dedicated NPU,...
TSMC to Bring 3nm Production to Second Japan Fab by 2028
Taiwan Semiconductor Manufacturing Co. (TSMC) will equip its second Japanese fab for 3 nm production starting in 2028, targeting a monthly output of roughly 15,000 12‑inch wafers. The plant joins an existing Japanese facility that began mass production in late 2024,...
Vishay Launches First 8mm SMD-4 Automotive MOSFET Driver for EV Systems
Vishay introduced the VODA1275, an automotive‑grade MOSFET driver housed in an 8 mm SMD‑4 package with a 600 CTI mold compound, targeting high‑voltage EV and HEV systems. The device offers industry‑leading 80 µs turn‑on time—three times faster than rivals—alongside 1260 V peak isolation...
MGC Raises Semiconductor Materials Prices 30% as Packaging Material Costs Rise
Japan's Mitsubishi Gas Chemical (MGC) announced a roughly 30% price increase across its electronic materials portfolio, including copper‑clad laminates, prepreg, and resin‑coated copper, effective April 1, 2026. The company attributes the hike to higher raw‑material costs, rising labor expenses, and increased...
🍪 TWiC: Samsung SiPho, Mobile Demand, Nvidia+Marvell, Intel Fab, Claude Leak, ++
Samsung unveiled its SiPho Foundry platform, marrying high‑bandwidth memory with silicon photonics on a 300 mm wafer, positioning it as a turnkey alternative to TSMC. Meanwhile, memory‑driven cost pressures forced MediaTek and Qualcomm to slash 4 nm mobile chip shipments by 15‑20 million...
AUROS Technology Targets Mass Supply of 1nm-Level Metrology Tools This Year
AUROS Technology is finalizing qualification of its ultra‑precision thin‑film thickness metrology system with a leading domestic chipmaker, aiming to begin mass production this year. The tool measures film thickness at angstrom‑level accuracy, supporting etching, deposition and CMP processes, and could...
DEEPX Expands NPU Partnership With Lotte Innovate After PoC Approval
DEEPX announced on April 2 that its DX‑M1 neural processing unit has cleared Lotte Innovate’s proof‑of‑concept validation, prompting the two firms to move into a mass‑production phase. Lotte Innovate selected the DX‑M1 for its strong computational performance, efficient thermal management and...
Tungsten Supply Risks Mount as China Controls Exports, Japan Cuts WF6 Output
The semiconductor industry is confronting a new supply bottleneck as China tightens export controls on tungsten, the raw material for tungsten hexafluoride (WF6) gas. Japanese WF6 producers, responsible for roughly 25% of global output, plan to cut production in the...
Snapdragon X2's Adreno X2-85 GPU Sees Driver Improvements For Linux 7.1
Rob Clark submitted a batch of MSM DRM driver changes for the upcoming Linux 7.1 merge window, targeting Qualcomm’s Snapdragon X2 laptop SoC. The updates bring preemption support, SKU detection with speed‑bin tables, and error fixes to the Adreno X2‑85 GPU, while the...
Realtek RTL8159 10GbE to USB 3.2 Adapters Sell for About $55 and Up
Realtek's RTL8159 10 GbE‑to‑USB 3.2 adapters have entered the market at prices ranging from roughly $45 to $80, making multi‑gigabit Ethernet accessible for laptops and small‑form‑factor PCs. The WisdPi WP‑UT9 retails for $79 (about $87 shipped to the US), while the XikeStor...
Mobilint Raises 70 Billion Won in Series C Funding
Mobilint announced a 70 billion won Series C round on April 1, backed by Praxis Capital Partners, POSCO Investment and K Partners. The funding will fuel development of next‑generation neural processing units, expand mass‑production capacity, and support global market entry. Mobilint’s AI chip portfolio...
Qualitas Semiconductor Signs 2nm Edge AI IP License Deal Worth 1.3 Billion Won
Qualitas Semiconductor announced a design‑IP license agreement for its 2‑nanometer gate‑all‑around (GAA) MIPI C/D‑PHY, valued at roughly 1.3 billion won—about 21% of its projected 2024 revenue. The license, granted to a U.S. edge‑AI semiconductor firm, runs through March 30 2025 and carries no...
FuriosaAI to Mass Produce Second-Gen AI Chip, Supply to Samsung SDS Cloud From July
FuriosaAI announced mass production of its second‑generation Renegade AI chip, targeting 20,000 units in 2024 after an initial 4,000‑unit run. The chip upgrades to HBM3E memory, boosting capacity to 72 GB and delivering up to 20 petaflops per rack. Samsung SDS will...
MiTAC Shows Servers with Next-Gen CPUs and Solidigm SSDs at NVIDIA GTC 2026
MiTAC unveiled a next‑generation G‑Series server at NVIDIA GTC 2026, pairing dual AMD EPYC “Venice” CPUs with NVIDIA RTX Pro 6000 and 4500 Blackwell GPUs. The chassis places GPUs and Solidigm D7‑PS1010 PCIe Gen5 SSDs at the front, while NVIDIA ConnectX‑8 delivers eight 400 GbE...
C-Hawk Expands Southeast Asia Manufacturing Capabilities and Capacity with New Malaysia and Vietnam Facilities
C-Hawk Technology announced the opening of two new manufacturing facilities in Southeast Asia—a 200,000‑square‑foot plant in Johor Baru, Malaysia, and a 96,000‑square‑foot site in Ho Chi Minh City, Vietnam. The Malaysian location expands precision‑plastic production and adds PFA tube‑bending, while the Vietnamese factory...
IBM Announces Strategic Collaboration with Arm
IBM announced a strategic collaboration with Arm to create dual‑architecture hardware that blends IBM’s enterprise‑grade reliability and security with Arm’s power‑efficient designs. The partnership targets AI and data‑intensive workloads, emphasizing virtualization, high‑availability, and ecosystem growth. By integrating Arm‑based software environments...
GigaIO Sells SuperNODE and FabreX AI Fabric to D-Matrix
GigaIO announced the sale of its SuperNODE platform and patented FabreX PCIe Gen 5 AI fabric to low‑latency inference specialist d‑Matrix. The deal concludes a year‑long partnership that integrated d‑Matrix’s Corsair accelerators into SuperNODE, creating the industry’s most scalable inference node. Along...
Cohu Announces $30M Follow-On Orders for High Performance Computing Test
Cohu announced two customers placed follow‑on orders worth $30 million for its Eclipse platform with active thermal control, targeting next‑generation high‑performance computing (HPC) processors. The deals include a PAICe Prescriptive software subscription valued at roughly $330 K in annual fees, aimed at...
PrismML Launches World’s First 1-Bit AI Model to Redefine Intelligence at the Edge
PrismML emerged from stealth to launch the world’s first commercially viable 1‑bit large language model, the 8‑billion‑parameter Bonsai 8B. Built on Caltech research and trained on Google v4 TPUs, the model delivers performance comparable to full‑precision 8B models while using...
Embedded World 2026: Boards and Modules (Part 3)
Embedded World 2026 showcased five new edge‑AI boards and modules aimed at industrial and IoT markets. Variscite’s VAR‑SMARC‑MX8M‑PLUS brings a 2.3 TOPS NPU and dual Gigabit Ethernet, while congatec’s Conga‑SMX95 pairs an NXP i.MX 95 CPU with a 2 TOPS eIQ Neutron accelerator...
The Epoch Brief - March 2026
Epoch AI’s March 2026 brief highlights three new Data Insights, including a 4.1× annual rise in AI chip memory bandwidth now at 70 million TB/s, and reveals that advanced packaging and high‑bandwidth memory, not logic dies, constrained chip production in 2025. A...
AMD Details Upcoming Zen 6 PQOS Extensions: Advanced Bandwidth and Privilege Controls
AMD released a technical document outlining three new PQOS ISA extensions for its upcoming Zen 6 microarchitecture: Global Bandwidth Enforcement (GLBE), Global Slow Bandwidth Enforcement (GLSBE) and Privilege‑Level Zero Association (PLZA). GLBE lets system software set L3 cache external bandwidth caps...