Hardware News and Headlines
Hardware News and Headlines
Hardware Pulse
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Manz Asia and Seiko Epson have formed a strategic partnership to develop Lab‑to‑Fab inkjet equipment for semiconductor manufacturing. The collaboration merges Epson’s high‑precision printhead technology with Manz’s equipment engineering and intelligent software, creating a product line that covers R&D, pilot, and mass‑production stages. The systems enable precise 2D and 3D deposition of conductive, photoresist, and functional inks for advanced packaging applications such as 2.5D/3D antennas and RFIC bonding layers. The joint solution aims to accelerate time‑to‑market and improve production efficiency across the semiconductor supply chain.
HyperLight Corp unveiled a 145 GHz packaged intensity modulator that delivers over 145 GHz electro‑optical bandwidth, enabling 448 Gbps per‑lane IMDD and 260 GBaud coherent links. The device is offered in O‑, C‑, L‑band configurations with a 1 µm pre‑order option, featuring a compact 0.8 mm...
Sunday Inc., a developer of a multifunctional home robot, announced a $165 million Series B financing round that lifted its valuation to $1.15 billion. The round was led by Coatue Management with participation from Bain Capital Ventures, Tiger Global, Benchmark and Conviction Partners....
Raymarine has broadened its marine cartography suite for anglers by launching LightHouse Charts GEN 2, adding Florida Marine Tracks, and introducing CMOR NEX GEN for its Axiom 2 Pro and XL displays. The new LightHouse version redraws three times faster...
Synopsys unveiled a refreshed hardware‑assisted verification (HAV) portfolio that adds new HAPS‑200 and ZeBu‑200 FPGA platforms and a suite of software‑defined enhancements. The 12‑FPGA systems double capacity over prior 6‑FPGA offerings and target data‑center AI training, inference, GPUs, and edge...
Apple is developing a foldable smartphone priced around $2,000, positioning it at the high end of the premium market alongside Samsung’s Galaxy Z Fold 7 and Google’s Pixel 10 Pro Fold. The device will feature an internal display roughly the size of an iPad...
Japanese semiconductor firm ROHM has launched online sales of three new silicon‑carbide (SiC) molded power modules: the TRCDRIVE pack, HSDIP20, and DOT‑247. The TRCDRIVE pack delivers 1.5‑times higher power density than conventional SiC modules and integrates a top‑mounted gate‑driver board...
JBL has launched the Live 780NC over‑ear headphones, featuring a refreshed design, longer battery life, upgraded Bluetooth connectivity and active noise cancellation. The standout upgrade is in‑app support for Auracast broadcasts, allowing iOS users to receive LE Audio streams despite Apple’s...
Smart home devices boost convenience and energy savings but are increasingly targeted by cybercriminals. Common flaws include weak default passwords, lack of updates, and unsegmented Wi‑Fi networks that let attackers move laterally. Recent incidents, such as a robot vacuum breach...
Sennheiser’s new BTA1 TV transmitter brings Auracast’s low‑latency, long‑range Bluetooth to any television, supporting HDMI ARC, optical, 3.5 mm and USB inputs. Bundled with the mid‑range HDR 275 headphones, the system offers a versatile, multi‑device listening experience for households. While the transmitter performs...
Nordic Semiconductor introduced a lifetime, flat‑rate firmware‑over‑the‑air (FOTA) and device‑management license within its nRF Cloud platform to help IoT makers meet the EU Cyber Resilience Act (CRA) requirements. The CRA, effective in 2027, mandates continuous security updates and auditability for...
Scintil Photonics unveiled the LEAF Light Evaluation Kit (EVK), enabling customers to test its single‑chip DWDM laser source for AI scale‑up networks. The LEAF Light chip promises up to 50% power reduction and lower latency compared with traditional single‑wavelength co‑packaged...
Emerson is positioning its test and measurement portfolio to serve semiconductor manufacturers establishing fabs and OSAT facilities in India. Leveraging its 2023 $8.2 billion acquisition of National Instruments, the company is already working with firms like Kaynes Semicon and offers a local...
Navitas Semiconductor introduced two 1200 V SiC MOSFET packages— a top‑side‑cooled QDPAK and a low‑profile TO‑247‑4LP— built on its 5th‑generation GeneSiC platform. The new TAP technology improves the RDSon×Qgd figure of merit by 35 % and raises the Qgd/Qgs ratio by roughly...
Nordic Semiconductor unveiled its first Neural Processing Unit (NPU) enabled system‑on‑chip, the nRF54LM20B, expanding its ultra‑low‑power edge AI portfolio. The integrated NPU accelerates TensorFlow Lite models up to 15 times faster than the Cortex CPU and delivers up to sevenfold...
congatec announced six new variants of its Ryzen AI Embedded P100 Series COM Express 3.1 Type 6 Compact modules, expanding core counts from four to twelve and graphics units from two to sixteen. The modules leverage 4‑nm Zen 5/5c CPUs, RDNA 3.5 GPUs...
iQOO launched the Z11x 5G in India, a mid‑range smartphone starting at ₹18,999. It features a massive 7200 mAh battery, MediaTek Dimensity 7400 Turbo chipset, and a 6.76‑inch 120 Hz Full HD+ display. The phone also offers MIL‑STD‑810H, IP68/69 water‑dust resistance and up to...
Meta Platforms announced a rapid rollout of four custom AI accelerators—MTIA 300, MTIA 400, MTIA 450 and MTIA 500—targeted for deployment by the end of 2027. The MTIA 300 is already powering smaller‑model training for ranking and ad recommendation, while the MTIA 400 has cleared lab...
Intel confirmed it will not spin off its Network and Edge (NEX) unit, reaffirming its commitment to the 5G/6G RAN market with the Granite Rapids processor. The decision follows a $7 billion funding infusion from Nvidia and SoftBank that helped the...
ASRock Industrial unveiled a new line of industrial motherboards that support AMD EPYC 4005/4004 and Ryzen 9000/8000/7000 series processors. The portfolio spans ATX (IMB‑A1700), Micro‑ATX (IMB‑A1302) and Mini‑ITX (IMB‑A1002/ A1003) platforms, each featuring DDR5 memory, PCIe Gen5 expansion, and multi‑display...
Aerowash has been awarded a multi‑year leasing contract by International Airlines Group to provide aircraft‑washing robots for British Airways at London Heathrow. The deal follows a competitive tender and will see several automated washers deployed across BA’s Heathrow operations. CEO...
ASUS has expanded its ROG Strix OLED lineup with three new 27‑inch QHD monitors: the WOLED‑based XG27AQDMG Gen2, the 280 Hz QD‑OLED XG27ACDMS, and the entry‑level QD‑OLED XG27AQDMES. The models share a 0.03 ms response time, factory calibration, and adaptive‑sync support, but differ...
AMD is reportedly developing a new graphics feature set called FSR Diamond for Microsoft’s upcoming Xbox platform, rumored as Project Helix. Unlike previous FidelityFX Super Resolution iterations, FSR Diamond is said to bundle AI‑assisted upscaling, frame generation, neural rendering and...
MSI has added two Intel 800 series motherboards to its portfolio, the PRO Z890‑S WIFI6E W ATX board and the B860M GAMING PLUS WIFI6E micro‑ATX board. The PRO model features a white PCB, multiple full‑length PCIe slots, Wi‑Fi 6E, 2.5 GbE Ethernet and 20 Gbps USB‑C, positioning it as a...
Rambus unveiled HBM4E, the latest high‑bandwidth memory that doubles HBM4’s data rate to 16 Gbps per pin, delivering up to 24.6 TB/s aggregate bandwidth across a six‑device stack. The new standard retains HBM’s low‑power, low‑latency characteristics while expanding channel count to 32...
Arm and NVIDIA unveiled an offline, real‑time voice AI pipeline on the DGX Spark platform, combining the faster‑whisper speech‑to‑text engine with the vLLM large‑language‑model server. The heterogeneous design assigns latency‑critical transcription to Arm Cortex‑X/A CPU cores while the GPU handles...
The Serial Wire Debug (SWD) protocol offers a two‑pin alternative to traditional JTAG, delivering high‑speed debug access for Arm Cortex‑M based SoCs. By using a single clock (SWCLK) and a bidirectional data line (SWDIO), SWD halves the pin count while...
Edge AI is reshaping device design by making power and thermal constraints primary, not optional, considerations. Engineers must build hardware architectures from the ground up and adopt a hardware‑software‑model co‑design approach to meet milliwatt budgets and fanless thermal envelopes. Memory...
The article outlines three AI‑focused data‑center scaling models—scale‑up (in‑rack, latency‑centric, copper‑based), scale‑out (inter‑rack, jitter‑centric, RDMA and optical), and the newer scale‑across (cross‑data‑center, long‑distance congestion management). It details how each approach uses distinct interconnect strategies and resource allocation methods, and cites...
Synopsys customized its Foundation IP to enable an ultra‑low‑voltage (0.4 V) optical networking chip designed for edge AI workloads. The team created a new memory compiler, added dual‑rail voltage support, and applied power‑gating and low‑leakage cells to meet aggressive power‑performance‑area (PPA)...
NXMind, backed by Dreame, announced that its Tianqiong chip series has entered mass production and will be integrated across Dreame’s home‑robot lineup. The heterogeneous system‑on‑chip combines a multi‑core CPU, dedicated NPU and microcontroller to enable real‑time LiDAR, vision fusion and...
German equipment maker Volkmann GmbH has partnered with HP Additive Manufacturing Solutions to launch the vPort powder handling system for HP’s Metal Jet S100 binder‑jet printers. The semi‑automated solution combines Volkmann’s PowTReX technology with a glove‑box interface, offering sieving, recovery...
Global PC manufacturers announced price increases of 5%‑10% as semiconductor shortages and higher freight costs persist. The hikes hit both consumer and enterprise segments, squeezing budgets for schools and businesses. Taiwan, home to major chip fabs and motherboard producers, faces...
Summit Technology Group unveiled AirLux Studio Signaling, a network‑based on‑air light replacement that uses PoE‑powered touchscreen displays. The platform integrates natively with Axia Livewire consoles, automatically reflecting status cues such as On‑Air, Recording, or Production in Progress. A centralized web...
Swarco secured a €24 million long‑term contract with Austrian motorway operator Asfinag to upgrade the country’s variable message signage. Over the next ten years the company will install and service up to 2,100 LED displays, with the first units rolling out...
Malaysia is set to develop a hyperscale data centre in Gelang Patah, Johor, aimed at bolstering the nation’s digital economy. The project will pursue the top GreenRE sustainability rating by employing reclaimed water for cooling and integrating substantial solar generation....
Researchers at Chalmers University have demonstrated precise control of electron spin by stacking a perpendicular magnetic layer with a topological van der Waals material. The heterostructure switches magnetization using very small electrical currents and operates at room temperature without external magnetic fields....
Android smartphones in 2026 will be defined by AI‑native hardware, on‑device intelligence, and a suite of new hardware innovations. Chipmakers are rolling out processors built for machine‑learning, while AI agents inside apps start performing tasks autonomously. Battery life jumps to...
IDS Imaging Development Systems and Prophesee have signed a Letter of Intent at Embedded World to deepen their partnership and create next‑generation industrial vision systems that fuse conventional imaging with Prophesee’s Metavision® event‑based technology. The expanded collaboration builds on the...
The AI hardware crunch is expanding as server CPUs join the long‑running GPU shortage. Intel now reports six‑month lead times for key server chips, while AMD’s lead times have stretched to ten weeks and prices in China have risen over...
Ukrainian drone and defense firms are rapidly localizing component production, now achieving 80‑90% domestic content for first‑level parts and aiming for 100% on‑shoring of critical systems. Companies such as The Fourth Law and Unwave are building a semiconductor fab to...
SpaceBridge is set to unveil UniHub at SATShow 2026, a software‑defined, modular VSAT hub packaged in a compact 3RU enclosure. The all‑in‑one solution promises up to five‑fold performance gains over the legacy ASAT‑II architecture and dramatically faster field deployment. CEO...
Researchers at UCSD and Rutgers have demonstrated a neuromorphic computing platform built from proton‑doped perovskite nickelate (NdNiO3) devices. By integrating symmetric and asymmetric junctions on a single wafer, the system combines ultrafast proton‑mediated dynamics with multilevel resistance memory, achieving nanosecond...
Windows 11’s built‑in HDR handling often produces washed‑out colors and banding when displaying SDR content, prompting users to seek fixes. Microsoft’s free HDR Calibration app lets users adjust luminance settings, improving desktop and browser visuals. For gamers with Nvidia GPUs,...
Plasma TVs dominated the high‑end market in the early 2000s thanks to superior contrast, wide viewing angles, and wall‑mountable designs. Their gas‑filled pixel chemistry, however, required large glass panels, generated significant heat, and consumed more power than emerging LCDs. Rapid...
Xscape Photonics closed a $37 million extension to its Series A, bringing total Series A funding to $81 million and doubling its valuation. The round, led by Addition with participation from IAG Capital Partners and NVIDIA, funds the rollout of FalconX, the first fully...
SK keyfoundry has completed a silicon‑carbide (SiC) planar MOSFET process platform covering 450‑2300 V, achieving over 90 % yield and high reliability. The firm demonstrated the technology with a 1200 V MOSFET order from a new SiC design customer, targeting industrial equipment thermal‑efficiency...
Chinese manufacturer TCL’s RayNeo Air 4 Pro AR/XR smart glasses are now on sale for $249 on Amazon, a $50 discount from the original $299 launch price. The device projects a 201‑inch HDR10 virtual screen with 120 Hz refresh, allowing users...
The article reviews liquid‑cooling technology as it moves from high‑end transmitters and particle accelerators into broadcast and consumer‑grade equipment. It contrasts anti‑freeze pumps for FM transmitters with deionized‑water loops used in megawatt‑scale systems, and highlights all‑in‑one (AIO) PC coolers as...
Milwaukee Tool is set to release a new M18 and M12 Four Bay Simultaneous Super Charger that can replenish up to four batteries to 100 % in roughly 90 minutes, a claim of up to ten times faster than conventional chargers....
