The EU Wants Its Own Tech Supply Chain
On 3 June the European Commission unveiled a sweeping Tech Sovereignty Package that includes the revised Chips Act 2.0, a Cloud and AI Development Act, an open‑source strategy and an energy‑system roadmap. Chips Act 2.0 adds demand‑side incentives and fast‑track funding for a 3 nm open‑access foundry, aiming to lift EU semiconductor share toward 20% by 2030. The Cloud and AI Act seeks to triple EU data‑center capacity by the early 2030s and introduces tiered “assurance levels” for data residency. The open‑source plan targets the €264 bn (≈$288 bn) public‑IT spend currently dominated by U.S. vendors, while the whole package still faces parliamentary scrutiny and lobbying pressure.
Cornelis and NextSilicon to Build Joint Reference Architectures for AI and HPC
Cornelis and NextSilicon announced a joint effort to develop reference architectures that combine Cornelis’s CN5000 400 Gbps congestion‑free fabric with NextSilicon’s Maverick‑2 dataflow accelerator. The partnership, unveiled at ISC High Performance 2026, seeks to validate the combined solution across configurations and...
Electronic Design Automation Market Size Worth $43.07 Billion by 2034
Polaris Market Research projects the global Electronic Design Automation market to expand from $20.93 bn in 2026 to $43.07 bn by 2034, reflecting a 9.4% compound annual growth rate. The surge is fueled by escalating chip complexity, AI‑enhanced design tools, booming automotive...
Nvidia Unveils Vera Rubin Platform Targeting AI, HPC Infrastructure
Nvidia launched the Vera Rubin platform, a rack‑scale system that fuses its new Vera CPUs with Rubin GPUs, NVLink‑C2C interconnects, ConnectX‑9 SuperNICs and BlueField‑4 DPUs. The architecture can house up to 144 GPUs per rack, delivering more than seven exaflops...
CEA-Leti Scales Ferroelectric RAM to 22nm Node
CEA‑Leti announced a 3‑D ferroelectric capacitor architecture that scales embedded FeRAM to the 22 nm node, delivering cell sizes 2.5 times smaller than conventional SRAM and matching the density of 10 nm SRAM. The vertical HZO‑based capacitors operate at just 1.3 V and exhibit...
ASML Rejects EUV Allegation: No Lithography System or Special Components Delivered to China
ASML issued a forceful denial that it has delivered any extreme‑ultraviolet (EUV) lithography system or specially‑designed EUV components to China. The clarification follows a Bloomberg report suggesting US officials feared a breach of Western export controls. ASML stressed that neither...
Rapidus Completes 150 Billion Yen Funding Round From Japan Government
Rapidus Corporation announced the completion of a 150 billion‑yen (US$943 M) funding round from the Information‑Technology Promotion Agency (IPA), a Japanese government agency. The round brings Rapidus’s total funding to 424.95 billion yen, supporting its goal to launch 2nm logic semiconductor manufacturing by...