Today's Semiconductors Pulse
Analyst Flags Intel’s $200+ P/E as Overvalued Amid AI Hype
Analyst Gil Luria says Intel’s valuation, trading above a 200‑times price‑to‑earnings multiple, is out of step with the AI cycle and may be overstated. He notes Intel’s Q1 FY2026 revenue rose 7.2% to $13.58B but execution risk remains high, and points to Nvidia, AMD, Broadcom and Micron as lower‑multiple alternatives with stronger near‑term upside.
Also developing:
By the numbers: SiPearl raises $37M Series A
Metasurface Enables Supersensitive, Superfast Thermal-Based Photodetector
Researchers at Duke University have created a metasurface‑enhanced pyroelectric photodetector that operates at a record‑breaking 3‑dB bandwidth of 2.8 GHz, equivalent to a 125 picosecond rise time. The device uses an ultra‑thin array of silver nanocubes atop a gold mirror, separated by a 10 nm Al₂O₃ layer, to trap light via plasmonic resonance and convert heat into an electric signal. It requires no external power, works at room temperature, and delivers competitive responsivity with a noise‑equivalent power as low as 96 pW/√Hz. The approach promises integration into on‑chip systems across the visible and infrared spectrum.
China Actively Targeting Taiwan's Chip Talent and Technology, Security Report Says
Taiwan’s National Security Bureau warned that Beijing is intensifying efforts to lure semiconductor engineers and intellectual property from the island. The campaign targets senior chip designers, researchers, and supply‑chain specialists with attractive salaries and research grants. By siphoning talent, China...
Anthropic Signs Massive Deal with Google and Broadcom for More Compute as Devs Hit Limits
Anthropic has struck a multi‑year, multi‑billion‑dollar partnership with Google Cloud and Broadcom to dramatically expand its compute capacity. The deal will provision roughly 10,000 new TPUs and custom Broadcom AI chips, allowing the company to lift the recent restriction on...
Infineon Launches Digital Controller for 800V AI Server Power Systems
Infineon Technologies introduced the XDPP1188-200C digital power controller, aimed at 800‑volt AI server power architectures in data centers. The device enables conversion from 48 V to lower rails and from ±400 V/800 V DC to 48 V, 24 V, or 12 V, reducing bus‑bar losses and...
Anthropic Signs Multi-Gigawatt TPU Deal with Google and Broadcom
Anthropic has struck a multi‑gigawatt TPU agreement with Google and Broadcom, with the hardware slated to be deployed in the United States beginning in 2027. The deal reflects surging demand, as the company’s annualized revenue now tops $30 billion, up from...
ACM Research Unifies Product Portfolio as ACM Planetary Family
ACM Research announced the ACM Planetary Family, a unified branding that reorganizes its equipment into eight process‑aligned series covering cleaning, advanced packaging, electroplating, furnace, track, PECVD, panel‑level packaging, and polishing. The new structure reflects the company’s evolution from a single...
IVWorks Raises $4.5m to Expand reGaN Technology Into RF and AI Power Semi Markets
IVWorks Co Ltd, a South Korean GaN wafer maker, secured $4.5 million in new funding, raising its total investment to $33 million. The capital will expand its proprietary reGaN selective‑area regrowth technology into E‑band and W‑band RF markets and AI‑focused power‑delivery applications....
IIT-M Pravartak, Maven Silicon Launch Semiconductor Certification Programmes
IIT‑M Pravartak Technologies Foundation has teamed up with Maven Silicon to roll out two nine‑month semiconductor certification programmes covering VLSI design and verification as well as embedded systems design. The curriculum blends online instruction, hands‑on laboratory work, and industry‑focused capstone...
The Specialty Device Surge Part 2: The Process Control Challenges Of MEMS, Co-Packaged Optics, And More
The second installment of the Specialty Device Surge series highlights how MEMS, CMOS image sensors, SiC/GaN power devices, and co‑packaged optics are confronting unprecedented process‑control hurdles as wafer sizes expand to 300 mm. Each device family relies on unique materials—piezo films,...
Enhancing Silicon Reliability With In-System Test And SLM Data
The semiconductor industry is leveraging in‑system test (IST) and Silicon Lifecycle Management (SLM) data to boost chip reliability across design, manufacturing, and field operation. Traditional DFT methods such as ATPG, scan chains, and BIST remain core, but embedded monitors and...
Kandou AI Raises $225M in Series A Funding
Swiss fabless startup Kandou AI secured a $225 million Series A round led by Maverick Silicon, with SoftBank, Synopsys, Cadence and Alchip participating. The funding will accelerate production of its Copper MIMO (chord signaling) chips that aim to double data‑rate capacity while slashing...
Intel Nova Lake to Use Xe3 Graphics, AX High-End Variant Cancelled
Intel’s upcoming Core Ultra 400 "Nova Lake" CPUs will ship with existing Xe3 graphics rather than the anticipated Xe4 architecture, while higher‑tier models will receive an enhanced Xe3P variant. The company also cancelled the high‑end AX SKU for this generation,...
Samsung Sees Massive 600 Percent Q1 Profit Surge as DRAM Market Tightens
Samsung Electronics is projected to post a record Q1 2026 operating profit of about $23.7 billion, a 600% year‑over‑year increase driven by a tightening DRAM market. The semiconductor division’s gross margin surged to roughly 80%, up from 15% a year earlier, as...
Archer Materials Advances Silicon Biochip Beta Prototype While Reaffirming Graphene as Next‑generation Platform
Archer Materials announced that its Stage 1 biochip project with IMEC is complete and the company is moving to a silicon‑based beta prototype. The prototype will combine a functionalized potassium sensor with cartridge engineering, microfluidics, and readout electronics for external validation....
Broadcom Secures Expanded AI Chip Deals, Shares Surge
Only good news for $AVGO I will post my scorecard soon. Broadcom agrees to expanded chip deals with Google, Anthropic - Broadcom said it agreed to produce future versions of Google's artificial intelligence chips, - The company also announced an expanded deal with Anthropic,...
Air Liquide Launches Advanced Materials Plant in Taiwan – Just Now, the Chemistry Behind AI Chips Is Becoming a Strategic...
On March 25, 2026 Air Liquide inaugurated its first large‑scale advanced materials plant in Taichung, Taiwan, dedicated to deposition and etch chemicals essential for sub‑2 nm semiconductor nodes. The facility focuses on atomic‑layer‑deposition precursors needed for AI and high‑performance‑computing chips. The launch...
SK Hynix Links Its Record Order From ASML to Its Plans for a U.S. Stock Market Listing, Sending a Pretty...
SK hynix announced an 11.95 trillion‑won (≈ $7.97 bn) order for ASML EUV lithography tools, the largest publicly disclosed single ASML customer deal. The machines will equip the new Yongin semiconductor cluster and the M15X site in Cheongju, supporting HBM4 and advanced 1c‑nm DRAM...
Nvidia’s RTX 50 SUPER Refresh Continues to Face Delays, and Even the RTX 60 Could Be Pushed Back Further
Rumors in early 2026 indicate NVIDIA has postponed the mid‑cycle RTX 50 SUPER refresh originally expected at CES 2026, and the mass‑production timeline for the next‑generation RTX 60 series may shift from late 2027 to 2028. The delays stem from tight GDDR7 memory supplies, which...
Renesas Rad-Hard ICs Aboard NASA’s Artemis II
Renesas Electronics’ radiation‑hardened integrated circuits are aboard NASA’s Artemis II mission, which launched on April 1 from Kennedy Space Center. The Intersil‑branded rad‑hard ICs are embedded in Orion’s avionics and the Space Launch System, managing power distribution, signal integrity and onboard computing...
Semiconductors Demand Trillion‑scale Cleanliness Beyond Human Vision
#Technology #Thread #Semiconductor #Manufacturing #Trillion The Semiconductor Visualizing Trillion: 1/ - I Was Once Asked How Small A Contaminant Has To Be To Ruin A Chip. - My Answer: "Smaller Than A Speck Of Dust And A Million Times More Invisible." - That Is...
EPC Expands Portfolio of 100V Integrated GaN Power Stage ICs
Efficient Power Conversion (EPC) has launched a 100 V GaN power‑stage IC family—EPC23108, 23109, 23110 and 23111—targeted at high‑performance motion and power‑dense platforms such as humanoid robots and drones. Each device integrates high‑side and low‑side eGaN FETs, gate drivers and level‑shifting...
Texas Instruments Leverages Analog Chip Strength as AI Hype Swells
Texas Instruments announced it will limit capital spending to $2‑5 billion annually after a $4.7 billion outlay in 2025, while free cash flow surged 96% to $2.9 billion. The move underscores the company’s bet on analog chips that power AI servers, reinforcing its...
Sivers Announces 5G/6G ICs
Sivers Semiconductors has launched the Daybreak 7‑15 GHz beamforming ICs, now generally available for emerging 5G‑Advanced and 6G FR3 applications and defense arrays. The chips deliver industry‑leading broadband transmit power, high efficiency and a low receiver noise figure, while supporting external...
£10.4m UK Project Will Grow Next-Gen Materials
The UK’s Engineering and Physical Sciences Research Council has awarded £10.4 million to a five‑year EXPRESS programme led by the Universities of Warwick and Southampton. The project will develop electrochemical electrodeposition techniques, guided by bespoke precursor chemistry, to grow high‑quality transition...
Silvaco Announces SiC Partnership with APEC
Silvaco Group announced an expanded strategic partnership with Taiwan‑based Advanced Power Electronics Corp. (APEC) to deepen the use of its Victory Device, Gateway, and SmartSpice solutions. APEC will deploy these tools across its silicon and silicon‑carbide (SiC) product lines, aiming...
Onsemi Powers Sineng's Solar and Energy Storage Systems
Onsemi’s latest hybrid power integrated modules, combining FS7 IGBTs with EliteSiC diodes in an F5BP package, have been selected for Sineng Electric’s next‑generation 430 kW liquid‑cooled string energy storage system and its 320 kW utility‑scale solar inverter. The modules deliver up to...
EPC Space Adds Half-Bridge Buck Platforms
EPC Space introduced two new eGaN half‑bridge buck evaluation boards, the EPC7C010 and EPC7C011, targeting aerospace and industrial power applications. The EPC7C010 delivers 100 V/20 A at up to 94.7% efficiency, while the EPC7C011 offers 200 V/10 A with a peak 96.6% efficiency. Both...
UK Semiconductor Centre Appoints Two New Directors
The UK Semiconductor Centre (UKSC) has hired Martin O’Sullivan as Director of Investment and Steve Taylor as Director of Strategic Marketing. O’Sullivan, a PhD‑trained semiconductor physicist with a background in equity research and capital markets, will streamline investor relations and...
Tiny Laser Array Could Offer Faster, Greener Indoor Wireless
British researchers have built a sub‑millimetre chip that integrates a 5 × 5 infrared VCSEL array with custom beam‑shaping optics, creating a compact optical wireless transmitter. Individual lasers deliver 13‑19 Gbps, and together they achieve a record‑breaking 362.7 Gbps over a two‑metre free‑space link....
Digital Twin Semiconductor Supply Chain Market to Reach $7.9 Billion by 2033
The Digital Twin Semiconductor Supply Chain market is forecast to reach $7.9 billion by 2033. Growing demand for end‑to‑end visibility, faster time‑to‑market and resilient operations is driving adoption across the industry. Digital twins provide real‑time simulation, predictive analytics and process automation,...
SmartRay Sensor Unites ECCO X Innovations with High-Precision Glass Inspection Capabilities
SmartRay unveiled the ECCO X 050G sensor, extending its ECCO X family with high‑resolution inline metrology for glass, reflective and transparent surfaces. The sensor delivers up to 40 kHz scan rates, 2.2–2.9 µm vertical and 11–13 µm lateral resolution, and generates 163 million 3‑D points per second...
Quantum Diamonds Expands to Asia
QuantumDiamonds announced the launch of a new regional hub in Taiwan, marking its first major foothold in Asia. The company appointed Peter Lemmens, a veteran with over 25 years in semiconductor leadership, to spearhead commercial and technical operations across the...
CEA-Leti and Fraunhofer IPMS Validate Wafer Exchange for Ferroelectric Memory Materials
CEA‑Leti and Fraunhofer IPMS have successfully demonstrated a wafer‑exchange pilot line for hafnium‑zirconium‑oxide ferroelectric stacks, proving that complex material stacks can be processed across multiple advanced fabs without contamination. The program used 300 mm CMOS cleanrooms, standardized VPD‑ICP‑MS and TXRF checks,...
Imec Names NVIDIA's Jensen Huang as Recipient of the 2026 Imec Lifetime of Innovation Award
Imec announced that Jensen Huang, founder and CEO of NVIDIA, will receive the 2026 imec Lifetime of Innovation Award. The award honors Huang’s pivotal role in creating the programmable GPU, which has evolved from gaming graphics to the core engine...
Keysight Introduces Hands-On Semiconductor Teaching Labs for Universities
Keysight Technologies unveiled three semiconductor teaching lab solutions—Basic Design and Measurement, Parametric Test and On‑Wafer Measurement, and Photonics IC Measurement—to give university students hands‑on experience with professional‑grade tools. The kits replicate real‑world test workflows, letting students set up equipment, perform...
Nordson Electronics Solutions to Demonstrate Automated Fluid Dispensing and Plasma Treatment Systems
Nordson Electronics Solutions will demonstrate its ASYMTEK Vantage fluid dispensing system with a new Class‑100 cleanroom configuration at Productronica China. The company will also showcase the stand‑alone MARCH FlexTRAK plasma system, which provides high‑throughput surface treatment in a compact footprint....
Metallic Oxide Semiconductor Field Effect Transistor Market to Surpass $15.5 Billion by 2033
The global metallic oxide semiconductor field‑effect transistor (MOSFET) market is projected to exceed $15.5 billion by 2033, driven by surging demand for energy‑efficient consumer electronics, electric vehicles, and renewable‑energy systems. Wide‑bandgap silicon‑carbide and gallium‑nitride technologies are accelerating performance gains, while miniaturization...
Broadcom to Build Custom TPUs for Google AI Racks
Broadcom $AVGO just said it has entered into a long term agreement with Google $GOOGL "for Broadcom to develop and supply custom Tensor Processing Units (“TPUs”) for Google’s future generations of TPUs and a Supply Assurance Agreement for Broadcom to...
Questioning Chip's Role Replacing Marvell Backend for TPU
Wasn’t this the chip that supposedly was going to replace $MRVL back end design for TPU?
Automotive Semiconductor Shifts & AI Workloads | TechInsights AWS Seminar
TechInsights hosted a data‑driven seminar for AWS automotive teams, highlighting a decisive shift from distributed electronic modules to centralized compute architectures in vehicles. The briefing detailed how high‑performance automotive SoCs, expanding memory bandwidth, and silicon‑carbide power devices are reshaping AI...
AMD‑Arm 2014 Opteron A1120 Packs Eight Cortex
I finally got one. @AMD x @Arm in 2014. Opteron A1120, aka AMD Seattle Up to 8x Cortex-A57, 4MB L2, 8MB L3 128-bit DDR3/4-1866 PCIe 3.0 x8 and 2x10GbE https://t.co/w08sMceEPB
Broadcom Expands AI Chip Deal with Google, Anthropic
Broadcom to Supply AI Chips to Google, Computing Capacity to Anthropic in Expanded Collaboration https://t.co/yHCXipodGy
Hong Kong: Secure Edge AI with Compute-in-Memory Innovation
University of Hong Kong researchers unveiled a Co‑Located Authentication and Processing system that merges compute‑in‑memory with hardware‑based security using memristors. The architecture eliminates the von Neumann bottleneck, delivering a 146‑fold boost in energy efficiency and an 18‑fold reduction in chip area...
Apple’s Chips Reshape Tech, Windows Remains Biggest Win
Apple's chips are the core of a new landscape, but its biggest win is Windows https://t.co/4r2S3X5l3x https://t.co/cZkkMSXv99
Andreessen Predicts Years‑long Chip Shortage, Investors Weigh Timing
Marc Andressen says there's going to be chip shortages for years to come. Tempted to buy 2377 TT but how do you time it https://t.co/mmAb7yVsW1
European Chips Skills Academy Launches the ECSA Learning Platform
The European Chips Skills Academy (ECSA) has launched the ECSA Learning Platform, a free digital hub offering more than 60 introductory to intermediate semiconductor courses. Developed with industry and academic partners, the platform integrates a Knowledge Hub, community collaboration spaces,...
Predicting XPUs: Once Mocked, Now Inevitable GPU‑only World
I remember so many people thinking I was nuts to suggest that years ago that XPUs would be successful and that it would be a GPU-only world.
Semiconductor-Based Quantum Pilot Line ‘SPINS’ Launched with EU Support
The EU has launched the €50 million SPINS pilot line, one of six quantum pilot facilities created under the Chips Act. Coordinated by imec, SPINS unites 25 RTOs, industry players and universities to develop semiconductor‑based spin‑qubit chips. The initiative targets three...
Stitching Precise Patterns – With Lasers
University of Pittsburgh engineers have devised a laser‑induced graphene (LIG) manufacturing method that uses an iron‑oxide ink layer to precisely control graphene formation on polymer films. The technique enables tunable electrode thickness and conductivity, and can create graphene on either...
IVWorks Secures $4.5M Funding to Expand ‘reGaN’ Technology Into RF and AI Power Semiconductor Markets
IVWorks announced a $4.5 million financing round, bringing its total capital raised to $33 million, to accelerate deployment of its proprietary reGaN technology. The company will use the funds to scale mass‑production infrastructure and secure its supply chain for GaN epitaxial wafers...