Today's Semiconductors Pulse
Intel and Nvidia to launch integrated CPU‑GPU SoCs in early 2028
Intel and Nvidia have confirmed a joint effort to produce x86 system‑on‑chips that combine Intel CPU cores with Nvidia RTX GPU chiplets. The first products are slated for early 2028, potentially unveiled at CES. They will be fabricated on TSMC’s N3P process, feature LPDDR6 memory and use Nvidia’s upcoming Rubin architecture.
Fujitsu Plans Dedicated 1.4nm AI Chip Manufactured Entirely in Japan by Rapidus — AI Chip to Be Designed and Manufactured...
Fujitsu announced plans to develop a dedicated AI inference NPU using Rapidus' 1.4 nm process, with an estimated development cost of ¥58 billion (about $363 million). The project, funded roughly two‑thirds by the New Energy and Industrial Technology Development Organization, will be designed and manufactured entirely in Japan and integrated with Fujitsu’s Arm‑based Monaka CPUs. Rapidus aims to start 1.4 nm production around 2029, marking its second domestic order after Canon. The initiative aligns with Japan’s broader push for sovereign AI hardware and data security.
RISC-V Now! — Where Specification Meets Scale!
RISC‑V Now! is a Silicon Valley conference designed to turn the open RISC‑V instruction set architecture into shipped products at scale. The event attracted roughly 600 semiconductor professionals from more than 250 companies, including industry giants such as Apple, Google,...
Kioxia Discontinues 2D NAND Products, Last Shipments to Be Made in 2028 — 1980s Planar NAND Memory Reaches End of...
Kioxia announced it will cease production of all 2D (planar) NAND flash and its third‑generation BiCS 3D NAND, with final shipments scheduled for December 31 2028. The phase‑out covers legacy 32nm, 24nm and 15nm planar nodes as well as early 64‑layer BiCS3...
Quantum Diamonds Expands to Asia
QuantumDiamonds GmbH announced Peter Lemmens as Managing Director Asia, coinciding with the launch of a new regional hub in Taiwan. The hire leverages Lemmens' 25‑year semiconductor leadership and deep Taiwan network to accelerate adoption of the company’s quantum‑diamond microscopy (QDM)...
Toradex OSM and Lino SoMs – 30×30mm NXP i.MX 93/i.MX 91 Modules with Solder-Down or B2B Connector Designs
Toradex introduced two ultra‑compact 30 × 30 mm System‑on‑Module families, OSM and Lino, built around NXP i.MX 91 and i.MX 93 processors for edge industrial and IoT use cases. OSM follows the OSM Size‑S standard with a 332‑ball LGA that is soldered directly to a...
Light Bends Perovskite Crystal Lattice, Opening Way to New Devices
Researchers at UC Davis have demonstrated that halide perovskite crystals undergo rapid, reversible lattice distortions when illuminated, a phenomenon termed photostriction. Using laser excitation and X‑ray probing, they showed the effect can be tuned by adjusting the crystal composition, light wavelength,...
Apple M5 Max MacBooks Are Getting Surprisingly Close to Real Gaming PCs
Apple’s latest M5 Pro and M5 Max chips are closing the performance gap with dedicated gaming PCs. Benchmarks by YouTuber Andrew Tsai show the M5 Pro delivering roughly 60 fps in upscaled 1440p on titles like Cyberpunk 2077, while the 40‑core M5 Max sustains similar frame rates...
AOI Receives New Order for 800G Data-Center Transceivers From Major Hyperscale Customer
Applied Optoelectronics Inc. (AOI) secured a volume order exceeding $53 million from a major hyperscale customer for 800‑gigabit single‑mode data‑center transceivers. The order supports AI‑driven GPU clusters and will be shipped between Q2 and mid‑Q3 2026 after product qualification. AOI’s CEO highlighted...
Nanya Raises $2.5 Bln, Signs DRAM Supply Deals with Kioxia and SanDisk
Nanya Technology raised roughly $2.5 billion via share sales and private placements to expand its DRAM production capacity. Kioxia invested T$15.6 billion for a 2 % equity stake and a long‑term DRAM supply agreement, while SanDisk committed T$31 billion and signed a multi‑year supply...
Intel Announces The "Optimization Zone"
Intel unveiled the Optimization Zone, a GitHub‑hosted repository that consolidates performance tuning guides and best‑practice recipes for Intel data‑center hardware. The hub currently includes optimization recipes for workloads such as Apache Kafka, Cassandra, Redis, and Spark, and provides BIOS tunables,...
T-Display-P4 Smartphone-Like Devkit Features ESP32-P4 MCU, ESP32-C6 Wireless SoC, and SX1262/LR2021 LoRa Transceiver
LILYGO has launched the T‑Display‑P4, a smartphone‑sized development kit that pairs the new ESP32‑P4 RISC‑V MCU with an ESP32‑C6 Wi‑Fi 6/BT 5.x module and optional SX1262 or LR2021 LoRa transceiver. The board offers a 4‑inch TFT or AMOLED screen, 2 MP camera, 32 MB...
Samsung Electronics Launches Silicon Photonics Foundry Business
Samsung Electronics' foundry division announced its entry into the silicon photonics market, unveiling a roadmap that moves from photonic integrated circuits (PICs) this year to optical engines in 2027 and turnkey co‑packaged optics (CPO) by 2029, with a next‑generation CPO...
LG Chem Targets 2 Trillion Won in Semiconductor and Automotive Electronics Materials Revenue by 2030
LG Chem announced a plan to double its semiconductor and automotive electronics materials revenue to 2 trillion won (about $1.5 billion) by 2030, up from roughly 1 trillion won today. The company created a new advanced R&D unit under its Advanced Materials Research Institute to...
Three-in-One Diode Integrates Sensing, Memory and Processing for Smart Cameras
Researchers at the University of Science and Technology of China have created a single semiconductor diode that simultaneously senses light, stores data and performs processing. By inserting an aluminum‑gallium‑nitride layer into a GaN p‑n junction, the device can switch among...
Photonic Chip Packaging Can Withstand Extreme Environments
NIST researchers have introduced hydroxide catalysis bonding (HCB) as a new packaging method for photonic integrated circuits, replacing traditional polymer adhesives with a glass‑like inorganic bond. The HCB‑packaged chips survived cryogenic temperatures, intense ionizing radiation, high‑vacuum conditions, and rapid thermal...
Researchers Demonstrate Laser Chips Performing Clock and Quantum Operations
Researchers at UC Santa Barbara and UMass Amherst have built a chip‑scale, visible‑light Brillouin laser that can be frequency‑stabilized to the narrow strontium optical‑clock transition and used to drive a trapped‑ion qubit. The integrated laser, paired with an on‑chip coil...
Rogue Valley Microdevices Launches MEMS Design Services
Rogue Valley Microdevices (RVM) announced the launch of MEMS Design Services, a foundry‑flexible offering that supports customers from concept through production‑ready design. The service provides three engagement models—Design only, Design with technology transfer, and full Design‑and‑Fabricate within RVM’s own fab—allowing...
New £10.4M Project to Grow Next-Generation Semiconductor Materials
The UK’s EXPRESS programme, a five‑year, £10.4 million EPSRC‑funded initiative led by the Universities of Warwick and Southampton, will develop next‑generation transistor and optoelectronic devices using transition metal dichalcogenides (TMDCs). Researchers will combine electrochemical deposition with bespoke precursor chemistry to grow...
Accelerator-Equipped MCU Brings Greater Access to AI in Cars
STMicroelectronics introduced the Stellar P3E, an automotive microcontroller that embeds a Neural‑ART accelerator for on‑chip AI inference. The MCU consolidates multiple ECUs, features six Cortex‑R52+ cores up to 500 MHz, and includes high‑density xMemory. By offloading machine‑learning tasks to the NPU, the...
High-Voltage Power Diodes Offer Higher Current Capacities, Faster Recovery Times
Dean Technology has launched two new high‑voltage diode families, the FH and SH series, expanding its medium‑power portfolio. The FH series delivers a reverse‑recovery time as low as 40 ns, a substantial improvement over the legacy 2CL line’s 100 ns, while supporting...
The Silicon Desert
The Silicon Desert map visualizes Arizona’s rapidly expanding technology ecosystem, covering semiconductor, hardware, software, AI, IoT, and life‑science sectors. It lists more than 50 participants, from early‑stage startups to Fortune 100 multinationals such as Intel, IBM, and Boeing. The Arizona Technology...
Display Driver IC Suppliers Mull Price Hikes Amid Rising Foundry, OSAT Costs
Display driver IC (DDIC) suppliers are confronting mounting cost pressure as foundry and outsourced semiconductor assembly and test (OSAT) expenses rise. Foundry services account for roughly 60‑70% of DDIC costs, while backend packaging contributes about 20%, and limited 8‑inch wafer...
Week 13, 2026
The semiconductor and AI ecosystem is entering a phase defined by efficiency gains, massive infrastructure scaling, and strategic localization. This week’s highlights include Gartner’s forecast of a sharp decline in large‑language‑model inference costs, NVIDIA’s dual‑model AI stack, and Google’s near‑lossless...
Foundryecosystem Report: Capacity Shortages, Fabs, ASE, ATE
The latest Foundryecosystem Report highlights a severe shortage of leading‑edge foundry capacity for AI chips, as AMD, Nvidia and others scramble for wafers. Rising costs are also pressuring mature‑node display driver IC (DDIC) suppliers, prompting potential price hikes. Meanwhile, major...
EPIC Microsystems Raises $21M to Power Next-Gen AI Data Centers
EPIC Microsystems announced an oversubscribed $21 million Series A round, bringing its total capital to $26 million. The funding, led by Seligman Ventures with participation from Intel Capital and other venture firms, will accelerate commercialization of its hybrid switched‑capacitor (HSC) power delivery technology...
Mitsubishi, Rohm, Toshiba To Merge Power Semi Businesses
Mitsubishi Electric, Rohm and Toshiba Electronic Devices & Storage have signed a memorandum of understanding with Japan Industrial Partners and TBJ Holdings to explore merging their power‑semiconductor businesses. The proposed joint venture would combine silicon, gallium‑nitride (GaN) and silicon‑carbide (SiC)...
Which Foundries Are Making Which AI Chips?
Jon Peddie Research tracks 133 active AI processor suppliers, with major players like Nvidia, AMD, Broadcom, Google and a host of startups operating fabless. Nvidia’s newest Rubin GPU is manufactured by TSMC using its N3P process, while its Groq 3...
600-V Superjunction MOSFET Targets EVs, SMPS, and Solar Inverters
Alpha & Omega Semiconductor (AOS) launched the AOTL037V60DE2, a 600‑V superjunction MOSFET built on its new MOS E2 platform. The device offers a low 37 mΩ on‑resistance, a robust intrinsic body diode with reduced reverse‑recovery charge, and a wide safe operating area,...
GlobalFoundries Files Patent Suit Against Tower
GlobalFoundries has initiated legal actions against Tower Semiconductor in both the U.S. International Trade Commission and the Western District of Texas. The complaints allege that Tower is infringing on eleven of GF’s U.S. patents covering high‑performance analog, RF, and silicon‑photonics...
Rugged 600-V Gate Drivers Come in Multiple Configurations
Microchip Technology has launched a new family of 600‑V gate drivers, offering twelve devices across half‑bridge, high‑side/low‑side, and three‑phase configurations. The drivers deliver fast switching with current‑drive capabilities ranging from 600 mA to 4.5 A and operate on 3.3‑V logic, simplifying integration...
Cisco, Kioxia, Sandisk, Solidigm Invest $2.5B in Nanya
Cisco, Kioxia, Sandisk and Solidigm have collectively invested about $2.5 billion in Taiwan’s Nanya Technology through a private‑placement share offering. The capital will fund expansion of Nanya’s DRAM fabrication capacity, addressing a global memory shortage. Each investor also signed separate DRAM...
Tower Acquires 300mm Fab From JV Partner in Japan
Tower Semiconductor will acquire full ownership and operational control of the 300mm Fab 7 in Uozu, Japan, from its joint‑venture partner Nuvoton. The 65nm facility produces RF‑SOI, power‑management ICs, sensors and silicon‑photonics chips, and Tower aims to quadruple its capacity...
Advanced Packaging in the Semiconductor Industry
Advanced packaging is reshaping the semiconductor sector by enabling higher transistor density and heterogeneous integration through 2.5D, 3D, and fan‑out wafer‑level techniques. The global market is projected to exceed $30 billion by 2028, driven by demand for AI, high‑performance computing, and...
Practical Design Guidelines for Atom-Thin Oxide Transistors Enable Reliable 3D Chip Integration
Researchers at National Taiwan University introduced a unified analytical framework that captures how channel thickness, trap states, interface quality, and surface roughness jointly dictate the performance of atom‑thin indium‑oxide and tungsten‑doped indium‑oxide transistors. The model accurately reproduces I‑V characteristics for...
Expanding Storage Capacity with Smart Gate Semiconductor Technology
KAIST researchers have unveiled a "smart gate" semiconductor structure that uses a novel boron oxynitride (BON) tunneling layer to overcome scaling limits in 3D V‑NAND flash memory. The asymmetric energy‑barrier design accelerates erase operations by up to 23‑fold while maintaining...
Jmem Tek Joins GlobalFoundries Ecosystem to Expand Post-Quantum Security Solutions
Jmem Tek has joined GlobalFoundries’ GlobalSolutions™ Ecosystem as an official IP Network Partner, bringing its proprietary Physical Unclonable Function (PUF) and post‑quantum cryptography (PQC) IP to GlobalFoundries customers worldwide. The partnership gives semiconductor designers access to silicon‑proven hardware root‑of‑trust, secure...
CEA-Leti and Fraunhofer IPMS Validate Wafer Exchange for Ferroelectric Memory Materials Within the FAMES Pilot Line
CEA‑Leti and Fraunhofer IPMS have completed the first exchange of ferroelectric memory wafers within the EU‑funded FAMES Pilot Line, proving a shared platform for advanced embedded non‑volatile memory development. The exchange used 300 mm CMOS cleanrooms to process hafnium‑zirconium oxide (HZO)...