Intel’s upcoming Nova Lake CPUs, part of the Core Ultra 400 series, will integrate Xe3 graphics and the Xe3P display/media engine rather than the newer Xe4 IP. The platform targets a late‑2026 launch with early‑2027 market availability and will natively support DDR5‑8000 memory without overclocking. A 52‑core flagship is slated for a 175 W TDP, while lower‑power 65 W variants will also be offered. Combined with an on‑die NPU, Nova Lake promises over 100 TOPS of INT8 AI performance.
YieldWerx announced a forthcoming webinar that will teach semiconductor engineers how to implement co‑packaged photonics (CPO) across the full product lifecycle. The session, led by CEO/CTO Aftkhar Aslam, will detail the 12 cross‑domain challenges—from optical data complexity to test‑flow discontinuities—and...
![[OFC 2026] Part 2 of 5: CPO and the AI Interconnect Challenge](/cdn-cgi/image/width=1200,quality=75,format=auto,fit=cover/https://substackcdn.com/image/fetch/$s_!FG3y!,w_256,c_limit,f_auto,q_auto:good,fl_progressive:steep/https%3A%2F%2Fsubstack-post-media.s3.amazonaws.com%2Fpublic%2Fimages%2F3201360a-f898-4593-8267-8cfc0766cc04_1280x1280.png)
AI training racks are scaling rapidly, with Meta's upcoming ORW rack doubling node count and pushing single‑rack power beyond one megawatt. Copper backplanes now face insurmountable limits in bandwidth, power density, and routing complexity. Meta used OFC 2026 to set...
Intel quietly added the Core Ultra 7 251HX to its Arrow Lake HX family, slotting between the Core Ultra 5 245HX and the Core Ultra 7 255HX. The processor features 18 cores – six Performance and twelve Efficient – with a 30 MB Smart Cache and a...
RISC‑V has moved from a promising ISA to a viable platform as the RVA23 baseline unifies high‑performance compute. Arm’s recent transition to a silicon‑first model reshapes the IP landscape, intensifying competition. Akeana’s Alpine test chip, taped out in a 4 nm...

A quiet but critical battle is unfolding in agentic AI infrastructure over the key‑value (KV) cache. The KV cache, which stores key and value projections for every token, scales linearly with context length, layer count, batch size, and heads, consuming...

Intel’s upcoming Nova Lake Core Ultra 400 desktop CPUs, now expected in 2027, are rumored to pack up to 52 cores, higher clock speeds and a notable IPC uplift that could outpace AMD’s Zen 6 chips. Leaker HXL suggests Nova Lake’s P‑core...
Intel confirmed that its 14th‑gen Core “Raptor Lake Refresh” desktop CPUs, the 700‑series chipset, and the LGA1700 socket will stay in production and be “abundantly available.” The company is encouraging motherboard makers to launch boards that support both DDR4 and...
Canadian retailers ShopRBC and PC‑Canada have posted early listings for AMD's Ryzen 9 9950X3D2 Dual Edition, pricing the chip at CAD $1,374‑$1,375, which converts to roughly USD $990. The listings suggest AMD will set a $999 MSRP when the processor launches on April 22, 2026. The...

Chinese manufacturer WCH’s CH32V006 RISC‑V microcontroller, launched in 2024, powers the new $2 WeAct CH32V006F8U6 Mini Core development board. The board features a 48 MHz 32‑bit RISC‑V2C core, 8 KB SRAM, 62 KB flash, USB‑C power, and selectable 3.3 V or 5 V I/O via...
Intel abruptly discontinued its official XeSS plugin for the Unity game engine, removing support for frame generation, temporal super‑sampling, and antialiasing. This follows the release of Intel's XeSS 3.0 SDK only a month earlier, which introduced multi‑frame generation and shared...

The semiconductor industry is riding a multi‑year AI‑driven expansion, with February 2026 sales growth, record 300 mm fab equipment spending, and a $360 billion Foundry 2.0 outlook. At the same time, upstream material shortages—particularly helium, naphtha, tungsten, and sulfur—are exposing new supply‑chain vulnerabilities....

The Silicon Photonics Market and Technology Report 2026 highlights rapid growth in datacenter optical interconnects driven by AI workloads and the shift toward co‑packaged optics. It outlines a projected market size of roughly $12 billion by 2026, driven by expanding foundry...

Intel announced the Core Ultra X9 378H, a 16‑core Panther Lake processor that mirrors the X7 368H’s architecture but caps its turbo at 5 GHz, slightly below the X9 388H’s 5.1 GHz. It retains the Intel Arc B390 integrated GPU while stripping enterprise‑grade features such as vPro, AMT, and...
![[OFC 2026] Part 1 of 5: 300mm SiPh Foundry: Who Is Actually Ready?](/cdn-cgi/image/width=1200,quality=75,format=auto,fit=cover/https://substackcdn.com/image/fetch/$s_!FG3y!,w_256,c_limit,f_auto,q_auto:good,fl_progressive:steep/https%3A%2F%2Fsubstack-post-media.s3.amazonaws.com%2Fpublic%2Fimages%2F3201360a-f898-4593-8267-8cfc0766cc04_1280x1280.png)
The OFC 2026 conference showcased seven papers from Samsung, GlobalFoundries and NVIDIA that dissect the state of 300 mm silicon‑photonic (SiPh) foundries. While the headline race to 200 Gbit/s per wavelength still dominates headlines, the papers reveal that success now hinges on...