Know What's Happening in Hardware
Know What's Happening in Hardware
Intel leaks 44‑core Nova Lake‑S desktop processor, up from 42 cores
Intel’s upcoming Nova Lake‑S desktop line now includes a leaked 44‑core SKU, replacing the previously announced 42‑core model. The design uses two identical 8P+12E compute tiles, freeing up 6P+12E tiles that could be sold as lower‑priced, locked non‑K variants with on‑die big last‑level cache (bLLC).
RATIONAL marked its 50th anniversary of the CD 101 combi oven while celebrating the production of its 1.5 millionth unit. The milestone unit, featuring a gold‑colored dial, was donated to the St. Nikolaus Children’s Hospice in Bad Grönenbach. Over five decades the company has introduced climate‑controlled, self‑cooking and touch‑screen models, securing roughly 50% of the global combi‑oven market. Today RATIONAL’s appliances prepare about 180 million meals each day worldwide.
$COHR just landed a $2B equity investment from @NVIDIA plus a multi-year, multi-product supply agreement with a multibillion-dollar purchase commitment. The framework runs through 2030, with revenue contribution starting in CY27. 5 things that matter: 1.This is about co-packaged optics and advanced...
Just spent time at the Qualcomm booth at MWC 2026 looking at its latest AI datacenter rack with the AI200. Qualcomm is positioning AI200 as a rack-scale AI inference platform aimed at large datacenter deployments and lowering total cost of...
RISC‑V adoption drives the need for third‑party IP security. Arteris (formerly Cycuity) introduced a CWE‑based assurance framework that translates MITRE weaknesses into reusable security requirements, verification properties, and portable C‑tests. A pilot with SiFive’s X280 core analyzed 16 of 60...
Fraunhofer researchers unveiled NeurOSmart, a system that fuses high‑resolution LIDAR sensing with neuromorphic AI chips to enable safe human‑robot collaboration. The LIDAR sensor uses MEMS mirrors with AlScN material to create a 3‑D view, while AI algorithms pre‑process data directly...
Linux kernel 7.1 will automatically attempt to power off the system when a fatal ACPI error occurs. Earlier releases only logged the “_Fatal opcode executed_” message and kept running. The change aligns the OS behavior with the ACPI specification, which...
Skyworks Solutions announced it will demonstrate an early‑6G FR3 RF front‑end power amplifier at Mobile World Congress 2026, partnering with MediaTek. The SKYR60002 module covers the 6.425‑to‑>7 GHz band and integrates LNA, PA and filters to meet new 3GPP requirements. Skyworks...
Microsoft released DirectX 12 Agility SDK 1.619, officially introducing Shader Model 6.9 and the DXR 1.2‑based Shader Execution Reordering (SER) feature. In a controlled demo, Intel’s Arc B‑Series GPUs achieved up to a 90 % performance boost when SER was enabled,...
Samsung announced that its Samsung Wallet will now include a Digital Home Key, extending the Digital Key feature from vehicles to residential smart locks. The new function relies on the open Aliro standard—managed by the CSA group behind Matter—and supports...
Meta announced a renewed focus on jemalloc, the high‑performance memory allocator that underpins its infrastructure. The company has unarchived the open‑source repository and outlined a roadmap to cut technical debt, modernize the codebase, and add features such as a stronger...
Microsoft Azure now offers instant‑access incremental snapshots for Premium SSD v2 and Ultra Disk, enabling disks to be restored the moment a snapshot is created. The feature eliminates the traditional copy‑and‑hydrate delay, delivering near‑full performance from the first I/O. Customers...
I tested the Samsung Galaxy S26 Ultra — and of course it's the best Android phone ever https://www.techradar.com/phones/samsung-galaxy-phones/samsung-galaxy-s26-ultra-review
The Week Ahead in Technology for March 2, 2026: MWC Barcelona opens with @Qualcomm @Nokia @CiscoSystems @HPE showcasing 5G/6G and AI networking. $AVGO reports with $73B AI backlog in focus. $MRVL and $CRWD also report. @Apple should launch sub-$600...
ASML, the sole supplier of EUV lithography machines, announced plans to move into advanced packaging, a technique essential for AI chips and high‑bandwidth memory. The company will spend the next 10‑15 years researching equipment for chiplet stacking, bonding, and larger‑die...
Advanced smart sprayers are reshaping agronomy by integrating camera‑based automation, variable‑rate control, and mechanical flexibility. Case IH’s SenseApply and John Deere’s See & Spray deliver real‑time, nozzle‑by‑nozzle adjustments at speeds up to 25 mph, cutting chemical waste. New Holland’s Guardian combines live variable‑rate...
Samsung’s flagship Galaxy S26 Ultra began shipping a week before its scheduled March 6 launch when a Reddit user received the device early. The premature delivery appears to be a logistics slip rather than a deliberate giveaway, and similar incidents have...
Raytheon says its SPY‑6 radar family is already operating on a hot production line and is poised to shift into full‑rate production once the U.S. Navy grants final approval. Low‑rate initial production is nearing completion after extensive testing across the...
South Korean AI‑inference specialist Rebellions unveiled the Rebel 100, a quad‑chiplet accelerator built on Samsung’s SF4X process and linked with UCIe‑A interconnects. The SiP integrates four 320 mm² NPU dies, each with a 12‑Hi HBM3E stack, delivering 2 FP8 PFLOPS (1 FP16 PFLOPS) at a 600 W...
Independent teardowns confirm that Apple’s iPhone 17, 17 Pro and 17 Pro Max use Qualcomm’s QTM565 mmWave antenna‑in‑package module, which is fabricated on Soitec’s Fully Depleted Silicon‑On‑Insulator (FD‑SOI) substrate via GlobalFoundries’ 22FDX process. The finding validates FD‑SOI as a high‑volume substrate for FR2 5G...
PITAKA has launched two Samsung Galaxy S26 cases—Edge and Cairn—featuring the Aaron Button, a side‑mounted hardware shortcut system named after Aaron Swartz. The button offers three fully programmable keys for app launches, system commands, and IoT automations, earning a 2026 NY...
Yunzii introduced the M1 Lightweight Tri‑Mode Wireless Mouse, offering 2.4 GHz, Bluetooth, and USB‑C wired connections for versatile, low‑latency use across gaming, office, and travel scenarios. The mouse features a PAW3311 sensor delivering up to 1000 Hz polling, 1 ms latency, and seven...
Intel confirmed its upcoming Arc Pro B70 “Battlemage” GPU, built on the long‑rumored BMG‑G31 die, featuring 32 Xe² cores, 32 GB of GDDR6 memory on a 256‑bit bus, and roughly 4,096 FP32 cores—double the B60’s capacity. A smaller Arc Pro B65 will use the same...
TSMC is urging its customers to submit applications for the N2 process node as most capacity is already booked through the end of 2027. Remaining slots carry a six‑quarter lead time, and even allocated customers face up to twelve months...
NanoIC, the imec‑coordinated European pilot line, announced the release of two advanced interconnect process design kits – a fine‑pitch redistribution layer (RDL) and a die‑to‑wafer (D2W) hybrid bonding kit. The RDL PDK supports line widths and spaces down to 1.3 µm...
In this episode, host Sebastian Hassinger talks with Harley Johnson, a UIUC professor and CEO of the Illinois Quantum and Microelectronics Park (IQMP), about how Illinois has built a world‑leading quantum ecosystem. Johnson traces his own journey from a 1994...
Apple rolled out the iPhone 17e, the latest version of its lower-end smartphone, and a faster version of the iPad Air, kicking off a wave of new products. https://www.bloomberg.com/news/articles/2026-03-02/apple-launches-599-iphone-17e-with-magsafe-charging-m4-chip-ipad-air
Apple just dropped the new iPad Air now with an M4 chip, and 50% more RAM (12GB vs 8GB) than the last gen. Hell of a deal at $599. Unless you REALLY need 120Hz OLED, Apple Pencil hover, or FaceID...
Researchers published in Nature Electronics a hair‑thin, flexible patch called BISC that places 65,536 micro‑electrodes on the brain’s surface for high‑resolution electrocorticography. The device can address up to 1,024 channels simultaneously and transmits data wirelessly, eliminating percutaneous cables. Animal tests...
. @AxeleraAI has raised the biggest semi round in EU history at $250 million. CEO Fabrizio Del Maffeo told me investor confidence in European chip companies is growing, and talked about commercial expansion, a next-gen chip and the startup's 500...
. @Moto just made the case that foldables don’t have to compromise anymore. First proper look at the Razr Fold. https://t.co/BALcN14z6F
Intel unveiled the Clearwater Forest Xeon 6+ at MWC, a chiplet‑based server processor that combines twelve 18A compute tiles with Intel 3 and Intel 7 base and I/O tiles. The design delivers up to 288 Darkmont efficiency cores and more than 1 TB...
Entry-level PC market to ‘disappear’ by 2028 — rising memory prices pile more strain on consumer PC market https://t.co/GEatUh3y6S
One of the most powerful aspects of Quantum Metal is that it goes beyond individual components. It enables full-chip design, from layout to analysis to fabrication-ready GDS export: https://t.co/Tf2kzgwgON https://t.co/J6dk4NjFKK
Gaming peripheral brand ATK Gear announced a partnership with Turkish esports organization BBL Esports as its official VALORANT peripheral sponsor. The deal coincides with BBL’s participation in the VALORANT Masters Santiago Swiss Stage, where 12 teams compete for a $1 million...
Worth pointing out, no third party vendor $NVDA works with will be an off the shelf implementation into their designs. Everything will be co-optimized and intentionally designed into their platforms/systems. Relevant when thinking about the $LITE and $COHR plays.
Why this technology is so essential for multi-die assemblies, and how it can be improved. https://t.co/dYLFJAgBBD #hybridbonding #semiconductor #HBM #3DDRAM #advancedpackaging #3DNAND
9elements is actively porting Coreboot combined with AMD's openSIL library to the first‑generation Ryzen 7000 Framework 16 laptop, with plans to extend the effort to the Framework 13 Gen1 model. The initiative focuses on integrating AMD openSIL Phoenix code into Coreboot, tackling early‑stage...
Memory shortage reported back to back months in the ISM Manufacturing Survey. I suspect this will be with us for a while.... https://t.co/RUpjKtiOJ6
The price of memory chips continues to rise and is being passed on to downstream industries. National Development and Reform Commission https://t.co/Jjf9lb8DTz
ZClaw is an OpenClaw‑based AI assistant that runs on the $5 ESP32 microcontroller, fitting into an 888 KB firmware image. The platform provides secure Wi‑Fi, TLS, HTTPS, and Telegram bot integration, allowing hardware interaction through GPIO, task scheduling, and on‑device AI...
Pico is officially coming to North America, and that's a really big deal for the XR market. We don't have dates or prices yet, but you can even apply to test the new Project Swan headset out ahead of launch...
XTI Aerospace’s Drone Nerds unit announced the addition of Creality’s SPARKX i7 3D printer to its product line. The i7 features AI‑assisted setup, real‑time monitoring, and an automatic filament‑switching system that supports up to four‑color prints. The printer is marketed...
The article explains why traditional potentiometer joysticks suffer from inevitable drift and how contactless sensors are the logical replacement. Hall‑Effect sticks improved reliability but generate only micro‑volt signals that require amplification. Tunnel Magnetoresistance (TMR) sensors leverage quantum tunneling to deliver...
Starpath Space introduced Starlight Air, an ultra‑thin space solar panel that weighs just 73 g per square meter and sells for about $15 per watt. The panel uses a nanometer‑scale crystalline photovoltaic layer printed on a fabric substrate, delivering the same...
The Canadian Commercial Corporation (CCC) secured a four‑year contract with the U.S. Department of Defense to supply Recover Assist Securing and Traversing (RAST) systems to the Naval Air Warfare Centre. Curtiss‑Wright’s Mississauga plant will manufacture the equipment and provide field...
In this episode, Professor Scott Aaronson, a leading quantum computing theorist at UT Austin, discusses how long‑standing fault‑tolerance theories are finally being validated in modern labs, bringing large‑scale quantum computers within reach. He contrasts the empirical success of error‑corrected gates...
Swedish chipmaker Sivers Semiconductors announced its participation at MWC Barcelona, where it will demonstrate its latest satellite communications (satcom) beamforming ICs and flat‑panel antenna arrays. The centerpiece is Maverick, a 576‑element Ka‑Band transmit/receive array that incorporates the newly released Cloudchaser...
Senteic has issued a three‑year tender to build a comprehensive IoT ecosystem, inviting providers to deliver hardware, connectivity and platform solutions across nine categories, including smart metering, asset tracking, smart cities, e‑health, fleet management, smart grid, agriculture, and a generic...
Guerrilla RF announced an expanded focus on the fast‑growing unmanned aerial systems (UAS) and counter‑UAS (C‑UAS) markets, offering a portfolio of more than 90 RF integrated circuits. The portfolio covers low‑noise small‑signal devices through high‑power GaN amplifiers, targeting mission‑critical communications,...
Innodisk unveiled a CXL Add‑in Card (AIC) that expands memory via PCIe without using DIMM slots. The HHHL‑form factor card supports up to 256 GB using two DDR5 RDIMM sockets and delivers 32 GB/s over PCIe Gen 5 × 8. Built on CXL 2.0 Type 3, it enables...
