Today's Hardware Pulse

Nvidia driver hints at next‑gen DLSS 5 work
Nvidia’s GeForce Game Ready driver 610.47 adds three new profile options—Enable DLSS NR override, Enable DLSS NR SL override, and Override DLSS NR presets—suggesting continued development of DLSS 5 neural‑rendering technology. The earlier DLSS 5 reveal had sparked debate over AI‑driven image alteration, and the new driver hints at a quiet but ongoing effort.
Also developing:
By the numbers: Cyient Semiconductors raises $30M Series A
Vertiv Projects 32% Revenue Jump on AI Data Center Boom
Vertiv Holdings (VRT) lifted its 2026 outlook, projecting revenue of $13.5 bn—a 32% rise from 2025—driven by soaring AI data‑center spending. The company also sees adjusted earnings climbing 43% to $6.02 per share, underscoring the AI infrastructure supercycle’s impact on U.S. tech stocks.
Russian Team Unveils Nanolaser with Record‑Pure 0.15 Nm Linewidth
Scientists from Saint Petersburg State University and partner institutes have built a semiconductor nanolaser whose emission line width is just 0.15 nm, five to ten times narrower than typical devices. The active region measures no more than 60 nm, a scale that...

AMD Taps GlobalFoundries for MI500 Photonics as It Advances CPO Design
AMD is developing a co‑packaged optics (CPO) version of its Instinct MI500 accelerator, using photonic integrated circuits fabricated by GlobalFoundries and multi‑chip‑module packaging from ASE. The CPO approach aims to boost bandwidth and cut power consumption by placing optical links directly...
German Startup SWARM Biotactics Deploys Cyborg Cockroach Swarms for Defense
German firm SWARM Biotactics announced the first operational swarm of cyborg insects—Madagascar hissing cockroaches fitted with electrodes and miniature backpacks—for stealth surveillance. The move revives a two‑decade‑old defense research line and raises questions about the future of bio‑hybrid robotics.

Microchip Launches CLB MCUs to Improve Timing Control and Cut System Cost
Microchip Technology unveiled two new 8‑bit microcontroller families, the PIC16F13276 and PIC18‑Q35, that embed a configurable logic block (CLB) alongside traditional MCU functions. The CLB lets designers shift critical logic from software to hardware, cutting latency and improving predictability for...

Most Pixel Owners Are Ignoring One of the Phone’s Strangest Built-In Sensors
Google’s Pixel 10 Pro houses an infrared temperature sensor that earned FDA De Novo clearance in 2024, allowing the phone to take body temperature readings with ±0.3 °C accuracy. The built‑in Thermometer app lets users log temperatures for fevers, food safety, and home‑efficiency checks....

The Quantum Bottleneck Isn’t Chips — It’s Lasers, and Vexlum Wants to Fix It
Vexlum, a Finnish spin‑out focused on III‑V semiconductor lasers, is transitioning from boutique production to its own semiconductor fab to satisfy rising demand for high‑power, low‑noise laser sources. Its VECSEL technology provides compact, multi‑wavelength lasers crucial for quantum computers, atomic...

EU to Launch Chips Act 2.0 in May to Speed Funding and Boost Local Ecosystem
The European Union will unveil Chips Act 2.0 on May 27, tightening the timeline for semiconductor funding and shifting subsidies toward home‑grown firms. The revised framework promises a more direct, faster disbursement process to avoid the delays that have hampered projects under...

Raspberry Pi RP2350 Board Offers NB-IoT Cellular Connectivity, GNSS, and Wi-Fi Indoor Location
Challenger+ has released a Feather‑compatible RP2350 board that adds certified NB‑IoT and GNSS connectivity via the ST87M01 modem. The dual‑core RP2350 MCU runs at 150 MHz and includes 8 MB PSRAM, 8 MB flash, and a USB‑C power interface. Cellular performance reaches up...

The Last 1.5mm of AI Power: Three Numbers From Vicor’s Q1 2026 Earnings Call
Vicor Corp. disclosed its second‑generation Vertical Power Delivery (VPD) module on the Q1 2026 earnings call, highlighting a 3 A/mm² current density, up to 40× current multiplication, and a 1.5 mm package thickness. The company also announced a capacity boost at its...

New Study Published Evaluating PharmaSens All-in-One Insulin Patch Pump
PharmaSens AG announced that the Journal of Diabetes Science and Technology published data from the first clinical feasibility study of its niia all‑in‑one insulin patch pump, which combines insulin delivery with continuous glucose monitoring. The single‑arm trial enrolled 18 adults...
High-Throughput Diffuse Electron Projection Lithography
Researchers introduced diffuse electron projection lithography (DEPL), which uses a wide diffuse electron beam in air and patterned gold‑nanoparticle masks to pattern features as small as 4 nm. The technique demonstrated a throughput of 15 4‑inch wafers per hour and projects up...

Anker Made Its Own Chip to Bring AI to All Its Products
Anker unveiled the Thus processor, a custom AI chip that uses compute‑in‑memory architecture to embed neural‑net inference directly in audio, mobile accessories, and IoT devices. The chip, smaller and lower‑power than conventional AI silicon, will first appear in Soundcore’s upcoming...

Scale Adds VMware Migration Path for Dell VxRail
Scale Computing announced a migration pathway that lets organizations replace VMware on Dell VxRail appliances with the Scale HyperCore virtualization suite. The program lets customers repurpose existing VxRail hardware as standard PowerEdge servers, avoiding costly hardware refreshes and VMware licensing...
SolarEdge Targets C&I with New All-in-One Battery
SolarEdge introduced the CSS‑OD 197, a 197 kWh all‑in‑one commercial and industrial battery that can be configured up to 1 MW/4 MWh. The system uses lithium‑iron‑phosphate modules, delivering 187 kWh usable capacity and a 0.5C charge/discharge rate. It is modular, supporting up to 20 inverters...
Bosch Sampling Third-Generation SiC Chips to Global Automakers
Bosch has begun sampling its third‑generation silicon carbide (SiC) power chips to automakers worldwide. The new chips deliver about 20% higher performance while being significantly smaller, enabling more chips per wafer and lower costs. Bosch has invested roughly $3.3 billion in...

The Best Hair Straighteners in the UK for Foolproof Styling, Tried and Tested by Our Expert
A comprehensive test of 17 hair straighteners, from budget to premium, identified the GHD Chronos Max as the overall winner at £239 (~$299). The review also highlighted the Remington Shine Therapy as the best budget pick at £26.98 (~$34) and...

EQT Launches AI Infrastructure Strategy
EQT announced a dedicated AI Infrastructure strategy to fund the physical backbone needed for exploding artificial‑intelligence workloads. The firm estimates roughly $4 trillion in global capex will be required over the next five years to expand data centres, power systems and...

Xwatch and RodRadar Announce Collaboration
Xwatch Safety Solutions and RodRadar have teamed up to launch the construction industry’s first safety‑grade “stop‑before‑strike” system. The solution merges RodRadar’s AI‑driven Live Dig Radar, a bucket‑mounted ground‑penetrating radar that detects underground utilities in real‑time, with Xwatch’s proportional hydraulic control...
Chips With Everything: Securing the Silicon Future
U.S. firms must shift from treating semiconductors as a routine procurement category to viewing them as strategic inputs, akin to energy generation capacity. Companies should stratify sourcing by criticality—optimizing commodity parts, securing dual‑source contracts for strategic chips, and building architectural...

Morgan Stanley: Agentic AI Shifts Value From GPUs to CPUs and Memory, Creating up to $60bn Incremental CPU TAM by...
Morgan Stanley’s latest research warns that the next wave of AI – termed “agentic” AI – will shift economic value from GPUs to the broader server stack, especially CPUs and memory. Multi‑step autonomous agents require extensive orchestration, making CPUs the...

Gaming Consoles Can Now Charge While You Play
Green #Technology in the game industry: Scientists find way to charge your game console while playing by Delft University of Technology @TechXplore_com Learn more: https://t.co/kzW8X092w4 #EmergingTech #Innovation #CleanEnergy https://t.co/JzeJybv80y
Honor 600 & 600 Pro: A Massive Battery and Enough AI to Order Your Nosh.
Honor unveiled its 600 series, featuring the Honor 600 and Honor 600 Pro smartphones, each equipped with a massive 6400 mAh battery and 80 W wired SuperCharge. The Pro model adds 50 W wireless charging and 27 W reverse charging, effectively turning it into a...
How to Implement OTA Firmware Update on MCUs
The article walks design engineers through implementing over‑the‑air (OTA) firmware updates on NXP’s RW612 MCU using a “staging + copy” workflow. Because the RW612 stores its application image in external serial NOR flash, the update routine relies on NXP’s ROM‑resident FlexSPI API...

See the Latest Advancements in Fast Steering Mirrors, Hexapods and Nanopositioning Technology
Physik Instrumente (PI) showcased its latest high‑performance motion solutions at the Defense + Security expo on April 22, 2026. The display featured vacuum‑compatible fast steering mirrors for free‑space optical communications, precision gimbals for laser beam control, and 6‑DOF hexapod platforms...
_(1).jpg?width=1280&auto=webp&quality=80&disable=upscale)
Honor Expands Egyptian Factory to Produce 3M Smartphones
Honor announced the expansion of its Egyptian factory in the 10th Ramadan industrial city, boosting capacity to 3 million smartphones per year. The 8,000 m² site, Honor's first manufacturing footprint outside China, will host five production lines and two SMT lines and is...

Blog Review: Apr. 22
The April 22 blog roundup highlights a series of industry podcasts and posts that dissect critical bottlenecks in chip verification, the rising complexity of analog‑mixed‑signal design, and security threats such as ATM jackpotting. It also showcases new verification IP for...

TSV Complexity Leads To Manufacturing Bottleneck
Through‑silicon vias (TSVs) are essential for 3D stacking and high‑bandwidth memory, but shrinking dimensions are driving up fabrication cost and defect rates. The surge in AI demand has strained HBM and advanced‑assembly capacity, creating a bottleneck in the limited pool...

HPE ProLiant Compute ML350 Gen12 Review: HPE Delivers a Mighty Xeon 6 Tower of Power
HPE’s ProLiant Compute ML350 Gen12 is the company’s most powerful tower server, featuring dual 32‑core Xeon 6730P CPUs (up to 86 cores) and up to 8 TB of DDR5 memory. It offers up to ten PCIe Gen5 slots and can accommodate eight single‑width or four...

Rethinking Sensors for Physical AI: Why Machines Need to See the World Differently
Traditional sensors have been built for human perception, translating physical signals into formats humans can interpret. As AI moves into the physical world, machines now consume sensory data directly, requiring a shift to machine-centric sensing. The article argues that sensors...

Innoviz Launches 1 Km Long-Range LiDAR Sensor
Innoviz Technologies unveiled the InnovizTwo Ultra Long‑Range (ULR) LiDAR, capable of detecting objects up to 1 km away for automotive applications. The sensor, built on the same production line as the existing InnovizTwo, has already been shipped to select customers for...
XOR'ing a Register with Itself Is the Idiom for Zeroing It Out. Why Not Sub?
Zero‑ing a register on x86 is most efficiently done with the xor r,r idiom because it avoids encoding a four‑byte immediate. Although sub r,r produces the same result and clears all flags, xor r,r became the dominant pattern after early compilers adopted it....

MostaTech to Highlight Rugged & Miniature Fiber Optic Gyros at SAHA 2026
MostaTech will showcase its newest rugged and miniature fiber‑optic gyroscopes at the SAHA International Defence & Aerospace Exhibition in Istanbul (May 5‑9, 2026). The display features the VG2103S‑3000, capable of surviving 3000 g shocks and 18 g vibrations, and the VG910H1 with 1200 g...

SUSE Launches Industrial IoT Platform Based on Losant Acquisition
SUSE announced the launch of its Industrial Edge platform, built on the Losant acquisition, to provide protocol‑agnostic data collection for edge devices. The solution includes no‑code/low‑code workflow tools, dashboards and templates, simplifying implementation. SUSE also committed to open‑sourcing Losant’s core...

IRobot Promo Code: 15% Off
iRobot is rolling out a series of promo codes that slash prices on its Roomba lineup, from a 15% gift discount plus $15 off accessories to deep cuts of up to $300 on models like the Plus 405 and 205. The...

IMSAR Completes First Flight of NanoSAR D REA
IMSAR LLC announced the first successful flight of its NanoSAR D Radar Electronics Assembly (REA), a software‑defined, miniaturized radar core. The flight demonstrated full RF and signal‑processing functions—pulse generation, filtering and detection—handled in software. By shifting processing to software, the...

Scale Computing Spotlights Edge Wins in Retail, K-12
Scale Computing used its Platform//2026 conference to showcase how its edge‑computing platform simplifies operations for wildly different customers. Taco Bell leverages the solution to standardize omnichannel ordering across dozens of international markets, freeing its internal teams for innovation. In northern...
Kioxia Issues Firmware Update for EXCERIA G3 SSDs, Recommends Upgrade
Kioxia has issued firmware version EVFATR.1 for its EXCERIA G3 (VC10) SSD line, urging owners of the earlier EVFATR.0 build to upgrade. The update targets critical bugs and aims to boost reliability and performance, though Kioxia has not released a detailed...
Akasa Rolls Out Realtek-Based 10GbE PCIe Card for Multi-Gig Upgrades
Akasa has launched the AK-PCCE10-01, a PCIe 3.0 ×2 network card using Realtek RTL8127AT to deliver 10 GbE over a standard RJ45. The card auto‑negotiates speeds from 10 Mbps to 10 Gbps, supports IEEE 802.3az Energy Efficient Ethernet, Wake‑on‑LAN and jumbo frames up to 16 KB....

RAM Price Relief? SK Hynix Plans $13-Billion Korean Fab
SK Hynix announced a $12.85 billion investment to build a new advanced‑packaging fab in South Korea, with construction starting this month. The plant will focus on high‑bandwidth memory (HBM) chips that power AI accelerators, addressing a surge in demand driven by...

ACME Solar Hits 2 GWh Battery Storage Milestone in Rajasthan; Stock up 1.65%
ACME Solar Holdings announced it has now operationalised over 2 GWh of battery energy storage systems in Rajasthan, bringing its total BESS capacity to 591 MW (2,031 MWh). The company aims to reach 10 GWh of storage by 2027, expanding its role in grid‑balancing...
AirTrunk’s Lumina Deal Raises Stakes For APAC Cloud ERP
AirTrunk has acquired Lumina CloudInfra, securing a 600 MW pipeline valued at up to $5 billion and instantly gaining footholds in Mumbai, Chennai and Hyderabad. The deal lifts AirTrunk’s total capacity to more than 3 GW across roughly 20‑23 campuses in six APAC...
From Brain Implant to Lifelong Companion: Michel Maharbiz Unveils Epia Neuro
Epia Neuro, a stealth‑mode neurotechnology startup co‑founded by Michel Maharbiz, announced its public debut at the Bioelectronic Medicine Forum. The company, now 45‑strong and backed by venture and pharma investors, is developing a skull‑mounted, dura‑sparing neural interface designed for outpatient...

Eight Mental Models for The AR Era
The post argues that the AR glasses race is driven more by control of the ambient context data pipeline than by hardware specifications. Every hour a user wears AI glasses, spatial, visual, audio and behavioral data feed a model‑training infrastructure...

Scaling Up: More Mac Studios Join NVIDIA DGX Setup
Current local setup: 2x NVIDIA DGX Mac Mini Mac Studio (not pictured) Soon to come: More Mac Studios https://t.co/4GtfgqJXAX
All-Day Smart Glasses Powered by Claude Code
The Holy Grail would be able to have smart glasses and Claude Code while walking around with those all day.
MSI Unveils the Cubi NUC AI 3MG: A 0.51-liter Mini PC Designed to Handle AI, Edge Computing, and Office Tasks...
MSI introduced the Cubi NUC AI 3MG, a 0.51‑liter mini PC aimed at business and edge AI workloads. It ships with Intel Core Ultra 9 386H, offering up to 100 TOPS of AI acceleration, dual 2.5 GbE, Wi‑Fi 7, and support for four displays. The...
Google Is in Talks with Marvell About Two New AI Chips—Putting Pressure on Broadcom
Google is reportedly in talks with Marvell to develop two custom AI chips—a Memory Processing Unit and a new TPU optimized for inference. The discussions come after Google signed a long‑term AI‑chip supply agreement with Broadcom that runs through 2031....

Blackbox Replaces Two Racks of HPE Storage with 8U of Everpure
Blackbox Hosting has replaced its two full racks of HPE 3PAR arrays with eight rack units of Everpure FlashArray hardware, consolidating 998 TB of provisioned storage into two 4U boxes. The new Pure Storage solution delivers a 10:1 data‑reduction ratio and...
Single Pair Ethernet Provides a Single Digital Communication Technology for Industry
Single‑pair Ethernet (SPE) is emerging as a unified communication layer for industrial automation, replacing the traditional mix of fieldbus and multi‑pair Ethernet. By using just one copper pair, SPE reduces cable bulk, extends reach up to one kilometre without repeaters,...