How Data Movement Defines Performance for AI Silicon
AI silicon performance now hinges on efficient data movement rather than raw compute power. In data‑center GPUs, over 80% of dynamic energy is spent shuttling data to DRAM, while edge AI devices can waste up to 90% of inference time waiting on memory I/O. Network‑on‑chip (NoC) architectures address these bottlenecks by packetizing traffic, reducing wiring complexity, and providing scalable bandwidth and latency control. Physically aware NoC automation further trims wire length by roughly 26% and halves peak latency, enabling modular chiplet designs that keep development costs in check.
Intel Nova Lake ES Chips Reportedly Double Multi-Core Performance
Intel has begun shipping engineering samples of its next‑generation Core Ultra 400 (code‑named Nova Lake) desktop processors to hardware partners for validation. The chips introduce a redesigned hybrid architecture with Coyote Cove performance cores and Arctic Wolf efficiency cores, and feature...
Swissbit Launches N7000 PCIe 4.0 SSD Series With Up to 10 DWPD
Swissbit unveiled the N7000 series, a new line of PCIe 4.0 NVMe SSDs built on its eighth‑generation BiCS8 NAND. The portfolio includes DRAM‑less models that rely on Host Memory Buffer technology and offers two endurance tiers: a TLC‑based 0.3 DWPD variant and...
Acer Launches Aspire 14 AI Ryzen AI 400 Copilot+ Notebooks
Acer unveiled the Aspire 14 AI notebook series, featuring two 14‑inch models powered by AMD’s Ryzen AI 400 processors. The laptops combine 16 GB LPDDR5X memory, Radeon 840M graphics and a 50‑TOPS NPU for on‑device AI tasks such as text generation and image editing. A dedicated...
COLORFUL Launches iGame B850M ULTRA Series AM5 Motherboards
COLORFUL has unveiled the iGame B850M ULTRA Series, two micro‑ATX motherboards for AMD Ryzen 9000 AM5 platforms. The ULTRA‑S model features a 14+2+1‑phase VRM and supports DDR5‑8400 memory, while the ULTRA‑OC pushes DDR5‑8800 and adds 5 Gb Ethernet for extreme overclocking. Both boards include...
Intel Crescent Island Xe3P AI Accelerator PCB Leaks Online
Intel has leaked PCB images of its upcoming Crescent Island AI accelerator, built on the Xe3P "Celestial" architecture. The design departs from previous GPU layouts, featuring a central square processor and 20 LPDDR5x memory modules that can deliver up to...
Global OLED Monitor Shipments Soar 78% YoY for 1Q 2026
Global OLED monitor shipments surged 78% year‑on‑year in Q1 2026 despite an 11% quarter‑on‑quarter dip, driven by abundant QD‑OLED panel supply. ASUS retained the top market share at 24% thanks to a broad OLED lineup, including a new 34‑inch 360 Hz...
ST Image Sensors Bring Always-On Vision to Next-Gen Personal Electronics
STMicroelectronics has introduced the VD55G4 monochrome and VD65G4 RGB image sensors, the latest members of its BrightSense family. These ultralow‑power global‑shutter chips deliver always‑on vision while consuming up to ten times less power than conventional sensors. Designed for wearables, AR/VR...
Rethinking System Design Amid the DRAM Crunch
DRAM scarcity is hitting AI hardware, with high‑capacity modules now costing three to four times previous levels and facing long lead times. This pressure is prompting a redesign of AI systems toward lower memory footprints, leveraging edge accelerators that run...
GatesAir Supports Successful ATSC 3.0 Direct-to-Mobile Trial in India
GatesAir announced the successful completion of a three‑year ATSC 3.0 Direct‑to‑Mobile (D2M) field trial in Delhi, India, partnered with public broadcaster Prasar Bharati and Tejas Networks. The trial used GatesAir’s Maxiva XTE exciter and a hybrid high‑power/high‑tower and low‑power/low‑tower transmission architecture operating in...
TSMC Lays Out ‘Three-Layer Cake’ Vision for AI Chips
Taiwan Semiconductor Manufacturing Company unveiled a "three‑layer cake" roadmap that fuses its 2nm N2 compute node, advanced 3D CoWoS packaging, and the Compact Universal Photonic Engine (COUPE) for high‑speed optical links. The strategy was announced at TSMC’s 2026 Technology Symposium...
Cusp-Singularity-Enhanced Coriolis Effect for Sensitive Chip-Scale Gyroscopes
Researchers have introduced third‑order cusp singularities into a chip‑scale Coriolis vibratory gyroscope, creating a singularity‑enhanced Coriolis effect. The approach yields a cubic‑root response that lifts the effective Coriolis factor by up to 1,010 times, improves signal‑to‑noise ratio 253‑fold, and boosts precision...
Motorola Razr 2026 Vs. Razr 2025: A Few Steps Forward, One Big Step Back
Motorola’s Razr 2026 arrives as the newest budget‑friendly foldable, priced at $699 and featuring a MediaTek Dimensity 7450X processor, a 50 MP ultrawide camera, and a larger 4,800 mAh battery. Compared with the Razr 2025, the newer model costs $100 more and halves internal storage...
Warby Parker and Google Take on Meta with New AI Smart Glasses
Warby Parker announced its first smart‑glasses, co‑developed with Google and Samsung, at Google I/O. The Intelligent Eyewear frames embed speakers, dual cameras, and Google Gemini‑powered AI within a lightweight dark‑green nylon design, offered as both sunglasses and regular glasses. Pricing...
A First (and Second) Look at the Android XR Glasses Launching This Year
Google unveiled the latest iteration of its Project Aura Android XR glasses, adding a protective case, a revamped compute puck with a fingerprint scanner, and an adaptive‑transparency lens that reacts to user focus. The company also showcased prototype designs from...
Xreal Unveils Project Aura Android XR Device at Google I/O Showcase
Xreal unveiled Project Aura, a lightweight wired XR glasses platform, at Google I/O, promising a global launch in 2026. The device runs Android XR, leverages Google’s Gemini AI, and is powered by Qualcomm Snapdragon processors. Live demos showcased immersive Google...
Is the New Surface Pro for Business (12th Edition) Worth an Upgrade over the Pro 11? Here's What You Need...
Microsoft’s Surface Pro for Business (12th Edition) upgrades the flagship 2‑in‑1 with Intel Panther Lake Core Ultra Series 3 CPUs, optional 5G, Wi‑Fi 7, and an anti‑reflective display. Starting at $1,949.99, it is $250 pricier than the 11th Edition and $750 above the Snapdragon‑based Surface Pro 11, which...
Roam to Deploy EV Charging at Hand Picked Hotels’ Luxury Country House Properties
Roam Charging has won a contract to install and operate 112 electric‑vehicle charge points at 20 luxury country‑house and coastal resort properties owned by Hand Picked Hotels in the UK and Channel Islands. The deployment will cover the full lifecycle—from design and...
Gaming Phones Are Becoming the New, Affordable Android Flagships – 144Hz OLED and Mammoth 8,000mAh Battery
RedMagic unveiled the RedMagic 11S Pro, an over‑clocked gaming phone built on the Snapdragon 8 Elite Gen 5 processor, featuring a 24,000 RPM TurboFan AquaCore cooling system, an 8,000 mAh battery with 80 W fast charging, and a 6.85‑inch 144 Hz AMOLED display without a notch. The device launches...
Sub-Sea AI Data Center Is Operating in China
China has launched the world’s first commercial undersea AI data center, located six miles off Shanghai’s Lingang Special Area. The wind‑powered facility, built by Hi Cloud Technology in partnership with local authorities, cost roughly $226 million and began operations in October...
SBRS Introduces 500 kW Charging System for Commercial Vehicles
Shell subsidiary SBRS has launched the PowerPack 500, a modular DC fast‑charging system delivering up to 500 kW for heavy‑duty commercial vehicles in Europe. The all‑in‑one unit starts with two charging points and can scale to six connectors without any depot redesign....
Microchip Timing Module Supports AI Data Centre and 5G Synchronization
Microchip has launched the MD-990-0011-B plug‑in timing module, co‑developed with Intel for Xeon 6 SoC servers and virtualized RAN platforms. The module offers automatic source selection among GNSS, SyncE and PTP, delivering resilient synchronization for AI workloads, cloud services and 5G...
GPUs: A High-Throughput Architecture Confronting a Workload Shift
Graphics processing units still power large‑scale AI training, but frontier large language models are exposing a growing memory bottleneck. While Nvidia H100 GPUs can deliver petaflops of FP8 throughput, trillion‑parameter inference often falls below 10 FLOPs per byte, making bandwidth...
Escarda Starts Series Production of AI Laser Weeder After Acquisition
Berlin‑based Escarda Technologies, now fully owned by Berlin Industrial Group (B.I.G.), is moving into series production of its AI‑powered laser weeder. The system blends high‑resolution cameras, AI plant recognition and Class‑1 laser technology to eliminate weeds in real time without...
The Next 15 Years of Moore’s Law, According to Imec
Imec’s new 15‑year roadmap predicts the commercial debut of complementary FET (CFET) technology around 2033, effectively stacking PMOS and NMOS devices to halve circuit area. The institute also foresees a shift to two‑dimensional semiconductor channels by 2041 to boost power...
ChargePoint Wants To Fix The Condo EV Charging Problem With 2,500 New Ports
ChargePoint announced a plan to deploy roughly 2,500 Level 2 EV charging ports at multifamily residences across the United States, beginning in 2026. The rollout is backed by a partnership with OBE Power, which will own, operate, and handle all maintenance...
Rapid Adoption of Automotive Ethernet Raises Standardization and Cost Concerns
Tech Insights forecasts automotive Ethernet sockets will climb from about 962,000 in 2025 to 3.42 million by 2032, pushing the average per‑vehicle ports from 11 today to 27 by 2030. The rapid growth is driven by higher‑bandwidth sensors, autonomous‑driving workloads and...
Samsung Electronics Launches Emergency Semiconductor Production Plan Ahead of Union Strike
Samsung Electronics activated an emergency management plan for its semiconductor fabs ahead of a union strike slated for May 21. The company is trimming wafer input volumes and shifting capacity to high‑bandwidth memory (HBM) chips to protect critical AI‑related supply....
Memory Chip Prices Set to Ease in Late 2027 as AI Demand Drives Global Market Volatility
Memory chip prices, which have surged amid AI‑driven demand, are projected to soften in the second half of 2027. Former Samsung Device Solutions head Kye‑hyun Kyung cites expanding Chinese production and a projected global wafer capacity of 6 million units per...
Infineon Expands XHP 2 CoolSiC MOSFET Portfolio with 2300 V Modules for Renewable Energy
Infineon Technologies has added 2300 V CoolSiC™ MOSFET variants to its XHP 2 power‑module family, targeting high‑voltage renewable‑energy converters. The new modules support DC‑link voltages up to 1500 V, feature on‑resistance between 1 mΩ and 2 mΩ, and offer 4 kV or 6 kV isolation. Leveraging silicon‑carbide...
China’s Rapid Chipmaking Expansion Threatens AI Memory Chip Boom, Samsung Adviser Warns
Samsung adviser Kyung Kye‑hyun warned that China’s aggressive chip‑making expansion could blunt the AI‑driven memory super‑cycle by 2028. Chinese firms already hold about 20% of the NAND market and could capture 12‑13% of DRAM after adding 300,000 wafers over three...
LG's UltraGear Is a Native 1,000Hz Full HD Gaming Monitor
LG has launched the UltraGear, a 24.5‑inch Full HD gaming monitor that delivers a native 1,000 Hz refresh rate. Unlike Samsung and Acer’s dual‑mode models, it maintains the 1080p resolution while hitting the ultra‑high refresh speed. The monitor targets competitive FPS players,...
China Market for Nvidia AI Chips to Open 'over Time': Huang
Nvidia CEO Jensen Huang told Bloomberg that China will gradually allow sales of its high‑end H200 AI chip, which is currently licensed but blocked by U.S. export rules. He did not meet Chinese leaders directly, but noted President Trump has...
AMD EPYC Venice Reportedly Combines TSMC N2P and N2 CCD Designs
AMD’s upcoming EPYC “Venice” server line will employ two distinct chiplet (CCD) designs. The mainstream variant will use TSMC’s N2P process, delivering up to 96 cores per socket with 12 Zen 6 cores per CCD. A high‑density version will run on...
Research Bits: May 19
Researchers at the University of Washington unveiled a low‑power, electrically programmable photonic integrated circuit built with standard foundry processes, using phase‑change material to retain settings without power. MIT scientists demonstrated implosion carving to shrink hydrogel‑based optical features from 800 nm to...
Intel Reportedly Urging OEMs Toward Faster Adoption of 18A Consumer CPUs
Intel is reportedly pressing major PC OEMs to accelerate the rollout of consumer processors built on its new 18A manufacturing node. The company aims to shift production capacity from aging Intel 7 and Intel 4/3 chips toward higher‑margin Panther Lake and Wildcat Lake CPUs....
Uviquity Announces World’s First Chip-Scale Deep-UV Laser
Uviquity announced the world’s first chip‑scale deep‑UV laser operating at 229 nm, produced from a single semiconductor chip. The device leverages the company’s aluminum nitride photonic‑integrated‑circuit platform and second‑harmonic generation to deliver collimated, narrow‑line‑width output. Sampling for OEM partners begins in...
Rohm Scales Power Supply Tools for Automotive SoCs
Japanese chipmaker Rohm has begun mass production of a configurable automotive power‑supply platform that pairs its BD968xx‑C series PMICs with the BD96340MFF‑C DrMOS driver. The solution targets system‑on‑chips used in ADAS, driver‑monitoring and in‑vehicle cameras, offering a 2.7‑5.5 V input range...
Microchip Ethernet PHY Families Enable Secure, Scalable Connectivity
Microchip Technology introduced the LAN878x and LAN888x families of Single Pair Ethernet (SPE) PHY transceivers, covering 100BASE‑T1, 1000BASE‑T1 and dual‑speed 100/1000BASE‑T1 options. The devices embed hardware‑based MACsec security compliant with IEEE 802.1AE‑2018 and native Time‑Sensitive Networking (TSN) for deterministic, low‑latency communication....
DEEPX Partners with Ultralytics to Define Global Standard for Physical AI
DEEPX and Ultralytics announced a partnership to create a global standard for Physical AI by embedding DEEPX’s DX‑M1 neural processing unit into the Ultralytics YOLO ecosystem. The integration introduces a new “format=deepx” flag that lets developers export YOLO models to...
Variscite to Launch NXP i.MX 95-Based SoM Product Family
Variscite is set to launch a SMARC‑compatible system‑on‑module (SoM) built around NXP’s i.MX 95 processor. The VAR‑SMARC‑MX95 will deliver up to six Cortex‑A55 cores, dedicated real‑time co‑processors, and a 2 TOPS eIQ Neutron NPU for edge AI workloads. Three variants will embed...
Verification IP: Why Design Teams Buy Instead of Build
Verification IP (VIP) offers pre‑built, reusable verification components for standards‑based interfaces and memories, letting design teams avoid the costly effort of building monitors, checkers, and test suites from scratch. As protocols like PCI Express, CXL, DDR, and emerging chiplet interconnects evolve...
Georgia Tech Researchers Unveil Innovative NAND Flash Storage Technology for Deep Space Missions
Georgia Tech researchers have created a ferroelectric NAND flash memory that can survive radiation doses up to one million rads—about thirty times the tolerance of conventional charge‑trapping NAND. The device uses a hafnium‑oxide ferroelectric layer that stores data via polarization...
Uncle Sam's Next Big Supercomputer Might Use Something More Exotic than GPUs
U.S. national labs are testing NextSilicon’s Maverick‑2 dataflow processor as a potential alternative to GPU‑centric supercomputers. Sandia National Laboratory’s 64‑node Spectra testbed, built with Penguin Solutions, recently met all system acceptance criteria, proving the chips can run key HPC workloads....
Cisco Wins Over AI Customers With Merchant Silicon And Optics
Cisco reported Q3 FY2026 revenue of $15.84 billion, a 12% year‑on‑year increase, with operating income climbing 23.7% to $3.96 billion and net income up 35.4% to $3.37 billion. The company raised its AI order outlook to $9 billion for the fiscal year, expecting $4 billion...
'I'm Sorry Dave': NASA Is Working on an AI Chip to Help Next-Generation Spacecraft Think for Themselves — so Clearly...
NASA’s High‑Performance Spaceflight Computing (HPSC) project is unveiling a new radiation‑hardened AI processor that promises up to 100 times the computing power of current spaceflight hardware, with early tests indicating performance as high as 500 times. The multicore chip is engineered to...
EnerSys Launches AlphaCell™ 4.0HP+ Battery to Improve Replacement Interval Stability in Outdoor Communications Networks
EnerSys announced the launch of its AlphaCell™ 4.0HP+ battery, a Thin Plate Pure Lead (TPPL) solution built for outdoor and edge communications networks. The battery is engineered to boost electrochemical stability and extend replacement intervals, addressing the growing demand for...
Dell PowerRack Launches at Dell Technologies World 2026 as a ‘Turnkey’ Networking, Storage, and Compute System for AI
Dell Technologies introduced PowerRack at Dell Technologies World 2026, a fully integrated rack‑scale system that combines networking, storage and compute for AI and HPC workloads. The solution promises to go from delivery to live operation in as little as six...
Mouser Electronics and Efficient Power Conversion (EPC) Enter Global Distribution Agreement to Deliver High-Performance Power Solutions
Mouser Electronics has signed a global distribution agreement with Efficient Power Conversion (EPC) to sell EPC's eGaN‑based power devices worldwide. The partnership will make GaN transistors and integrated power stages—spanning 15 V to 350 V—available to engineers designing DC‑DC converters, lidar, motor...