Microsoft Plans Significant Update to Windows Secure Boot
Microsoft is rolling out its first Secure Boot certificate update in 15 years, with the 2011‑based certificates set to expire between June 27 and October 2026. For Windows desktops, the fix requires a standard Windows Update plus a UEFI firmware upgrade, while Windows Server environments demand a manual, multi‑step rollout. Major OEMs such as Dell, HPE, and Lenovo are releasing firmware patches to enable the new certificates. Enterprises that miss the window will lose the ability to receive boot‑process security updates, increasing exposure to firmware‑level attacks.
Nvidia Earnings Show AI Spending Moving Beyond GPUs
Nvidia reported record fiscal 2027 Q1 revenue of $81.6 billion, driven by a 92% surge in data‑center sales to $75.2 billion. The company announced a new reporting structure that separates its business into Data Center and Edge Computing, with the Data Center split...
Servers Don’t Fail Randomly: The Structural Causes Behind Large Scale Hardware Incidents
Server outages in modern data centers are rarely random; they stem from structural flaws introduced during design, firmware configuration, or pre‑production validation. As platforms become denser and firmware‑driven, reliability hinges on interactions among power delivery, PCIe fabrics, and management controllers...
Nvidia’s Jensen Huang Wants to Be King of a Brand-New Empire
Nvidia, the world’s most valuable chipmaker, announced its entry into the central processing unit market with Vera, its first standalone AI‑focused CPU launched in March. CFO Colette Kress said the product opens a new $200 billion total addressable market, with early...
New Silicon Battery Partnership Targets Longer-Range Drone Delivery
Amprius Technologies and Matternet have formed a strategic partnership to embed Amprius’s silicon‑anode lithium‑ion cells into Matternet’s autonomous M2 delivery drones. The collaboration has already seen the new batteries installed in the M2 platform, which operates in several urban drone...
HighTec and SiFive Strengthen RISC-V Safety Tools
HighTec EDV-Systeme and SiFive have announced a joint effort to deliver safety‑qualified RISC‑V software toolchains for automotive and industrial applications. The partnership merges HighTec’s LLVM‑based compiler suite for C/C++ and Rust, which is ISO 26262 ASIL D and ISO 21434 certified, with SiFive’s...
Google To Build $15B Data Center Next To Amazon Center In Missouri
Google announced a $15 billion, 900‑acre data center in Montgomery County, Missouri, positioned directly beside Amazon’s $35 billion, 1,000‑acre project. The investment is part of Alphabet’s $190 billion capex plan for 2026, emphasizing AI‑driven infrastructure. Google will bring more than 1 gigawatt of capacity...
Micron's AI Memory Dominance Is Just Beginning
Micron Technology guided for $33.5 billion quarterly revenue with roughly 81% gross margins, levels rarely seen in memory. DRAM prices surged 65%‑67% sequentially while NAND demand rose, indicating AI‑driven supply constraints across the market. Investors are fixated on Micron losing Nvidia’s...
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Gecko Robotics announced it will integrate Ouster’s new Rev8 digital lidar into its Cantilever operating platform. The Rev8 sensor suite delivers full‑color, structured 3D point clouds together with infrared and intensity data, enabling richer visualizations of industrial assets. By feeding...
NVIDIA Predicts $1 Trn in GPU Sales, Moves in on CPUs
NVIDIA projects its graphics processors will generate roughly $1 trillion in revenue between 2025 and 2027, driven by surging demand for generative and agentic AI. The company just reported a record $81.6 billion in Q1 fiscal 2027 revenue, with its nascent CPU...
China Built a Gaming GPU: Lisuan's LX 7G100 Performs Like an RTX 3060 but Costs Almost $500
Chinese firm Lisuan Technology has launched the LX 7G100, a 12 GB gaming GPU that benchmarks near Nvidia’s five‑year‑old RTX 3060 in synthetic tests. Priced at roughly $480 (3,300 RMB), it competes with mainstream cards like the RTX 5060 Ti but falls short in real‑world gaming...
Microsoft Refreshes Surface Line with Biz-Friendly Features – and a High Price Tag
Microsoft unveiled an updated Surface for Business lineup, adding a new Surface Pro for Business and two Surface Laptop for Business models—13‑inch entry‑premium and 13.8‑/15‑inch premium versions. All devices run the latest Intel Core Ultra Series 3 chips, offer optional...
Mizuho Just Rerated These 3 AI Winners
Mizuho analyst Vijay Rakesh upgraded price targets for Micron, STMicroelectronics and Texas Instruments, citing AI‑driven data‑center demand that is tightening memory markets and boosting analog chip content. The target for Texas Instruments rose to $300 from $255, reflecting a 90%...
New Semiconductor Building Blocks Make Power Converters Smaller, More Affordable
Oak Ridge National Laboratory (ORNL) has demonstrated a power converter built with gallium‑nitride (GaN) semiconductors supplied by ROHM. The GaN devices switch 10‑20 times faster than traditional silicon, delivering higher efficiency while shrinking the converter’s size and weight. The compact,...
IPhone 18 Pro Max Might Not Be the Best From Apple in 2026
Apple is set to launch the iPhone 18 Pro Max later this year, but analysts say the flagship could be eclipsed by a new premium line. Leaks point to either an iPhone Ultra or a foldable iPhone—potentially called iPhone Fold—targeting the high‑margin segment in 2026....
Infineon Expands CoolGaN BDS Portfolio with Compact 40 V Bidirectional GaN Switches
Infineon Technologies has added two compact 40 V bidirectional GaN switches, the IGK048B041S and IGK120B041S, to its CoolGaN BDS family. The devices shrink PCB footprint by up to 82% and halve component count by integrating two MOSFET functions into a single...
Trump Approved an Nvidia Chip for Sale in China. Beijing Doesn’t Want It.
President Trump lifted a long‑standing export ban, allowing Nvidia to sell its high‑performance H200 AI chip to China. The move was touted as a win for Chinese artificial‑intelligence ambitions and a revenue boost for Nvidia, the world’s leading AI‑chip maker....
AMD EPYC Venice Enters Production on TSMC 2nm Process
AMD announced that its next‑generation EPYC “Venice” processor is now ramping production at TSMC’s 2 nm fab in Taiwan, with later production planned for TSMC’s Arizona plant. Venice is the first high‑performance server CPU built on the 2 nm node, targeting cloud,...
Nokia, KDDI Test Energy-Efficient 6G Base Station Technology
Nokia Bell Labs and KDDI Research completed a proof‑of‑concept trial of Intelligent 4D Resource Optimisation Technology for 6G base stations, showing up to 40% lower power consumption at equal throughput and up to four‑fold throughput without extra energy. The month‑long...
AMD to Invest $10 Billion in Taiwan's AI Industry to Advance Top-End Chips
AMD announced a $10 billion investment in Taiwan's semiconductor and AI ecosystem, targeting advanced chip packaging and manufacturing. The program will partner with local firms such as ASE, SPIL, Sanmina, Wiwynn, Wistron and Inventec to accelerate development of its Helios AI...
Advancing Heterogeneous Integration Through Industry Roadmap Improvements
A multinational research team led by Intel published a perspective in Nature Reviews Electrical Engineering calling for a new generation of heterogeneous integration (HI) roadmaps. The paper argues that existing roadmaps lag behind rapid advances in AI, 5G/6G, and aerospace,...
Cost-Effective High-Performance Flip Chip MicroLeadFrame (fcMLF) Package Introduction
Amkor introduced the flip‑chip MicroLeadFrame (fcMLF), a hybrid package that merges the low‑cost, high‑volume leadframe process with the performance benefits of flip‑chip interconnects. The technology uses copper pillar bumps and supports fine‑pitch, fan‑in configurations while maintaining a wettable flank for...
Fraunhofer IPMS Develops Wafer-Level Chiplet Systems
Researchers at Germany’s Fraunhofer Institute for Photonic Microsystems (IPMS) have unveiled a wafer‑level quasi‑monolithic integration (QMI) technique that embeds chiplets into structured silicon pockets and levels them for back‑end‑of‑line wiring. The method bridges the gap between traditional chip packaging and...
Infineon 40V CoolGaN BDS Family Shrinks Portable Power Designs
Infineon has added two GaN bidirectional switches, the IGK048B041S and IGK120B041S, to its 40 V CoolGaN BDS family. The devices shrink PCB footprints by up to 82 percent and halve the component count by merging two MOSFETs into a single package. Both...
Scaling the Next Generation of Multi-Die Systems
The EE Times virtual conference on June 23‑24 will examine how to scale next‑generation multi‑die chiplet systems for AI workloads. Sessions focus on accelerating design flows, advanced packaging, interconnect standards and the thermal, power and yield challenges that arise at production...
Acer Veriton GN100 Packs NVIDIA Blackwell AI Compute Into Compact Workstation
Acer unveiled the Veriton GN100, a compact AI workstation built around NVIDIA’s DGX Spark platform and the GB10 Grace Blackwell Superchip. Despite measuring only 150 mm × 150 mm × 50.5 mm, the system delivers up to 1 petaFLOPS of AI performance, 128 GB of unified LPDDR5x memory, and a 4 TB...
Imec Unveils Quantum Dot Qubit Device Using High NA EUV Lithography
imec demonstrated a silicon quantum dot qubit array fabricated with High NA EUV lithography at ITF World. The device features 6‑nm gate gaps, enabling dense qubit integration compatible with 300 mm CMOS fabs. This marks the first integrated hardware using High...
This $3,999 AMD Mini PC Replaces Expensive Cloud AI without the Nvidia Price Tag
AMD unveiled the Ryzen AI Halo, a $3,999 mini PC that aims to replace costly cloud AI services and Nvidia's $4,699 DGX Spark workstation. Powered by a Ryzen AI Max CPU with up to 16 Zen 5 cores, a 40‑core integrated GPU...
AMD Ryzen AI Max 400 ‘Gorgon Halo’ Packs up to 192GB of Unified Memory — Refreshed APU Uses Zen 5...
AMD has refreshed its Ryzen AI Max line with the Gorgon Halo‑based Max 400 series, offering up to 192 GB of unified memory and Zen 5/ RDNA 3.5 cores. The top Max+ Pro 495 model clocks a 5.2 GHz boost, 16 CPU cores, and a 40‑CU Radeon 8065S iGPU. AMD positions...
AMD Launches New Ryzen Processors and Ryzen AI Halo Dev Platform
AMD unveiled the Ryzen AI Halo developer platform, now available for pre‑order at $3,999 and powered by the Ryzen AI Max+ 395 processor with up to 128 GB unified memory and 50 TOPS AI performance. The company also announced the upcoming Ryzen...
Spintronic Memory Switches in 40 Ps
University of Tokyo researchers have demonstrated a non‑volatile spintronic memory cell that flips its magnetic state in just 40 picoseconds using an antiferromagnetic Mn₃Sn‑tantalum stack. The switching is driven by spin‑orbit torque from ultra‑short electrical pulses, and the team also showed...
Cerebras Says Its Chips Run a Trillion-Parameter AI Model Nearly 7 Times Faster than GPU Clouds
Cerebras Systems announced that its wafer‑scale CS‑3 chip can run Moonshot AI’s trillion‑parameter Kimi K2.6 model at 981 tokens per second, 6.7× faster than the leading GPU‑based cloud provider and 23× faster than the median. In a 10,000‑token coding task, Cerebras...
Seagate Sparks Memory Sell-Off As CEO Says It Would 'Take Too Long' To Build New Factories
Seagate CEO Dave Mosley told investors that building new memory‑chip factories would take too long to satisfy the rapid surge in AI‑driven storage demand. He said the company will instead focus on maintaining four to five quarters of supply visibility...
MCUs Bridge I3C Across Voltage Domains
Microchip has launched the PIC18‑Q20 family of 8‑bit MCUs that embed up to two I3C peripherals and Multi‑Voltage I/O (MVIO) in ultra‑compact 14‑ and 20‑pin packages as small as 3 × 3 mm. The devices operate across three independent voltage domains, with MVIO‑enabled...
Motor MCU Integrates Driver and Control Functions
Toshiba has begun sampling the TB9M040FTG, a motor‑control device that merges an Arm Cortex‑M23 MCU with a 2 A three‑phase brushless‑DC driver. The part, part of the SmartMCD series, adds flash memory, a 5‑V high‑side driver, LIN transceiver and a hardware...
CPU IP Processes Mixed Scalar and Vector Workloads
SiFive unveiled its Performance P570 Gen 3, a RISC‑V out‑of‑order superscalar processor IP that blends scalar and vector execution. The chip promises a sizable performance uplift over the earlier P550 Gen 1 and complies with the mandatory RVA23 profile, including Hypervisor and...
Smart Glasses: Samsung and Google Take the Next Step in the AI Race
Samsung and Google have joined forces with fashion brands Gentle Monster and Warby Parker to launch a new generation of AI‑powered smart glasses, entering a market recently energized by EssilorLuxottica and Meta’s second‑generation release. The collaboration blends cutting‑edge vision technology...
Vishay’s New Automotive Optocouplers Combine 5300 VRMS Isolation and 11 Mm Creepage for EV Electronics Isolation Stages
Vishay Intertechnology has introduced two AEC‑Q102‑qualified optocouplers, the VOWA617A and VOWA618A, targeting high‑voltage isolation in electric‑vehicle power electronics. The devices deliver 5300 V RMS isolation, ≥11 mm creepage distance and a CTI of 600, exceeding typical automotive standards. They also offer a broader...
Amphenol Printed Circuits Shows PCBs of All Sizes at IMS2026
Amphenol Printed Circuits (APC) will exhibit a full spectrum of printed‑circuit‑board designs at the 2026 IEEE MTT‑S International Microwave Symposium in Boston, June 9‑11. The booth will feature high‑performance PCBs for rugged RF/microwave, high‑speed digital, and space‑qualified applications, ranging from tiny...
Alibaba Unveils New AI Chip as Nvidia Access Remains Stalled
Alibaba unveiled its Zhenwu M890 AI accelerator, claiming three‑times the performance of the earlier Zhenwu 810E and positioning it as a domestic alternative while Nvidia’s H200 chip remains stalled in China due to U.S. export restrictions. The new chip joins a Zhenwu...
India Just Signed Its Most Consequential Chip Deal. The Hard Part Starts Now.
India and the Netherlands sealed a landmark MoU between Tata Electronics and ASML, committing the Dutch firm to supply EUV lithography tools and support for a new semiconductor fab in Dholera, Gujarat. The plant, built with a 50 % government stake...
Building What Comes Next: Why Startups Need a Manufacturing-First Approach to Innovation
GlobalFoundries (GF) argues that semiconductor startups must embed manufacturability into early design decisions to avoid costly redesigns and capital inefficiency. The firm’s GF Labs and GF Accelerate programs provide startups with process design kits, multi‑project wafer runs, and venture funding...
Alibaba Bolsters AI Play with Fresh Chip, LLM
Alibaba unveiled its most powerful AI processor, the Zhenwu M890, featuring 144 GB of on‑chip memory and roughly three‑fold performance gains over its predecessor. The company also launched the Qwen3.7‑Max large language model, optimized for coding and autonomous, multi‑step tasks, and...
Hoth Plans Rocket One Rebrand and AI Chip Pivot
Hoth Therapeutics announced it will rename itself Rocket One, Inc. and restructure to focus on artificial‑intelligence semiconductor and spintronic computing technologies, while keeping its biotech programs in a separate subsidiary. The company secured exclusive licenses from Virginia Commonwealth University for...
Flexible Organic-Inorganic Hybrid Synapse Advances Physical Reservoir Computing
Researchers unveiled a flexible organic‑inorganic hybrid charge‑trap synapse that delivers non‑volatile, analog weight storage with fast response and high endurance, enabling low‑power physical reservoir computing. The device combines organic semiconductor flexibility with inorganic charge‑trap layers to emulate synaptic dynamics while...
Microsoft Set To Bring Biggest India Data Centre Online
Microsoft will launch its biggest data centre in Hyderabad by mid‑2024, part of a $20.5 billion investment in India. The facility aims to meet soaring demand for Azure cloud and Copilot AI services, which Indian firms such as Infosys, Cognizant and...
Schunk Supplies 123 Depot Charging Pantographs to King County Metro in Seattle
Schunk Transit Solutions is delivering 123 inverted SLS 201 pantographs to King County Metro’s Tukwila Base depot for electric‑bus charging. The equipment integrates into the depot structure rather than mounting on vehicle roofs, and full commissioning is planned for spring 2026. Metro...
MTN to Turn Its African Towers Into an AI Inference Grid
MTN Group announced it will retrofit its African cellular towers with open‑GPU hardware, creating a distributed AI inference grid that runs both radio functions and edge AI workloads. The move complements two new AI‑enabled data centres slated for South Africa...
China Reportedly Blocks NVIDIA GeForce RTX 5090 D V2 Imports
Chinese customs have reportedly denied import permits for NVIDIA's GeForce RTX 5090 D v2, a GPU specifically engineered for the Chinese market. The block appears to originate from Chinese regulators rather than new U.S. export controls, catching NVIDIA off guard. Because the card...
KIOXIA EXCERIA PRO G2 (PCIe Gen 5.0 NVMe SSD @ 14,9 GB/S) Review
Japanese memory maker KIOXIA has launched the EXCERIA PRO G2, a consumer‑grade PCIe 5.0 ×4 NVMe SSD delivering up to 14.9 GB/s sequential reads and 13.7 GB/s writes. The drive pairs its high bandwidth with integrated DRAM cache, a 110 % improvement in power efficiency, and a...