Arteris and MIPS Partner
Arteris and MIPS, a GlobalFoundries subsidiary, have announced a collaboration to speed the creation of physical AI computing platforms. MIPS will incorporate Arteris’ FlexGen smart NoC IP and Magillem SoC integration automation tools into its RISC‑V processor offerings, targeting high‑growth markets such as automotive MCUs, ADAS, robotics, and edge computing. The partnership aims to alleviate data‑movement bottlenecks, improve energy efficiency, and shorten time‑to‑market for domain‑specific silicon. Both companies see the joint solution as a way to deliver scalable, high‑performance AI‑enabled SoCs.
AGI Infinity Reveals Patent‑ready Optical Architecture
AGI Infinity announced that its patent‑ready "Wires to Waves" platform has completed two simulations confirming that holographic optical conductors (HOC) and holographic optical transistors (HOT) can operate together in a fully volumetric 3‑D construct. The technology seeks to replace selected...
Semiconductor EUV Photoresist Market to Hit $10.8 Billion by 2033
The global semiconductor EUV photoresist market is forecast to reach $10.8 billion by 2033, propelled by the shift to sub‑7 nm and sub‑3 nm process nodes. Accelerated adoption of extreme ultraviolet lithography, driven by AI workloads, data‑center expansion, and electric‑vehicle demand, underpins the...
Infineon Contributes Industrialisation Know-How to European Quantum Pilot Lines
Infineon Technologies is contributing its semiconductor‑manufacturing expertise to three European quantum pilot lines—CHAMP‑ION (ion‑trap chips), SUPREME (superconducting qubits) and SPINS (CMOS‑based quantum nano‑systems). The initiatives, backed by the EU Chips for Europe programme, aim to move quantum hardware from laboratory...
CEA-Leti to Present Advances in Next-Gen Chip Integration at ECTC 2026
CEA‑Leti will showcase breakthrough hybrid‑bonding technologies at ECTC 2026, including a die‑to‑wafer test vehicle with a 1 µm pitch and ultra‑low‑temperature annealing down to 100 °C. The research targets ultra‑fine vertical interconnects that overcome the scaling limits of traditional micro‑bump approaches. Presentations also...
The Real SpaceX Play: 5 Chip Stocks Powering the IPO Before It Launches
Investors are eyeing a potential $2 trillion SpaceX IPO, but the real engine behind the launch is a handful of semiconductor firms. Taiwan Semiconductor Manufacturing (TSMC) fabricates the AI‑chips that power Starlink and autonomous rocket landings, while Intel, AMD and NVIDIA...
AMD Ryzen AI Halo Mini PC Surfaces Ahead of Expected June Release
AMD’s first‑party Ryzen AI Halo mini PC, unveiled at CES 2026, has been spotted online ahead of its slated June launch. The system is built around the new Ryzen AI Max+ 395 processor and features a compact square chassis with ARGB lighting,...
These 3 AI Stocks Just Crushed Earnings: Still Time To Buy?
AI‑related earnings season delivered three standout performers as Seagate Technology, Silicon Motion Technology, and NXP Semiconductors all posted results that beat expectations and sparked roughly 20% share price gains. Seagate reported $4.10 EPS on $3.11 billion revenue, while Silicon Motion saw...
Samsung Is the Latest Tech Player to Bemoan Memory Chip Crunch. That's Good News for These Stocks
Samsung’s memory division disclosed a record‑low demand‑fulfillment rate as pre‑orders for DRAM and NAND are already being booked through 2027, signaling a widening supply gap. The shortage is hitting AI‑driven capex, which analysts expect could exceed $1 trillion by next year,...
Huawei Predicts 60% Revenue Boost From Sale of Its AI Chips in 2026
Huawei forecasts a 60% jump in AI‑chip revenue for 2026, targeting $12 billion versus $7.5 billion in 2025. The surge is anchored by strong orders for its Ascend 950PR processor, now in mass production, and an upcoming upgraded 950DT version slated for Q4....
TSMC to Invest $56B in Fabs This Year, and It’s Still Not Enough
Taiwan Semiconductor Manufacturing Company (TSMC) announced a 2024 capital‑expenditure plan of $52‑$56 billion, underscoring a record‑breaking first‑quarter profit surge of 58% and 41% revenue growth. The company’s revenue mix has flipped, with high‑performance computing now contributing 61% versus 26% from smartphones....
A New Type of Optical Chip Cuts Static Power While Enabling Electrical Reprogramming
Researchers at the University of Washington and MIT have created a programmable photonic integrated circuit called NEO‑PGA that eliminates static power consumption by using phase‑change materials. The chip can be electrically reprogrammed, retains its state without power, and is fabricated...
EU-Funded HiPower 5.0 Project Developing GaN-Based EV On-Board Chargers
The EU‑funded HiPower 5.0 project, led by Fraunhofer IZM, is creating a 22 kW gallium‑nitride (GaN) on‑board charger (OBC) that occupies only 4 L—about one‑third the size of today’s average 12 L units. By using monolithic bi‑directional GaN switches supplied by Infineon, the charger...
Spectacular Cash Generator Sandisk Generates Spectacular Pile of Dollars
Sandisk smashed its $4.8 billion outlook for Q3 FY2026, posting $5.95 billion in revenue—a 251% year‑over‑year surge driven by NAND price spikes and data‑center demand. GAAP net income rebounded to $3.62 billion from a $1.93 billion loss, while gross margin jumped to 78.4%. The...
How GlobalFoundries’ “Virtual Fabs” Are Redefining Semiconductor Manufacturing
GlobalFoundries introduced Global Fab Engineering Services (GFES), a "virtual fab" model that extends engineering support, data analytics and process optimization beyond the physical wafer fab. Launched in 2015 with a hub in Bengaluru focused on yield analytics, GFES added a...
Chart: How ROHM, Toshiba, Mitsubishi Tie-Up Could Reshape the Power Sector
ROHM Semiconductor, Mitsubishi Electric and Toshiba have signed an MOU to explore merging their power‑semiconductor divisions, which together hold about 11% of the global market. The combined entity would become the world’s second‑largest supplier of power devices, trailing only Infineon’s...
Qualcomm Developing Custom Silicon with Unnamed Hyperscaler as Company Continues to Plot Data Center Comeback
Qualcomm announced a partnership with an unnamed hyperscaler to develop custom silicon for data‑center servers, with first shipments slated for December 2026. The move follows the company’s FY26 Q2 earnings, where revenue rose to $10.6 billion and profit surged to $7.37 billion....
Lattice Wins 2026 AI Excellence Award for Edge AI
Lattice Semiconductor was named a 2026 AI Excellence Award winner by Business Intelligence Group, recognizing its Edge AI solution built with NVIDIA. The award highlights the combined Lattice CertusPro‑NX Sensor‑to‑Ethernet Bridge board and NVIDIA Holoscan Sensor Bridge, delivering a full‑stack...
ADI Rolls Out A²B 2.0 for Automotive Audio with Higher Bandwidth
Analog Devices announced that its A²B 2.0 automotive audio bus has entered full production. The new version boosts bandwidth to 98.3 Mbps in full‑duplex mode while keeping latency around 62 µs. It adds Ethernet tunneling via an OASPI interface and remains compatible with...
Tim Cook Warns About 'Significantly Higher Memory Costs' From June — and Not Surprisingly, Mac Fans Think Price Hikes Are...
Apple’s CEO Tim Cook warned that memory‑chip prices will rise sharply in the June quarter, putting pressure on Mac pricing. The company’s existing RAM inventory is depleting, forcing Apple to consider cost‑pass‑through options. Strong demand for AI‑focused Macs such as...
Altera Updates FPGA AI Suite for Edge AI Deployment
Altera has launched FPGA AI Suite 26.1.1, a major upgrade that adds a spatial‑mapping compiler to its AI software platform. The new compiler translates neural networks directly onto FPGA fabric, delivering ASIC‑like inference speed while preserving the re‑programmability of FPGAs....
Latest Issue of Semiconductor Today Now Available
Semiconductor Today released its April 2026 issue, a free monthly magazine covering the latest advances in compound semiconductors and advanced silicon materials. The issue features articles on gallium arsenide, indium phosphide, nitrides, silicon carbide, silicon‑germanium and related devices, including nano‑ridge lasers...
Advantech Brings Agentic AI to Jetson Thor Edge Platforms
Advantech unveiled its MIC‑AI series, a family of edge platforms built on NVIDIA Jetson Thor modules that can run generative and agentic AI workloads directly in factories and autonomous machines. The lineup includes MIC‑743, MIC‑742, MIC‑741 systems and MIB‑741, MIB‑742...
Broadcom Launches Wi-Fi 8 and 10G PON Chips to Boost Fiber Broadband Business for Operators
Broadcom unveiled its fourth‑generation Wi‑Fi 8 chipsets together with the BCM68565 10‑Gbps PON gateway SoC, targeting service providers in competitive, ARPU‑tight broadband markets. The integrated platform supports XGS‑PON, GPON and Active Ethernet while consolidating dual‑band Wi‑Fi 8 radios into a single silicon...
Western Digital and Sandisk Crush Wall Street Forecasts on Soaring AI Demand, but Stocks Fall
Western Digital and SanDisk posted spectacular earnings as AI‑driven demand lifted memory prices. Western Digital posted Q3 adjusted EPS of $2.72, 45% revenue growth to $3.34 billion, beating forecasts, while SanDisk reported EPS of $23.41 and revenue of $5.95 billion, up 251%...
QuantumDiamonds Deploys Tool at Taiwanese Test House
QuantumDiamonds GmbH has deployed its QDm.1 quantum‑sensing system at Integrated Service Technology (iST) in Hsinchu, Taiwan, marking the first Asian installation of the technology. The system provides non‑destructive, high‑resolution 3D imaging of current pathways in advanced chip architectures, including 2.5D/3D...
The Power Market: Three Applications, One Ecosystem
IDTechEx projects the global power electronics market to surpass $65 billion by 2036, driven by a 10% CAGR fueled primarily by data‑center expansion and electric‑vehicle (EV) adoption. Silicon IGBTs remain prevalent, but wide‑bandgap (WBG) devices—especially SiC MOSFETs—are set to dominate EV...
X-FAB Q1 Shows Strong Wide-Bandgap Growth
X‑FAB reported Q1 2026 revenue of $195.6 million, a modest 4% YoY decline, while its wide‑bandgap segment surged. SiC wafer shipments jumped 195% YoY to 14,300 units and wide‑bandgap revenue rose 152% YoY to $15.1 million. Microsystems achieved an all‑time‑high $33.7 million, up 42%...
Huawei’s AI Chip Sales Surge as Nvidia Stalls in China
Huawei reported a sharp rise in AI‑chip sales, driven by strong demand from Chinese cloud providers and data‑center operators. The company’s Ascend series saw revenue growth of roughly 70% year‑on‑year, while Nvidia’s sales in China slipped about 15% in the...
Low Noise Amplifier, PE2-15-5R06R0-3R5-21-12-SFF
Planar Monolithics (PMI) introduced the PE2-15-5R06R0-3R5-21-12-SFF, a low‑noise amplifier (LNA) operating from 5 to 6 GHz for military and industrial use. The device delivers 15 dB of gain with a tight gain flatness of ±0.5 dB and a typical noise figure of 3.5 dB,...
Continuous Lamination Unlocks Stable Production of Large-Area Flexible Circuit Boards
Researchers at Korea Institute of Machinery and Materials have unveiled a roll‑to‑roll (R2R) direct lamination process that enables continuous, large‑area production of flexible printed circuit boards (FPCBs). By systematically mapping how semi‑cured adhesive films fill circuit gaps under varying speed...
Athos Scraps Multi-Vendor Roadmap, Plans Chiplet Tape-Out
Athos Silicon, the functional‑safety chiplet startup spun out of Mercedes‑Benz, has abandoned its original multi‑vendor chiplet roadmap after Arm’s acquisition of DreamBig. The company will now tape‑out a single, purpose‑built chiplet that integrates third‑party CPU, GPU and NPU IP while...
Brain-Inspired Chip Could Reduce AI Energy Use by 70%
Researchers at the University of Cambridge have unveiled a hafnium‑oxide memristor that switches via an internal electronic interface rather than filament formation, promising ultra‑low power operation. The device achieves switching currents as low as 10⁻¹¹ A and energy consumption in the...
GaN Ka-Band QFN Packaged Power Amplifier: NPQ2107-SM
Nxbeam has launched the NPQ2107‑SM, a GaN Ka‑Band power amplifier packaged in a QFN form factor. The device operates from 27.5 GHz to 31 GHz, delivering 17 W saturated output, 29% power‑added efficiency and 22 dB linear gain. In linear mode it supplies over...
Fast Load Transient - FLT 150A
The Fast Load Transient (FLT) 150A from Noffz is a high‑performance load‑step instrument built for next‑generation power‑management IC validation. It achieves up to 150 A/µs slew rates with 200 ns pulse resolution, leveraging an FPGA‑based architecture for nanosecond‑level determinism. Integrated measurement hardware includes...
Samsung Surprises on Phone Front as Chip Prices Drive Record Profit
Samsung shipped 65.4 million smartphones in Q1, an 8% year‑over‑year rise that kept it ahead of Apple’s 60.4 million units. Global handset shipments grew only 1% as vendors front‑loaded inventory, creating a looming overhang. Samsung’s Device Solutions division drove record Q1 revenue...
Samsung and SK Hynix Warn AI-Driven Memory Shortages Could Last Until 2027 and Beyond, as HBM Demand Explodes — Customers...
Samsung and SK Hynix warned that AI‑driven memory shortages, especially for high‑bandwidth memory (HBM), could persist through 2027 and beyond. Customers are already reserving supply years in advance, reflecting record‑low fulfillment rates. The shortage is spilling into the broader DRAM...
Intel and AMD Form X86 Ecosystem Advisory Group
Intel and AMD announced the formation of an X86 Ecosystem Advisory Group, bringing together a slate of industry heavyweights such as Broadcom, Dell, Google, HP, HPE, Lenovo, Meta, Microsoft, Oracle, Red Hat, Epic Games and the Linux Foundation. The group’s charter...
Wafer Dicing Service | Silicon Wafer Dicing & Die Singulation
Wafer dicing separates processed wafers into individual dies, a step that directly influences yield and downstream packaging reliability. AnySilicon offers a matchmaking platform that connects fabless designers, MEMS developers, and research labs with qualified dicing service providers across a broad...
Google Tensor SoC Thread
Google’s Tensor G3 custom SoC powers the Pixel 8 and Pixel 8 Pro, featuring a Cortex‑X3 prime core, Cortex‑A715 and A510 efficiency cores on Samsung’s 4LPP node, and a Mali G715 MP7 GPU. Leaked data suggests three packaging variants—iPoP, fan‑out panel‑level (Fo‑PLP), and fan‑out wafer‑level...
Power Corner: Renesas’s Grid-to-Core Strategy for 800 V Data Center Power Architecture
Renesas is promoting a grid‑to‑core power architecture that moves data‑center power delivery from traditional side‑car racks to a unified 800 V DC bus using solid‑state transformers. The approach combines GaN‑based Vienna rectifiers, an LLC DCX isolated DC‑DC platform, and matrix transformers...
Prices of Nvidia’s B300 Server at 7 Million Yuan in China on US Curbs: Sources
Strong demand for AI compute in China has pushed Nvidia's B300 server price to about ¥7 million (≈$980,000), nearly double the 2025 level. The surge follows tighter U.S. export restrictions and a crackdown on grey‑market smuggling, creating a scarcity premium. Chinese...
Qualcomm, Samsung, MediaTek Expect Hit in Handset Revenues as Component Shortages Bite OEMs
Chipmakers Qualcomm, Samsung and MediaTek warned that memory‑module shortages, driven by AI data‑center demand, will depress smartphone revenues in 2026. Qualcomm expects Q2 handset revenue to fall from $6 billion to about $4.9 billion, with a bottom in Q3 before a modest...
MediaTek Sees Nearly 10% Annual Revenue Growth Despite Likely Q2 Setback
Taiwan‑based fabless chipmaker MediaTek expects second‑quarter 2026 revenue to be flat or fall up to 6%, ranging between NT$140.2 billion and NT$149.2 billion (approximately $4.43‑$4.77 billion). Despite the near‑term dip, the company projects an almost 10% rise in full‑year revenue, driven by a...
AOI Awarded $20.9m Texas Semiconductor Innovation Fund Grant
Applied Optoelectronics Inc (AOI) has secured a $20.9 million grant from the Texas Semiconductor Innovation Fund to fund a 210,000 ft² manufacturing expansion in Sugar Land, Texas. The new facility will become one of the nation’s largest production sites for AI‑focused data‑center...
Google's Tensor G6 Rumors Nearly Had Me Hyped, but It Might Let Me Down
Leaked specifications suggest Google’s upcoming Tensor G6 SoC will adopt a 1+4+2 core configuration, featuring a 4.11 GHz C1‑Ultra prime core and a mix of C1‑Pro cores. The rumor also claims the chip will use the five‑year‑old PowerVR C‑Series CXTP‑48‑1536 GPU,...
Nexperia China Says Operations Stable After Parent Risk Warning
Nexperia China announced that its manufacturing and financial operations in China remain stable despite a risk warning issued to its parent, Wingtech Technology, after the latter’s latest financial disclosure. The company emphasized that the warning stems from external factors affecting...
Tower Semiconductor and Axiro Push High-Efficiency SiGe for Next-Gen Radar
Tower Semiconductor and Axiro Semiconductor have introduced a new family of silicon‑germanium (SiGe) beamforming ICs for Ku‑ and X‑band radar and satellite communications. The devices, now moving to volume production in Tower’s U.S. fabs, promise higher gain, linearity, output power...
ISM 2.0 Must Support Ecosystem Development, Says American Synopsys
Synopsys senior vice‑president Prith Banerjee urged the Indian government to treat the upcoming ISM 2.0 programme as an ecosystem initiative rather than a collection of isolated incentives. The centre plans to allocate roughly ₹1,000 crore (about $120 million) for FY27, building on the...
Creating Agentic EDA Methodologies
The article examines the emerging push for agentic AI methodologies in electronic design automation (EDA), emphasizing the need for AI to operate across diverse data formats and abstraction levels. It highlights the scarcity of architectural‑level tools and the lack of...