Today's Hardware Pulse
Nvidia driver hints at next‑gen DLSS 5 work
Nvidia’s GeForce Game Ready driver 610.47 adds three new profile options—Enable DLSS NR override, Enable DLSS NR SL override, and Override DLSS NR presets—suggesting continued development of DLSS 5 neural‑rendering technology. The earlier DLSS 5 reveal had sparked debate over AI‑driven image alteration, and the new driver hints at a quiet but ongoing effort.
Also developing:
By the numbers: Cyient Semiconductors raises $30M Series A
Huawei Unveils Chip Tech Intended to Ensure Chinese Independence
Huawei unveiled the Tau Scaling Law, a new semiconductor design paradigm that de‑emphasizes transistor shrink in favor of time‑based scaling and LogicFolding architecture. The company claims the approach can deliver chips equivalent to a 1.4 nm process by 2031, with the upcoming Kirin line set to be the first to use it. Over six years Huawei says it has already mass‑produced 381 chips using the method. The announcement targets U.S. export restrictions that block China from EUV lithography and aims to boost Chinese chip self‑sufficiency.
Infineon Expands CoolGaN BDS Family
Infineon Technologies has added two gallium‑nitride bidirectional switches, the IGK048B041S and IGK120B041S, to its CoolGaN BDS 40 V G3 family. The larger device offers 4.2 mΩ RDS(on) while the smaller delivers 9 mΩ, both in ultra‑compact wafer‑level packages. Compared with silicon MOSFETs, the...
SK Hynix Unveils iHBM Thermal Solution, Cutting HBM5 Heat Resistance by 30%
SK Hynix introduced its iHBM thermal management package for next‑generation high‑bandwidth memory, claiming a 30% reduction in thermal resistance for HBM5 chips. The solution embeds cooling elements inside the memory stack and is compatible with existing SiP architectures, promising smoother...
A Battery-Powered Starlink Mini Is Likely on the Way
SpaceX’s Starlink Mini appears poised for a battery‑integrated version, as recent firmware reveals a “DishBatteryStats” module that tracks charge level and charging state. The code also defines three power states, indicating the dish can run on USB‑C, its internal battery,...
Oticon Medical Launches Ponto Instant Portfolio to Expand Non-Surgical Bone Conduction Hearing Options
Oticon Medical unveiled the Ponto Instant portfolio, a non‑surgical bone‑conduction hearing solution that adds two new wearables: the Instant HearBand and the Instant SoundConnector. The HearBand offers a lightweight, behind‑the‑head design with adjustable sizing, while the SoundConnector lets users attach...
ELECOM Introduces Semi-Solid-State Power Bank With 2,000-Cycle Battery Lifespan
ELECOM unveiled the DE‑C85‑5000 series, a 5,000 mAh power bank built on semi‑solid lithium‑ion technology, slated for release in late May 2026. The semi‑solid cells claim about 2,000 charge cycles—roughly four times the lifespan of conventional liquid‑electrolyte chargers. The device adds a...
GUC Showcases VSORA’s Jotunn8 AI Inference Processor at TSMC Europe Technology Symposium
Global Unichip Corp. (GUC) will showcase VSORA’s Jotunn8 AI inference processor at the TSMC Europe Technology Symposium. The chip, built on TSMC’s 5nm node with HBM3E and 2.5D CoWoS packaging, delivers ultra‑low latency and high throughput for data‑center workloads. GUC...
Researchers From the University of Oulu and the University of Tokyo Demonstrate Drone-Mounted 5G Base Station for Emergency Communications
Researchers from the University of Oulu and the University of Tokyo have successfully demonstrated a drone equipped with a compact 5G base station and satellite backhaul, delivering stable mobile coverage in a controlled test environment. The proof‑of‑concept was carried out...
Huawei Unveils "LogicFolding" Chip Design to Bypass US Sanctions
Huawei announced a "LogicFolding" chip‑design breakthrough that it says will let it produce 1.4‑nanometer‑class performance by 2031 without relying on US‑blocked lithography tools. The move intensifies China’s push for semiconductor self‑sufficiency amid ongoing export restrictions.
Huawei Unveils "Tau Scaling Law" Chip Design to Sidestep U.S. Sanctions
Huawei announced a new semiconductor design methodology called the "Tau Scaling Law," led by chief architect He Tingbo. The approach shifts focus from transistor shrinkage to system‑level performance, seeking to keep China competitive despite U.S. technology bans.
UBS Says AI-Fueled Earnings Keep Asian Stocks Buoyant Despite High Japanese Bond Yields
Tan Min Lan of UBS Global Wealth Management argues that AI-driven earnings growth is keeping Asian equities attractive despite Japan's elevated JGB yields, with North Asia expected to post blockbuster earnings this year.
NT Radar to Improve Real-Time Observation of Rainfall, Wind Conditions
The Bureau of Meteorology is finalising design work on a dedicated S‑band dual‑polarised Doppler radar at Tennant Creek Airport, slated to become operational by mid‑2027. The high‑power radar will serve the Barkly region—including Tennant Creek, Elliott and surrounding First Nations...
Detecting Defect-Induced Silent Data Corruptions in CPUs (Stanford, Google)
Stanford and Google researchers introduced ITHICA, an intra‑thread instruction‑checking framework that uncovers defect‑induced silent data corruptions (SDCs) in CPUs. The method challenges the long‑standing assumption that silicon defects produce consistent errors, showing that identical instructions can yield divergent results depending...
An Agent-Driven End-to-End HW-SW Co-Design Benchmark for Heterogeneous SoCs (Columbia, IBM)
Columbia University and IBM Research introduced HSCO-Bench, the first benchmark that tests large language model (LLM) agents on end‑to‑end hardware‑software co‑design for heterogeneous system‑on‑chips. The suite runs on an open‑source SoC platform and deploys generated designs to an AMD Virtex‑7...
After Wearing Sennheiser's Momentum 5, I'll Never Doubt the Company's Competitive Edge Again
German audio maker Sennheiser has launched the Momentum 5, its latest flagship over‑ear headphones, adding Dolby Atmos support, enhanced active noise cancellation with four microphones per ear cup, and an eight‑band equalizer in its Smart Control Plus app. The new model retains...
Michael Burry Warns Nvidia AI Demand May Be Temporary, Sparking Chip Supply Chain Alarm
Investor Michael Burry warned that Nvidia's AI‑driven revenue surge could be fleeting, citing a concentrated buyer base and a “bullwhip” effect that threatens the semiconductor supply chain. He highlighted $119 bn of non‑cancellable orders with TSMC and warned a 20% cut...
Nvidia Flags Taiwan Supply‑Chain Bottlenecks as Vera Rubin Ramp Stresses TSMC CoWoS Capacity
Nvidia CEO Jensen Huang landed in Taiwan on May 23 to meet TSMC’s chairman and lock in production for the six‑chip Vera Rubin AI platform, warning that the ramp will overload the island’s advanced‑packaging capacity. The trip follows Nvidia’s record Q1...
Samsung Readies $1,099 Galaxy Z Flip 8 for July Unpacked Amid Flip‑phone Uncertainty
Samsung is set to unveil the Galaxy Z Flip 8 at a July 22 Unpacked event, with rumors pointing to a $1,099 price tag, a 6.9‑inch 1080p 120 Hz folding OLED display and a modest camera bump. Analysts warn the device could...
UBS Boosts ASML Target to €1,900 ($2,050), Names It Top Euro Chip Pick
UBS analysts have upgraded ASML Holding to their highest-rated European semiconductor pick and raised the price target to €1,900 (about $2,050), up from €1,600 ($1,730). The Dutch firm’s 2027 capacity outlook and expanding memory‑market exposure underpin the bullish stance, signaling...
AI Speeds up Discovery of Next-Gen Computer Chips and Electronic Materials
An international team led by Flinders University and Khalifa University has created a machine‑learning platform that uses Bayesian optimization to discover new gallium‑based semiconductor materials. The AI engine learns chemical rules from thousands of existing compounds and proposes only chemically...
Ring Battery Doorbell Pro $250 4K Wi‑Fi Doorbell Signals Surge in High‑Res Home Security
Ring launched its Battery Doorbell Pro, a $250 battery‑powered video doorbell that streams 4K retinal video over Wi‑Fi. The product’s untethered design and premium resolution underscore a growing market for high‑bandwidth home security devices, putting new pressure on broadband providers.
Analysts Warn Taiwan's Chip Dominance Threatens Global Supply Chains if China Takes Control
Fox News analysts warned that Taiwan’s control of advanced semiconductor manufacturing, led by TSMC, underpins smartphones, AI and precision‑guided munitions. A Chinese takeover would give Beijing a stranglehold on supply chains worth trillions and erode U.S. technological advantage.
Dell Unveils PowerStore Elite, Boosting Data Lake Performance Up to 3×
Dell Technologies introduced PowerStore Elite, a software‑defined storage platform that promises up to three times the performance and throughput of prior generations, 5.8 petabytes of capacity in a 3U chassis, and a 6:1 data‑reduction guarantee. The launch targets enterprises wrestling with...
Download the Guide to Multi-Gig Automotive Ethernet Validation
Pickering Interfaces released a white paper on validating 10GBASE‑T1 automotive Ethernet using MEMS‑based fault insertion. The guide explains how engineers can replace lengthy road‑testing with automated lab simulations of real‑world connectivity faults. It details methods to improve repeatability, protect signal...
Xiaomi Unifies AI Governance Across Phones, Vehicles, and Edge
Most enterprise AI governance policies were written when the phone and the AI were two separate things. @Xiaomi Technology has changed that. At scale, and already in employee pockets across Asia. Here is what the stack looks like across six layers: • Silicon:...
Razer Huntsman V3 Pro TKL 8kHz Review: The Fastest, Most Precise Competitive Gaming Keyboard Ever Made?
The Razer Huntsman V3 Pro TKL 8KHz is a tenkeyless gaming keyboard that pushes Razer’s V3 platform to its limits with an 8,000 Hz HyperPolling rate, 2nd‑Gen Analog Optical switches, Snap Tap and Rapid Trigger technologies. Priced at $169.99, it delivers sub‑0.13 ms...
CPO Test Interfaces Lead Next AI Optics Revolution
(2) From Electrons to Photons: CPO Test Interfaces Become the Next AI Infrastructure Battleground This is why CPO is viewed as an important direction for the next stage of AI infrastructure. As 800G, 1.6T, and even higher-speed interconnects become standard, optics...
Huawei May Launch Kirin with 20‑30% Yield
Apple/Intel/Samsung typically want to get 80-90% yield before releasing a product. That includes all binning after final packaging. What's the bet that Huawei are willing to accept 20% or 30% for Kirin?
Google Begins Limited TPU Rollout to Select Data‑Center Customers, Challenging Nvidia
Alphabet's Google announced a limited rollout of its custom Tensor Processing Unit (TPU) AI accelerator chips to a handful of data‑center customers, including Anthropic and a tentative deal with Meta. The move, backed by a $5 billion Blackstone joint‑venture, signals Google’s...
Blackstone and Google Launch $5 B AI Data‑Center JV Targeting 500 MW by 2027
Blackstone announced a $5 billion joint venture with Google to develop AI‑focused data centers in the United States, with a goal of bringing 500 MW of capacity online by 2027. The partnership, revealed weeks after Blackstone’s Q1 earnings fell short of expectations,...
Room‑Temperature Electron Beam Technique Enables Nanoscale Chip Patterning
Rice University scientists have demonstrated a room‑temperature electron‑beam method that creates ordered nanoscale wrinkles on hard chip materials such as silica. By pairing the beam with alpha‑molybdenum trioxide as a stress source, the process forms optical gratings in a single...
D‑Wave’s Order Backlog Jumps Almost 2,000% as Quantum Annealing Gains Traction
D‑Wave Quantum announced that its Q1 2026 order backlog grew nearly 2,000% year‑over‑year, with bookings reaching $33.4 million. The surge stems from a $20 million purchase by Florida Atlantic University and a $10 million agreement with an unnamed Fortune 100 company, underscoring rapid commercial...
CardputerZero – A Raspberry Pi CM0 Pocket Computer for Makers (Crowdfunding)
M5Stack’s CardputerZero is a credit‑card‑sized Linux computer built around the Raspberry Pi Compute Module Zero, offering a 46‑key keyboard, 1.9‑inch LCD, Ethernet, USB‑C, and optional camera and IMU. Two models launch on Kickstarter – the Lite at $59 and the full...
You May Not Know Actions Technology, But You’ve Definitely “Heard” It
Actions Technology, a Zhuhai‑based IC designer, has evolved from pioneering China’s first MP3 SoC in 2001 to supplying high‑fidelity Bluetooth and proprietary 2.4 GHz audio chips for leading global consumer‑audio brands. Its self‑developed Bluetooth stack and NGPP‑2.4G protocol achieve 9 ms latency,...
Biznet Enhances Digital Infrastructure and Connectivity with Ciena
Biznet has upgraded its submarine cable Biznet Nusantara Cable System‑1 (BNCS‑1) with Ciena’s WaveLogic 5 Extreme (WL5e) technology, boosting capacity to 400 Gbps across Java, Sumatra and Bangka. The deployment, supported by Ciena Services and Terrabit Networks, also integrates Ciena’s Navigator Network Control...
Realising the Benefits of Quality Inspection Reports
PCBWay has released 14 independent quality inspection reports generated by Centre Testing International, showcasing thermal, mechanical and electrical performance that exceeds typical industry benchmarks. The reports reveal a glass transition temperature of 169.6 °C, a coefficient of thermal expansion of 37.4 ppm/°C,...
Huawei Claims 1.4nm-equivalent Chips by 2031, Narrowing Gap with TSMC
Huawei announced it will achieve transistor density comparable to a 1.4‑nanometre process by 2031 using its newly disclosed Tau Scaling Law and LogicFolding architecture. The claim, made at a Shanghai symposium, positions the Chinese giant to close the three‑year lead...
Computex 2026: Nvidia N1X AI Chip Preview, Intel Gaming Handhelds, and RAM Shortage Response
Nvidia, Intel and storage innovators converge at Computex 2026 in Taipei, where Nvidia is expected to preview its N1X AI chip, Intel will showcase next‑generation gaming handhelds, and the industry confronts a tightening RAM supply. The event, running June 2‑5, signals...
XPeng Starts Mass Production of L4 GX Robotaxi in Guangzhou
XPeng has begun mass production of its GX robotaxi, a Level‑4 autonomous vehicle built in Guangzhou, featuring a 3,000‑TOPS vision‑only computing stack and four Turing AI chips. The move makes XPeng the first Chinese automaker to launch series production of...
How Enterprise Storage Vendors Are Responding to the Memory Crunch
AI-driven data‑center expansion is straining DRAM supplies, with Trendforce projecting the technology will consume 20% of global DRAM wafer capacity by 2026. The shortage is prompting major enterprise storage vendors—Dell, Everpure (formerly Pure Storage), HPE, and NetApp—to lift prices and...
Huawei Proposes New Path for Chips as Moore’s Law Runs Out of Road
Huawei unveiled its "Tau Scaling Law" at the 2026 ISCAS conference, proposing time‑based scaling instead of traditional geometric shrinkage. The approach hinges on a new LogicFolding architecture that shortens signal paths to boost transistor density without cutting‑edge lithography. Huawei claims...
Intel Reportedly Developing GPU-Focused Nova Lake Edge AI Processor with Unusual 8E+12Xe Configuration
Intel is reportedly developing a Nova Lake processor built around an 8E+12Xe configuration, pairing eight efficiency cores with a high‑end integrated Xe graphics engine while omitting traditional performance cores. The design emphasizes GPU‑centric compute for edge AI workloads such as small‑language‑model...
Huawei Claims Chip Design Breakthrough
Huawei announced that its next‑generation chips will achieve transistor density comparable to a 1.4 nm process within five years, a milestone that would place the Chinese firm near the global frontier of semiconductor technology. The claim was made at a Shanghai...
Exposed Charging Pins on Valve Steam Controller Puck Raise Safety Questions
Valve is probing a safety issue with the Steam Controller's charging puck after a Reddit user reported that a metal Google Pixel Watch 3 band shorted the puck's exposed pogo pins, causing it to overheat and nearly start a fire. The...
Huawei Says It Has Workaround to Match Leading Chips
Huawei Technologies announced it has devised a workaround that could enable the company to produce chips comparable to Intel’s most advanced products by 2031. The method sidesteps the need for the cutting‑edge lithography machines that the United States has barred...
Why Is Samsung's A Series Cheaper Than Its S Series
Samsung’s Galaxy A series is positioned as a value‑oriented line, with prices from $199.99 to $549.99, while the flagship S series starts at $649.99 and tops out at $1,599.99 for the 1 TB Ultra model. The A line adopts premium features—IP68...
Edge‑Compute Platforms Become Essential for Tesla Optimus‑Powered Factories
Tesla's Optimus humanoid robot deployment is forcing manufacturers to replace traditional automation back‑ends with low‑latency edge‑compute clusters. The shift highlights the need for ruggedized GPU servers and ultra‑fast networking to keep AI‑driven robots operating safely and efficiently on the shop...
Applied Materials Posts Record Q2 FY2026 Revenue, Forecasts >30% Equipment Growth Amid AI Surge
Applied Materials announced record quarterly revenue and a 54.8% gross margin for its Semiconductor Systems segment, driven by soaring AI-related semiconductor demand. The company said its equipment business will grow more than 30% this calendar year and highlighted eight‑quarter customer...
Dell Launches On-Prem AI Factories with ChatGPT, Gemini, Grok
Dell Technologies announced its AI Factory at the DTW 2026 conference, bundling OpenAI's ChatGPT, Google's Gemini and xAI's Grok on PowerEdge servers for on‑premises deployment. The move targets regulated sectors seeking data‑residency and cost‑effective token usage, while positioning Dell for...
Worth It to Grab a New CPU Now to Get Ahead of Intel and AMD Possibly Cutting Back Production?
Rumors are circulating that Intel and AMD may scale back PC‑focused CPU production and redirect capacity to server‑grade silicon as consumer demand weakens and component prices stay high. The shift could tighten retail inventories and push up prices for current‑generation...