
Intel leaks 44‑core Nova Lake‑S desktop processor, up from 42 cores
Intel’s upcoming Nova Lake‑S desktop line now includes a leaked 44‑core SKU, replacing the previously announced 42‑core model. The design uses two identical 8P+12E compute tiles, freeing up 6P+12E tiles that could be sold as lower‑priced, locked non‑K variants with on‑die big last‑level cache (bLLC).

Rohde & Schwarz and LITEON demonstrated a production‑optimized test setup at MWC Barcelona 2026, using the PVT360A vector performance tester to characterize four FlexFi 5G femtocells in parallel. The PVT360A’s 2 × 8‑port architecture and smart‑channel technology cut testing time by 50 percent, enabling fully automated calibration on LITEON’s manufacturing lines. The joint demo highlighted the platform’s ability to handle non‑signaling 5G NR FR1, LTE, multi‑component carrier and advanced MIMO scenarios within a compact footprint. Both companies see the solution as a catalyst for scaling 5G small‑cell production.
ESAB, together with Linde Gas & Equipment, unveiled the Ruffian EMP 270G engine‑driven welding generator at CONEXPO‑CON/AGG 2026, offering show‑only pricing and bundled accessories. The unit delivers 270 A at a 100 % duty cycle and 11 kW of generator power from a 23.5‑HP KOHLER...

At the 2026 Chiplet Summit, Synopsys unveiled an AI‑driven, agentic approach to multi‑die design that promises to automate and accelerate the entire workflow. The semiconductor industry is shifting toward heterogeneous chiplet architectures and 3‑D stacking, creating unprecedented design complexity. AI...

AI‑ready Aitech SP1 single‑board computer now incorporates Teledyne e2v’s QLS1046 space‑qualified SoC. The chip features four 64‑bit Arm Cortex‑A72 cores, DDR4 memory with error correction, and radiation tolerance up to 100 krad, enabling reliable operation in LEO, GEO, lunar and deep‑space...

The NDSS 2025 paper introduces Borrowed Time, a countermeasure that protects integrated circuits from emerging static side‑channel attacks such as static power analysis, laser logic state imaging, and impedance analysis. By continuously monitoring a device and securely erasing key‑dependent data...

Microsoft clarified that Windows 11 will not drop support for legacy V3 and V4 printer drivers, countering earlier reports. Existing drivers remain functional and available via Windows Update, while new driver submissions are blocked by default and require case‑by‑case approval starting...

Multimatic Motorsports completed a full‑distance endurance race using Conflux Technology’s 3D‑printed, configurable transmission oil cooler. The additive‑manufactured unit was produced in two weeks and delivered roughly 20% more heat rejection than the legacy cooler while fitting within the same compact...

DigiKey will showcase more than a dozen new embedded‑system products from leading suppliers at Embedded World 2026 in Nuremberg, Germany. The booth (4A‑633) features live demos ranging from thread‑network sensor arrays to single‑pair Ethernet video streaming and AI‑enabled microcontrollers. DigiKey...

China plans to quintuple its leading‑edge chip output within two years, raising 7 nm and 5 nm wafer starts from under 20,000 to about 100,000 per month. The long‑term goal is to reach 500,000 advanced‑node wafers monthly by 2030. SMIC, the only...
Researchers have demonstrated lead‑free all‑inorganic double perovskite Cs2AgBiBr6 memristors that combine robust analog resistive switching with biologically relevant synaptic plasticity. The devices rely on reversible Ag⁺ ion migration to form filamentary conduction paths, as confirmed by impedance spectroscopy, c‑AFM, and...

MathWorks announced its membership in the EDGE AI Foundation, a consortium dedicated to energy‑efficient artificial intelligence for edge devices. The partnership will let engineers leverage MATLAB and Simulink to train, integrate, and deploy AI models on embedded hardware while validating...

Stratasys announced a 22% year‑over‑year reliability increase for its F900 industrial 3D printer, driven by manufacturing enhancements co‑developed with its Customer Advisory Board (CAB). The CAB, composed of aerospace, defense and automotive leaders, identified production‑scale barriers and helped shape improvements...
AMD announced the EPYC 8005 “Sorano” series, a Zen 5‑based, single‑socket processor line succeeding the 8004 “Siena” family. Designed for 1P servers, the chips target telco and radio‑access‑network workloads with a focus on performance‑per‑dollar and performance‑per‑watt. The series promises high core counts,...

Infineon’s recent paper introduces Saarthi, an autonomous AI formal verification engineer that leverages multi‑agent LLM frameworks to generate, prove, and analyze RTL properties. The system creates English‑language verification plans, refines SystemVerilog assertions, and runs Cadence’s Jasper model‑checker in an iterative...
Arm and Linaro have unveiled the CoreCollective consortium, an open‑source‑focused alliance aimed at accelerating the Arm software ecosystem. The group is financially backed by Arm and invites any vendor to join for free. Founding members include AMD, Ampere, Canonical, Google,...

Scality and WEKA announced that Scality RING will serve as the back‑end object store for WEKA’s NeuralMesh high‑performance AI file system. The partnership leverages NeuralMesh’s SSD‑based front‑end with RING’s cost‑efficient, disk‑based object tier, delivering up to ten times faster performance than...

This isn’t new. Here’s an article from 2024. US Generals have publicly indicated 2027, but the recent PLA leadership purge should be alarming. And China realizes they need bleeding edge GPU to keep pace with US models and datacenters. Alarmed...
STIGA S.p.A. has partnered with SiMa Technologies to embed SiMa.ai’s low‑power Physical AI ML‑SoC into its next‑generation robotic lawn mowers for both consumer and commercial use. The integration enables ultra‑low‑latency, edge‑based decision‑making while reducing power draw, resulting in lighter, more...

Astera Labs reported record FY2025 revenue of $852.5 million, a 115% year‑over‑year increase, and a Q4 revenue of $270.6 million, up 17% sequentially. GAAP operating margin reached 20.3% for the year, while non‑GAAP margin was 39.2%, reflecting strong profitability. The company began...

Nimbus Data introduced FlashMax, a next‑generation multiprotocol all‑flash platform that consolidates block, file and object storage into a single namespace. The system adds DirectLink PCIe expansion, hardware‑accelerated deduplication and compression, and rack‑level resiliency, supporting up to 20 PB raw (100 PB effective)...

Intelligent Memory Ltd. (IM) has launched a new low‑density eMMC product line, offering 8 GB and 16 GB capacities in a 153‑ball BGA package for industrial applications. The devices target environments requiring stability, longevity and right‑sized storage, such as factory automation, medical...

AutomationDirect announced the addition of Penn‑Union split bolt connectors, aluminum power bars, and bronze service post connectors to its catalog. The split bolts accommodate CU‑CU, CU‑AL, and AL‑AL conductor pairs, while the power bars support two to four conductors in...
Japanese tech giant Toshiba and MIRISE Technologies have embedded their Simulated Bifurcation Machine, a quantum‑inspired optimization engine, into an autonomous mobile robot. The on‑board FPGA runs a new multi‑object tracking algorithm at 23 frames per second, delivering up to 23%...
Mersen has introduced its Critical Power Panel (CPP) series, a fully customizable fused panelboard that combines a lightweight design with a reduced footprint. Targeted at NEC‑required and non‑required applications—including UPS systems, data centers, medium‑voltage eHouses, emergency circuits, and DC utility...

Dual Inventive has completed field trials of its next‑generation rail safety suite, including the RCS 3000 remote‑control signal, the RSS 3000 PC off‑grid points controller, and the RDI 3000 v2 remote detonator isolator. Tests in Germany, France, Belgium and the UK demonstrated clear visibility...

The Trump administration will deploy DARPA’s Open Price Exploration for National Security (OPEN) AI system to establish reference prices for critical minerals, starting with germanium, gallium, antimony and tungsten. The tool calculates fair values by stripping out alleged Chinese market...
Dell and Lenovo laptops with Nvidia CPUs 'could come in the first half of this year' — so get ready for some thin-and-light gaming powerhouses (hopefully) https://www.techradar.com/computing/cpu/dell-and-lenovo-laptops-with-nvidia-cpus-could-come-in-the-first-half-of-this-year-so-get-ready-for-some-thin-and-light-gaming-powerhouses-hopefully
This is where the shift from research → real hardware starts. NYC expansion + hires from Apple, Meta & Samsung shows $BTQ moving toward silicon validation and commercialization. Quantum-secure chips are starting to look like real execution. 👀
D7VK version 1.4 has been released, extending its Direct3D 5‑7‑via‑Vulkan translation layer for Wine and Proton. The update introduces colour‑key transparency, fixing opaque artifacts in titles such as Arx Fatalis and Divine Divinity. It also consolidates legacy DDraw support, enabling games...
The Legacy Friction: Integrating Intelligence into Iron - the structural, technical, and cultural resistance that occurs when you try to integrate 21st-century autonomous intelligence into 20th-century physical iron. https://t.co/6dgJ5aZe4w

Tattvam AI, a deep‑tech startup focused on AI‑driven semiconductor design, closed a $1.7 million pre‑seed round led by Seedcamp. The funding will expand its engineering team, accelerate research, and bring its first product to market within months. The company’s AI reasoning...

NXP has introduced two 10BASE‑T1S Physical Medium Dependent transceivers – the automotive‑grade TJA1410 and the industrial‑grade TJF1410 – that offload only the analog front‑end while the digital PHY resides in the host MCU or switch. Both devices use a three‑pin...
Efficient Power Conversion (EPC) unveiled the EPC91122, a 3‑phase BLDC motor‑drive inverter evaluation board tailored for humanoid robot joint applications. The board incorporates EPC’s EPC33110 GaN ePower Stage, delivering up to 20 A RMS (28 A peak) in a 32 mm‑diameter core while supporting...

Ireland has launched I‑C3, a National Competence Centre in Semiconductors dedicated to startups and SMEs. The centre, coordinated by Tyndall National Institute and co‑funded by the EU Chips Joint Undertaking, offers funding pathways, design tools, training and access to pilot‑line...

LG Electronics will unveil a next‑generation telematics module at MWC Barcelona 2026, merging a telematics control unit with a multi‑band antenna that handles 5G, GPS, V2X and satellite signals. The integrated design cuts signal loss, simplifies wiring and removes the...

Epirus and Digital Force Technologies have merged Epirus' Leonidas high‑power microwave weapon with DFT's Seraphim command‑and‑control software to create a unified detect‑to‑defeat counter‑UAS system. The integrated solution links autonomous detection, tracking and non‑kinetic microwave defeat, allowing a single burst to...
MSI has added the SPATIUM M571 DLP to its Gen5 SSD portfolio, featuring Phison’s 6 nm PS5028‑E28 controller and LPDDR4 DRAM cache. The drive ships in 1 TB, 2 TB and 4 TB capacities, delivering up to 14,500 MB/s sequential reads and 11,000 MB/s writes, with...
MSI announced two new B550 micro‑ATX motherboards for the AM4 socket, extending DDR4 support for Ryzen 5000 builds. The PRO B550M‑B retails at $78.96 and offers dual M.2 slots, while the B550M‑A PRO costs $67.66 with a single M.2 slot and a simplified...

Micro‑Magic has introduced the U5000, a tactical‑grade MEMS inertial measurement unit positioned to match the performance of Sensonor’s STIM320 series. The device delivers gyroscope bias stability of ≤0.1°/h, angle random walk of ≤0.1°/√h, and accelerometer bias under 30 µg, while operating...

Mustek warned that memory and storage shortages driven by rapid AI infrastructure expansion will persist until 2027, tightening component availability and pricing. The South African distributor said its integrated distribution model helps stabilise supply but margins remain pressured. Mustek also...

Ericsson announced at MWC 2026 that it will showcase live 6G demonstrations in partnership with Apple and MediaTek. The Apple demo will feature Multi‑RAT Spectrum Sharing (MRSS) to illustrate seamless 5G‑to‑6G coexistence, while MediaTek will present a 6G centimeter‑wave data‑call prototype...

AMD announced a multi‑year AI infrastructure partnership with Meta, delivering next‑generation Instinct GPUs, EPYC processors, and rack‑scale systems tailored for Meta’s data centers. The deal includes up to 6 GW of GPU capacity and a performance‑based warrant for up to 160 million...

OptiScaler’s test build 0.9.0‑pre10 adds FSR 4 support to Vulkan games by routing the upscaler through a DirectX 12 bridge, effectively bypassing AMD’s official limitation to RDNA 4 GPUs and DX12 titles. The community‑driven implementation works in titles such as Doom: The Dark...

Samsung’s product lineup now spans five categories Apple doesn’t offer: foldable smartphones, a smart ring, stylus‑enabled phones, AI‑powered refrigerators, and AI‑driven vacuum cleaners. The Galaxy Z Fold7, Z Flip7 and the three‑paneled Z TriFold illustrate Samsung’s early lead in foldable...
the most interesting part of this: "Our studio system is fully built around being first-party. We're not built to just be a publisher," Matt Booty explained. "It is core to our partnership with the Microsoft platform, being involved in early hardware...

Meta AI Research has open‑sourced GCM, a GPU Cluster Monitoring toolkit designed to catch silent hardware failures that can derail large‑scale AI training. The system integrates tightly with the Slurm workload manager, providing job‑level attribution of power, temperature, and error...
The AI accelerator/compute market is not a one-size-fits-all market. There will be a host of solutions and a variety of workloads. While Intel has yet to show an AI accelerator solution, this is a step in the right...

South Korea's KOSPI index surged past the 6,000 mark, closing at a record 6,085 on Wednesday. The rally was powered by a sharp rise in global memory demand, lifting Samsung Electronics 2.5% and SK Hynix 2.1%. The benchmark is now...
SkyWater Technology reported Q4 2024 revenue of $75.5 million with a 26.6% gross margin, beating guidance and delivering a positive EPS of $0.04. Full‑year revenue reached a record $342 million, up 19% year‑over‑year, driven by strong ATS growth and record...
Researchers have engineered ordered vacancies in boridene to create pronounced electrical anisotropy, enabling both bipolar and linear photocurrent suitable for optoelectronic computing. The material, (Mo₂/₃Y₁/₃)₂AlB₂, can be deposited at low temperatures and patterned across a full 12‑inch wafer, meeting back‑end‑of‑line...