Nvidia Says Its Forecast for $200 Billion CPU Market Includes China
Nvidia CEO Jensen Huang said the company’s new Vera central processors give it access to a $200 billion CPU market, and that this forecast includes China despite ongoing U.S.–China tech tensions. The forecast expands Nvidia’s growth narrative beyond GPUs, aligning with the rise of agentic AI that demands high‑performance CPUs. Huang also noted that while Nvidia holds U.S. licenses for its H200 AI chips, none have been shipped to Chinese customers yet. The comments came ahead of Computex, where Nvidia will deepen ties with Taiwan’s supply chain and TSMC.
Huawei Develops 122TB SSD with New Packaging Tech to Sidestep US Sanctions on 3D NAND Chips — Chinese Firm Develops...
Huawei unveiled the OceanDisk 1800 series, offering 61.44 TB, 122.88 TB and a future 245 TB SSD for AI inference and data‑center workloads. To sidestep U.S. export bans on advanced 3D NAND, the company adopted Die‑on‑Board (DoB) packaging, mounting YMTC’s 232‑layer NAND dies directly...
Intel Razor (RZL) and Titan (TTL) Lakes Discussion Threads
Intel’s forum chatter reveals speculative roadmaps for Razor Lake, Titan Lake, Serpent Lake and Hammer Lake, all projected for 2028‑2029. Razor Lake is rumored to host up to 16 performance cores and 32 efficiency cores with LPDDR6 memory, while Titan...
Intel Charges Ahead With New Process Nodes
Intel has moved its 18A (1.8 nm) process into full-volume production and is already advancing its 14A node, with a version 0.5 process design kit (PDK) released and a version 0.9 slated for October. CEO Lip‑Bu Tan announced a long‑term roadmap that includes...
US Weighs Chip Tariffs to Spur Domestic Growth, Trade Chief Says
U.S. Trade Representative Jamieson Greer said the United States is still weighing tariffs on imported semiconductors to spur domestic chip production, but no new duties will be imposed immediately. He made the remarks at the ceremony for Micron Technology’s expanded...
No ‘Immediate’ Tariffs on Semiconductors
U.S. Trade Representative Jamieson Greer announced that the United States will not impose new tariffs on semiconductors in the near term. Speaking at Micron’s Virginia plant, where the nation’s most advanced memory chip was unveiled, Greer stressed that timing and...
General Compute Launches the First ASIC-Native Neocloud
General Compute announced the general availability of General Compute Cloud, the first ASIC‑native neocloud designed for AI inference. The platform runs on the company’s SN40 and SN50 data‑flow silicon, delivering the fastest independently benchmarked speeds on the MiniMax M2.7 model...
Stressed Crystal Creates Nanoscale Patterns on Chip Materials at Room Temperature
Rice University researchers introduced a room‑temperature method that uses an anisotropic alpha‑molybdenum trioxide crystal to imprint nanoscale ripple patterns onto hard dielectrics such as silica, aluminum oxide and silicon nitride. The electron‑beam‑induced stress buckles the crystal layer while softening the...
Analyst Says Nvidia Poised to Capture Two-Thirds of the X86 Server CPU Market From Intel and AMD with Expected $20...
Analyst Dean McCarron predicts Nvidia will capture roughly two‑thirds of the $30 billion x86 server CPU market, generating about $20 billion in revenue. The company aims to ship 4 million Vera CPUs—priced near $5,000 each—by fiscal year 2027, leveraging its vertically integrated Rubin...
AI Is Starting to Out-Design Chip Engineers in Narrow Areas as LLMs Accelerate Software Chip Design Tool Development — "There...
AI-driven tools are beginning to outperform human engineers in narrowly defined chip‑design tasks. Google DeepMind’s AlphaChip has generated superhuman layouts for multiple TPU generations, while Synopsys’ DSO.ai reports three‑fold productivity gains and up to 25% power reductions for customers. Berkeley...
EC Approves €66m for German SiC Facility
The European Commission has approved a €288 million (≈$314 million) state‑aid package for two German semiconductor projects. €66 million (≈$72 million) will fund Zadient Materials Europe’s new plant in Bitterfeld to produce high‑purity silicon‑carbide (SiC) source material using a circular gas‑recovery process. The remaining...
Amkor Expands Arizona Packaging Plans as AMD Joins Advanced Packaging Customers
Amkor Technology announced the acquisition of an additional 67 acres adjacent to its existing 104‑acre campus in Arizona, paving the way for a new advanced‑packaging fab slated to begin production in 2028. The company confirmed a partnership with AMD to...
Imec Says AI Scaling Needs More Orchestration Across Research, Design, Manufacturing
At ITF World 2026, imec CEO Patrick Vandenameele likened AI scaling to a violin that needs an orchestra, stressing that research, design, and manufacturing must operate in concert. He urged deeper collaboration among foundries, fabless firms, EDA vendors, equipment suppliers,...
China Chipmaker CXMT Logs 1,688% Profit Surge Amid Global Memory Crunch
China’s ChangXin Memory Technologies (CXMT) posted a net profit of $3.6 billion for Q1, a 1,688% jump from a year earlier, while revenue surged 719% to $7.5 billion. The surge reflects soaring global DRAM prices driven by AI‑related demand. CXMT, now the...
ST Gate Drivers Ensure High Energy Efficiency in Battery-Operated Equipment
STMicroelectronics introduced the STDRIVE102 family of gate‑driver ICs for three‑phase brushless motors, adding SPI‑enabled STDRIVE102P and STDRIVE102BP variants. The devices operate from 6 V to 50 V, drive six external N‑channel MOSFETs, and feature an ultra‑low 50 nA standby current to maximize battery...
GlobalFoundries Launches Specialized Business Unit to Expand Onshore Quantum Hardware Manufacturing
GlobalFoundries has created a new division, Quantum Technology Solutions, to commercialize on‑shore quantum hardware manufacturing. The U.S. Department of Commerce will provide $375 million under the CHIPS and Science Act and take a roughly 1% equity stake in the company. The...
Meta, Broadcom and Others to Launch $125 Million Semiconductor Research Hub at UCLA
Meta, Broadcom, Applied Materials, GlobalFoundries and Synopsys are investing $125 million to launch a five‑year Semiconductor Hub at UCLA's Samueli School of Engineering. The center will support research across chip design, equipment, software and manufacturing, aiming to accelerate AI‑powered chip innovations....
US To Award $2 Billion To Quantum Companies, Take Equity Stakes
The U.S. Department of Commerce is set to award roughly $2 billion in grants to nine quantum‑computing firms, with the federal government taking equity stakes in each recipient. IBM will receive the largest portion—about $1 billion—and will pair it with an equal...
Nvidia’s Jensen Huang Wants to Be King of a Brand-New Empire
Nvidia, the world’s most valuable chipmaker, announced its entry into the central processing unit market with Vera, its first standalone AI‑focused CPU launched in March. CFO Colette Kress said the product opens a new $200 billion total addressable market, with early...
Intel Says 14A Is on Track for 2028 Risk Production, 10A and 7A Now in Development
Intel CEO Pat Gelsinger confirmed that development of the 10A and 7A process nodes is now under way, while the 14A node is on schedule for risk‑production in 2028 and volume shipments in 2029. The company’s latest consumer CPUs –...
Hanmi Semiconductor to Enter US Market with California Subsidiary
Hanmi Semiconductor announced the formation of a U.S. subsidiary, Hanmi USA, in San Jose, California, slated for launch by the end of 2026. The office will deliver on‑site technical support to AI‑focused fabs being built by Intel, Micron, SK hynix and others,...
NVIDIA Predicts $1 Trn in GPU Sales, Moves in on CPUs
NVIDIA projects its graphics processors will generate roughly $1 trillion in revenue between 2025 and 2027, driven by surging demand for generative and agentic AI. The company just reported a record $81.6 billion in Q1 fiscal 2027 revenue, with its nascent CPU...
New Semiconductor Building Blocks Make Power Converters Smaller, More Affordable
Oak Ridge National Laboratory (ORNL) has demonstrated a power converter built with gallium‑nitride (GaN) semiconductors supplied by ROHM. The GaN devices switch 10‑20 times faster than traditional silicon, delivering higher efficiency while shrinking the converter’s size and weight. The compact,...
Infineon Expands CoolGaN BDS Portfolio with Compact 40 V Bidirectional GaN Switches
Infineon Technologies has added two compact 40 V bidirectional GaN switches, the IGK048B041S and IGK120B041S, to its CoolGaN BDS family. The devices shrink PCB footprint by up to 82% and halve component count by integrating two MOSFET functions into a single...
Trump Approved an Nvidia Chip for Sale in China. Beijing Doesn’t Want It.
President Trump lifted a long‑standing export ban, allowing Nvidia to sell its high‑performance H200 AI chip to China. The move was touted as a win for Chinese artificial‑intelligence ambitions and a revenue boost for Nvidia, the world’s leading AI‑chip maker....
Scaling the Memory Wall: HBM, CXL, and the New GPU Playbook
The AI data‑center market is confronting a growing memory wall as inference workloads demand ultra‑low latency and massive KV‑cache capacity. High‑bandwidth memory (HBM) remains the primary bandwidth solution, but supply constraints and thermal costs are driving prices up, with the...
AMD EPYC Venice Enters Production on TSMC 2nm Process
AMD announced that its next‑generation EPYC “Venice” processor is now ramping production at TSMC’s 2 nm fab in Taiwan, with later production planned for TSMC’s Arizona plant. Venice is the first high‑performance server CPU built on the 2 nm node, targeting cloud,...
Nvidia Revenue Jumps 85% on AI Demand
Nvidia reported record first‑quarter fiscal 2027 revenue of $81.6 billion, an 85% year‑on‑year jump driven by soaring AI infrastructure demand. The data‑center segment generated a historic $75.2 billion, up 92%, while networking revenue exploded 199% to $14.8 billion. Edge‑computing sales rose 29% to...
AMD to Invest $10 Billion in Taiwan's AI Industry to Advance Top-End Chips
AMD announced a $10 billion investment in Taiwan's semiconductor and AI ecosystem, targeting advanced chip packaging and manufacturing. The program will partner with local firms such as ASE, SPIL, Sanmina, Wiwynn, Wistron and Inventec to accelerate development of its Helios AI...
Advancing Heterogeneous Integration Through Industry Roadmap Improvements
A multinational research team led by Intel published a perspective in Nature Reviews Electrical Engineering calling for a new generation of heterogeneous integration (HI) roadmaps. The paper argues that existing roadmaps lag behind rapid advances in AI, 5G/6G, and aerospace,...
Semidynamics and SiPearl to Develop EU-Sovereign Rack-Scale AI Compute Platform
Semidynamics and SiPearl announced a joint effort to build a European‑sovereign, rack‑scale AI compute platform that pairs SiPearl’s Arm‑based CPU with Semidynamics’ RISC‑V AI inference ASIC. The system will adhere to Open Compute Project standards, delivering high density, performance‑per‑watt and...
Fraunhofer IPMS Develops Wafer-Level Chiplet Systems
Researchers at Germany’s Fraunhofer Institute for Photonic Microsystems (IPMS) have unveiled a wafer‑level quasi‑monolithic integration (QMI) technique that embeds chiplets into structured silicon pockets and levels them for back‑end‑of‑line wiring. The method bridges the gap between traditional chip packaging and...
Infineon 40V CoolGaN BDS Family Shrinks Portable Power Designs
Infineon has added two GaN bidirectional switches, the IGK048B041S and IGK120B041S, to its 40 V CoolGaN BDS family. The devices shrink PCB footprints by up to 82 percent and halve the component count by merging two MOSFETs into a single package. Both...
Scaling the Next Generation of Multi-Die Systems
The EE Times virtual conference on June 23‑24 will examine how to scale next‑generation multi‑die chiplet systems for AI workloads. Sessions focus on accelerating design flows, advanced packaging, interconnect standards and the thermal, power and yield challenges that arise at production...
Data Center Revenue Soars 92% as NVIDIA Turns in Another Record-Breaking quarter...and the Share Price Falls
Nvidia reported a record $81.6 billion revenue for Q1 2027, driven by data‑center sales that jumped 92% year‑on‑year to $75.2 billion. Net income surged to $58.32 billion, yet the stock slipped as investors worried about sustaining the pace. CEO Jensen Huang highlighted the arrival...
Acer Veriton GN100 Packs NVIDIA Blackwell AI Compute Into Compact Workstation
Acer unveiled the Veriton GN100, a compact AI workstation built around NVIDIA’s DGX Spark platform and the GB10 Grace Blackwell Superchip. Despite measuring only 150 mm × 150 mm × 50.5 mm, the system delivers up to 1 petaFLOPS of AI performance, 128 GB of unified LPDDR5x memory, and a 4 TB...
Imec Unveils Quantum Dot Qubit Device Using High NA EUV Lithography
imec demonstrated a silicon quantum dot qubit array fabricated with High NA EUV lithography at ITF World. The device features 6‑nm gate gaps, enabling dense qubit integration compatible with 300 mm CMOS fabs. This marks the first integrated hardware using High...
AMD Ryzen AI Max 400 ‘Gorgon Halo’ Packs up to 192GB of Unified Memory — Refreshed APU Uses Zen 5...
AMD has refreshed its Ryzen AI Max line with the Gorgon Halo‑based Max 400 series, offering up to 192 GB of unified memory and Zen 5/ RDNA 3.5 cores. The top Max+ Pro 495 model clocks a 5.2 GHz boost, 16 CPU cores, and a 40‑CU Radeon 8065S iGPU. AMD positions...
AMD Launches New Ryzen Processors and Ryzen AI Halo Dev Platform
AMD unveiled the Ryzen AI Halo developer platform, now available for pre‑order at $3,999 and powered by the Ryzen AI Max+ 395 processor with up to 128 GB unified memory and 50 TOPS AI performance. The company also announced the upcoming Ryzen...
Cerebras Says Its Chips Run a Trillion-Parameter AI Model Nearly 7 Times Faster than GPU Clouds
Cerebras Systems announced that its wafer‑scale CS‑3 chip can run Moonshot AI’s trillion‑parameter Kimi K2.6 model at 981 tokens per second, 6.7× faster than the leading GPU‑based cloud provider and 23× faster than the median. In a 10,000‑token coding task, Cerebras...
Four-Tier Memory Hierarchy for LLM Reasoning (USC, UW)
Researchers at USC and UW introduced a semantics‑aware memory hierarchy that partitions LLM token caches across four storage tiers—HBM, DDR, compressed, and evicted. By scoring token importance with cumulative attention, low‑importance tokens are offloaded to CPU memory and prefetched without...
Memory Makers Brace for Hydrogen Fluoride Pricing Shock as Hormuz Blockade Impacts Supply Chain — Key Etching and Cleaning Material...
The war in Iran and the resulting Hormuz blockade have disrupted the supply chain for anhydrous hydrogen fluoride, a key etchant used in memory‑chip fabrication. Prices in China have surged 130 % over early‑2026 levels as sulfuric‑acid costs jump 27 % and...
CPU IP Processes Mixed Scalar and Vector Workloads
SiFive unveiled its Performance P570 Gen 3, a RISC‑V out‑of‑order superscalar processor IP that blends scalar and vector execution. The chip promises a sizable performance uplift over the earlier P550 Gen 1 and complies with the mandatory RVA23 profile, including Hypervisor and...
India Just Signed Its Most Consequential Chip Deal. The Hard Part Starts Now.
India and the Netherlands sealed a landmark MoU between Tata Electronics and ASML, committing the Dutch firm to supply EUV lithography tools and support for a new semiconductor fab in Dholera, Gujarat. The plant, built with a 50 % government stake...
Hoth Plans Rocket One Rebrand and AI Chip Pivot
Hoth Therapeutics announced it will rename itself Rocket One, Inc. and restructure to focus on artificial‑intelligence semiconductor and spintronic computing technologies, while keeping its biotech programs in a separate subsidiary. The company secured exclusive licenses from Virginia Commonwealth University for...
When Arm Meets RISC-V: SiPearl, Semidynamics to Co-Develop Sovereign AI Platform
SiPearl and Semidynamics announced a joint effort to build Europe’s first sovereign rack‑scale AI platform, pairing SiPearl’s Arm‑based Rhea2 CPUs with Semidynamics’ RISC‑V inference accelerators. The first‑generation system will rely on DDR memory for the CPUs and full CPU‑accelerator memory...
China Reportedly Blocks NVIDIA GeForce RTX 5090 D V2 Imports
Chinese customs have reportedly denied import permits for NVIDIA's GeForce RTX 5090 D v2, a GPU specifically engineered for the Chinese market. The block appears to originate from Chinese regulators rather than new U.S. export controls, catching NVIDIA off guard. Because the card...
Intel Nova Lake ES Chips Reportedly Double Multi-Core Performance
Intel has begun shipping engineering samples of its next‑generation Core Ultra 400 (code‑named Nova Lake) desktop processors to hardware partners for validation. The chips introduce a redesigned hybrid architecture with Coyote Cove performance cores and Arctic Wolf efficiency cores, and feature...
Quantum Diamond Microscopy – Solving the Inspection Gap in Advanced Packaging
Quantum diamond microscopy (QDM) is now being deployed in semiconductor failure‑analysis labs across the US, Europe and Asia, offering the first non‑destructive, direct measurement of electrical current inside fully assembled advanced packages. By imaging magnetic fields generated by current, QDM...
TSMC Lays Out ‘Three-Layer Cake’ Vision for AI Chips
Taiwan Semiconductor Manufacturing Company unveiled a "three‑layer cake" roadmap that fuses its 2nm N2 compute node, advanced 3D CoWoS packaging, and the Compact Universal Photonic Engine (COUPE) for high‑speed optical links. The strategy was announced at TSMC’s 2026 Technology Symposium...